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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Microwave Packages Application
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! HIC Packages
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Fiber Optics Packages
- Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: The package is made of ceramic cavity internal brazing metal hot sink, external no wire packaging structure, synchronous matching with high reliable germanium window or sapphire window cover plate. Cover plate sealing can be selected as soft and hard brazing or glass melting sealing
- Materials: Ceramic
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Supplier: Allied Electronics, Inc.
Description: Photocell, Hermetically Packaged
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Description: At Qnnect, formerly Hermetic Solutions Group", we are fully dedicated to providing the highest quality environment for the welding and sealing of your high-reliability electronic packages and medical implant devices. We have an ISO Class 7 cleanroom equipped with state-of-the-art laser
- Additional Services: Testing / Inspection
- Industry: Electrical / Electronics, Medical
- Location: North America, United States Only, Northeast US Only
- Sealing Method Capabilities: Laser Welding
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Description: Qnnect, formerly Hermetic Solutions Group manufactures custom fiber optic and telecommunications packages for a variety of applications including: WADM modules Modulators Attenuators Pump lasers Switches Amplifiers This
- Materials: Aluminum, Tungsten, Other
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Description: With over 70 years of experience and extensive manufacturing capability, Qnnect, formerly Hermetic Solutions Group has the largest selection of open tooling, plus custom capabilities for any size package, including JEDEC outlines such as TO-18, TO-39, TO-8, TO-3, TO-37, TO-66 and more
- Materials: Aluminum, Stainless Steel, Other
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Description: Qnnect, formerly Hermetic Solutions Group manufactures both custom and standard drop-in microwave packages for multiple industries including defense and aerospace. These components are used in higher-end applications, such as satellite, missiles, and aircraft guidance; electronic
- Materials: Aluminum, Copper, Stainless Steel, Other
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Supplier: Palomar Technologies, Inc
Description: world. With today’s rapidly changing technology, time-to-market is one of the most important factors for product success. With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full
- Backend Processing: Wire Bonding, Flip Chip Technology, Hermetic Sealing, Bonding, Other
- Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
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Supplier: Light in Motion LLC
Description: Description: The BPW38 is silicon photodarlington mounted in narrow angle, TO-18 package. Features: Hermetically sealed package Narrow reception angle European "Pro Electron" registered
- Collector Current: 7.5 milliamps
- Dome Lens: Yes
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -65 to 125 C
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Supplier: Light in Motion LLC
Description: Description: The BPW36/37 are silicon phototransistors mounted in narrow angle TO-18 package. Features: Hermetically sealed package Narrow reception angle European "Pro Electron" registered
- Collector Current: 0.5000 milliamps
- Dome Lens: Yes
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -65 to 125 C
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Supplier: Light in Motion LLC
Description: four output options. The TTL/LSTTL compatible output can drive up to ten TTL loads over supply current from 4.5 to 16.0volts. The monolithic die packaged in a narrow angle, hermetically sealed, TO-18 metal can package. Features: High noise immunity. Direct TTL/LSTTL interface
- Output Type: Current Output
- Photosensor Type: PN Photodiode
- Supply Voltage: 18 volts
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Supplier: Isobaud, Inc.
Description: The IBS2249 consists of two pairs of a phototransistor optically coupled to an AlGaAs infrared-emitting diode in a leadless hermetic surface mount package
- Collector Emitter Breakdown Voltage: 0.3000 volts
- Isolation Voltage: -1500 to 1500 volts
- Mounting Option: Flat Pack
- Operating Temperature: -55 to 125 C
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Supplier: Isobaud, Inc.
Description: The IBS249 consists of a phototransistor optically coupled to an AlGaAs infrared-emitting diode in a leadless hermetic surface mount package
- Collector Emitter Breakdown Voltage: 0.3000 volts
- Isolation Voltage: -1500 to 1500 volts
- Mounting Option: Flat Pack
- Operating Temperature: -55 to 125 C
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Supplier: Skyworks Solutions, Inc.
