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  • Eliminating Flux Residue in OPTO-Electronic Packages (.pdf)
    With the advent of opto-electronic hermetic packages, it has become necessary to significantly reduce, if not eliminate, foreign materials that can cause reliability problems on the optical components inside the package. One material that has been identified as a possible source for unwanted
  • Package Hermeticity and Gas Analysis
    processing or may be generated internally after seal from material outgassing or decomposition, a primary source is the ingress of moisture that occurs because of a non-hermetic package seal. Usually, to evaluate overall package integrity, both fine and gross leak tests are required to test the full
  • High performance, lightweight, hermetic AlSi packages for Military, Aerospace and Space applications (.pdf)
    Presented at the 2nd Advanced Technology Workshop on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications in Baltimore, MD.
  • Two Solutions to Static Problems in Semiconductor Die Bonder Operation (.pdf)
    to opposing leads on the hermetic package.
  • Advantages of using LCP based pre-molded leadframe packages for RF & MEMS applications
    can be developed to provide enhanced reliability for non hermetic class packages. Further Interplex will propose some new development. concepts that will extend the performance of these materials to meet the more stringent needs of the developing RF and power component markets for better performance
  • Case Study # 3 - DRO Housing
    hermeticity.Telecommunication and other microelectronic devices need to be protected by being sealed in a hermetic package. This housing is used in a microwave telecom application. It was originally developed by machining of a popular Fe 49% Ni alloy. The material is expensive to throw away chips, and is 'tough and gummy
  • Medical Device Link .
    devices. Providing a hermetic package for the electronics serves two purposes: it keeps body fluids away from the electronic parts, and it prevents potentially toxic substances in the electronic package from entering the body. Many electronic implantables contain batteries, which in turn contain
  • Low Outgassing Accelerometers and Cables for Thermal Vacuum and Vibration Test Environments
    accelerometers and cables prior to vibration testing. Accelerometer designs with hermetic. housings and connectors can have low outgassing qualities. For all non-metallic materials. outside of a hermetic package, such as cables with polymer strain relief that do not typically have. low outgassing qualities

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  • Implantable Neural Prostheses 2
    The techniques covered include biocompatibility and biostability, hermetic packaging , electrochemical techniques for neural stimulation applications, novel electrode materials and testing, thin-film flexible microelectrode arrays, in situ charac- terization of microelectrode arrays, chip-size thin-film device encapsulation, microchip-embedded capacitors and …
  • MEMS Materials and Processes Handbook
    He, C.J. Kim: On-chip hermetic packaging enabled by post-deposition electro- chemical etching of polysilicon.
  • Springer Handbook of Nanotechnology
    He, C.J. Kim: On-chip hermetic packaging en- abled by post-deposition electrochemical etching of polysilicon, Proc. 18th Int. Conf.
  • Springer Handbook of Nanotechnology
    He, C. J. Kim: On-Chip Hermetic Packaging En- abled by Post-Deposition Electrochemical Etching of Polysilicon, Proceedings of the 18th Inter- national Conference on Microelectromechanical Systems (IEEE, Piscataway NJ 2005) pp. 544–547 10.20 S. K. Ghandhi: VLSI Fabrication Principles – …
  • RF MEMS: Theory Design and Technology
    6.8 Conventional Hermetic Packaging of MEMS Switches, 171 .
  • Springer Handbook of Nanotechnology
    Fig. 36.7 DMD products in hermetic packages .
  • Microsystems and Nanotechnology
    Hermetic packaging is desirable in most cases because it provides a moisture free environment to avoid charge separation in capacitive devices, corrosion in metallization, or electrolytic conduction, in order to prolong the lifetime of the electronic circuitry.
  • Fundamentals of Microsystems Packaging > FUNDAMENTALS OF SEALING AND ENCAPSULATION
    Finally, the difference in hermetic vs. non- hermetic packaging , and how to achieve reliability without hermeticity, is indicated.