Description: The OLH910 consists of a pair of LEDs that are optically coupled to a dielectrically isolated photovoltaic diode array, packaged in a hermetically-sealed, 8-pin dual in-line ceramic package. When the LED is energized, the infrared emission is detected by the photovoltaic array
- Isolation Voltage: 1500 volts
- Mounting Option: Surface Mount
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Supplier: Skyworks Solutions, Inc.
Description: in-line package (DIP) that provides 1000 VDC electrical isolation between the input and output. Features High reliability and rugged hermetic construction Couples AC and DC signals 1000 VDC electrical isolation Matched photodiodes
- Isolation Voltage: 1000 volts
- Mounting Option: Surface Mount
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Supplier: Light in Motion LLC
Description: Description: The L14F1/L14F2 are silicon photodarlingtons mounted in narrow angle, TO-18 package. Features: Hermetically sealed package Narrow reception angle
- Collector Current: 7.5 milliamps
- Dome Lens: Yes
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -65 to 125 C
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Supplier: Advanced Technical Ceramics Company
Description: AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years. Today, the company remains the leading US-owned non
- Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
- IC Package Type: BGA, MCM, LCCC, Other
- Location: North America, United States Only, Southern US Only
- Package Material: Ceramic, Other
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Supplier: Sensata Technologies
Description: The 18HM Hermetic AC Motor Protector delivers the benefit of locked rotor and overload protection in a robust hermetic package. Sensata Technologies has been the leading global supplier of motor protection for over 50 years.
- AC Voltage: Yes
- Rated Current: 60 amps
- Rated Voltage: 230 volts
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Supplier: Isobaud, Inc.
Description: The IBS049 consists of a phototransistor optically coupled to an AlGaAs infrared-emitting diode in a leadless hermetic surface mount package. Features Hermetic 4-pin LCC package 1000Vdc isolation voltage High CTR Small Outline package High
- Collector Emitter Breakdown Voltage: 60 volts
- Isolation Voltage: 1000 volts
- Mounting Option: Flat Pack
- Operating Temperature: -55 to 125 C
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Supplier: Isobaud, Inc.
Description: The IBS010 consists of a phototransistor optically coupled to an AlGaAs infrared-emitting diode in a leadless hermetic surface mount package. Features Hermetic 4-pin LCC package 1000Vdc isolation voltage High CTR Small package outline High
- Collector Emitter Breakdown Voltage: 60 volts
- Isolation Voltage: 1000 volts
- Mounting Option: Flat Pack
- Operating Temperature: -55 to 125 C
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Supplier: Skyworks Solutions, Inc.
Description: The OLF100 consists of a LED that is optically coupled to an N-P-N silicon phototransistor mounted in an 8-pin hermetic surface mount flat-pack package. The leads can be formed to provide compliant solder connections to the mounting substrate. Special electrical parametric selections
- Mounting Option: Surface Mount
- Optocoupler Output: Phototransistor
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Supplier: Skyworks Solutions, Inc.
Description: The OLS910 consists of a pair of LEDs that are optically coupled to a dielectrically isolated photovoltaic diode array, packaged in a small hermetic leadless chip carrier (LCC). When the LED is energized, the infrared emission is detected by the photovoltaic array and a DC output
- Isolation Voltage: 1500 volts
- Mounting Option: Surface Mount
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Supplier: Crane Aerospace & Electronics
Description: 1. The PEP-4S series of voltage variable Phase Shifters is offered in three popular IF center frequency ranges (30, 60 and 70 MHz) with other frequencies optional. 2. Each provides 0° to 360° phase shift and 10% bandwidth within the 10 to 400 MHz frequency range. The voltage controlled design has
- Control Voltage (for Analog Phase Shifters): 0.5000 to 30 volts
- Frequency Range: 10 to 400 MHz
- Input Power: 0.0 dBm
- Input VSWR: 1.6 :1
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Supplier: Silicon Designs, Inc.
Description: cold extremes for extended periods of time where environmental conditions require a hermetic package. ?The SDI Models 2240 and 2480 contain a single or three orthogonally mounted, proprietary SDI Model 1522 accelerometer LCC chips, making them even less sensitive to temperature changes
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Supplier: Broadcom Inc.
Description: compared with the traditional solutions such as current transformers and Hall-effect sensors. This device consists of a sigma-delta analog-to-digital converter optically coupled to a digital-to-analog converter in a hermetically sealed 8-Pin ceramic DIP package with gold plated leads.
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 125 C
- Optocoupler Input: AC, DC
- Rise Time: 3.4 µs
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Supplier: Materion Corporation
Description: stamped from base materials of Kovar, A42, Copper or Nickel that are then plated with Ni and/or Ni and Au. This type of preform is an excellent "heat spreader" within an electronic package. It’s available in size from 0.005” thick to 0.015” in length and width. Shapes include squares,
- Applications: Electronics / RF-Microwave
- Clad / Bimetal: Yes
- Metal / Alloy Types: Other / Miscellaneous Nonferrous (UNS M)
- Shape / Form: Semi-finished Shape / Mill Stock, Bar Stock, Squares / Square Bar
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Supplier: Crane Aerospace & Electronics
Description: 1. Dual I & Q networks are integrated devices that produce two pairs of quadrature-phased, equal amplitude signals when fed by two IF signals and an LO signal as shown in the schematic above. 2. Merrimac’s IDP-2S series combines two matched circuits in one package. Both lumped and
- Input Frequency Range: 20 to 500 MHz
- Package Type: Through Hole Technology (THT)
- Power Level: 14 dBm
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Supplier: Thermocold Costruzioni Srl
Description: Packaged air dynamic handling units with crossflow heat exchangers with centrifugal fans and hermetic scroll compressors. • Compressors scroll hermetic type. • Double suction centrifugal fans. • Air side heat exchanger with seamless copper tubes and plate type
- Application: Commercial, Residential
- System Type: Heat Energy Recovery
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks
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Supplier: Crane Aerospace & Electronics
Description: -directional couplers provides direct access to both coupled ports. 3. Merrimac couplers may be ordered with specific coupling values up to 30 dB and over selected frequency bands up to 18 GHz in microwave packages. 4. These units comply with the applicable portions of MIL-C-15370 and
- Average Power: 1 watts
- Coupler Type: Uni-Directional
- Coupling: 10 to 20 dB
- Directivity: 18 to 20 dB
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Supplier: Utmel Electronic Limited
Description: DIODE 47 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode
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Supplier: Sensata Technologies
Description: VDC. Sensata has over 100 different switch packages in single and multi-pole configurations with actuation styles such as leaf, lever, pushbutton, plunger, roller, and toggle. KLIXON® 4AT Series low temperature hermetic switches provide indication of position in many different
- Actuating Force: 28 oz
- Actuator Type: Pushbutton
- Maximum Current Rating: 3 amps
- Operating Temperature: -275 to 275 F
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Supplier: Sensata Technologies
Description: KLIXON® 6PS series stainless steel pressure switch is a snap-acting, all welded device with hermetically sealed switch contacts. All switch components that are exposed to the fluid stream or external environment are made from 300 series stainless steel or brass to ensure maximum corrosion
- Pressure Reading: Gauge
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Featured Products Top
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The IBH7000 consists of input LED optically coupled to two PIN photodiode detectors in a hermetic 8-pin DIP package. The input side photodiode allows an external feedback loop to ensure constant LED light output. A matched output photodiode drives an output circuit (read more)
Browse Optocouplers Datasheets for Isobaud, Inc. -
NORTHVALE, New Jersey, USA – New Yorker Electronics has released the new Vishay T24 Series SMD HI-TMP Wet Tantalum Capacitors with high operating temperatures to +200°C in the compact C case code. Featuring a glass-to-tantalum hermetic seal and a long life rated to 2 (read more)
Browse Tantalum Capacitors Datasheets for New Yorker Electronics Co., Inc. -
delivers 10mA of forward current, and a reverse recovery time of 100nS. Starting with VMI's standard glass-body, hermetically sealed diodes, these devices are over-molded in a rigid epoxy. The leads are then (read more)
Browse High Voltage Diodes Datasheets for Voltage Multipliers, Inc. -
Our ceramic filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages are most often used in commercial applications. The lower volume, custom designed hermetic packages find wide usages in military applications. Both styles are available in various mounting configurations. (read more)
Browse RF Filters and Microwave Filters Datasheets for Smiths Interconnect -
High volume and various mounting configurations Ceramic Filters are manufactured in two basic styles for both commercial and military applications. The high-volume, cost-effective units in open frame, non-hermetic packages (read more)
Browse RF Filters and Microwave Filters Datasheets for Smiths Interconnect -
resolution for very low g range measurements. The high resolution and low noise makes it ideal for applications in robotics, structural and seismic monitoring. The high quality hermetic package allows use in demanding environments (read more)
Browse Accelerometers Datasheets for Dytran by HBK -
HIGH REL & HIGH PERFORMANCE opto-electronic products in hybrid, hermetic and custom packages for Aerospace: radiation tolerant solutions for power management, motor controllers & actuation controllers. Near Earth Orbit Optocouplers – NEO (read more)
Browse Optocouplers Datasheets for Isobaud, Inc. -
Actuation Controllers. ISOBAUD offers hermetic and hybrid packages that are radiation tolerant. Medical ISOBAUD will support solutions for equipment that require high level of reliability and the ability to function in harsh environments. ISOBAUD has radiation tolerant (read more)
Browse Optocouplers Datasheets for Isobaud, Inc. -
-to-metal anode terminal seal. TDD series Hybrid Capacitor combine high capacitance and low ESR in a fully hermetic tantalum package for High reliability Defense and Aerospace applications where weight and volume are at a premium. Especially suited for high power pulse applications, with (read more)
Browse Capacitors Datasheets for Quantic Evans -
The Dytran 7583A series provides VC–MEMS triaxial measurements in a rugged hermetically sealed package. This high–performance triaxial variable capacitance (VC) accelerometer is offered in multiple (read more)
Browse Accelerometers Datasheets for Dytran by HBK
Conduct Research Top
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Rochester Electronics Qualifies Hermetic Packages for MC68040FE Microcontrollers
A valued Rochester customer required an ongoing supply of the MC68040FE processor to produce medical ventilators to be used in the fight against COVID-19.
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Package Hermeticity and Gas Analysis
processing or may be generated internally after seal from material outgassing or decomposition, a primary source is the ingress of moisture that occurs because of a non-hermetic package seal. Usually, to evaluate overall package integrity, both fine and gross leak tests are required to test the full
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How Getters Improve Reliability of Hermetically Sealed Electronic Packages
Electronic components may fail if they are exposed to corrosive agents or chemical attack by moisture or other reactive gases that may be present within an electronic package or enclosure. The reliability of sensitive electronic components can be improved by hermetically sealing them within
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Providing a Continuous Source of Supply for Critical Processors
Rochester Electronics worked with an OCM supplier partner to provide an assembly solution for their 240 lead CQFP hermetic package, which was no longer available in the market.
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HR1 Getter for Removal of Hydrogen from Hermetic Microelectronic Packaging
Outlines methodology for quantifying a getter's performance related to hydrogen (H2) absorption performance in uptake capacity and uptake rate, and provide a fundamental understanding on how to select a getter for keeping microelectronic packages free from an H2 outgassing induced failure mode.
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Two Solutions to Static Problems in Semiconductor Die Bonder Operation
to opposing leads on the hermetic package. Eventually, this hermetic package encases the entire die or chip. These leads are the link from the semiconductor die to the rest of the circuit when it is mounted on a circuit board or flex circuit substrate.
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Moisture-resistant sealing materials for downhole HPHT electrical feedthrough packages
Downhole logging tools and electrical circuits are packaged in a hermetically-sealed metal enclosure, which is either sealed and pressurized, or filled with fluid, to protect the circuits from downhole corrosive environment and humidity. The sealed tool enclosure uses an electrical feedthrough
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Hermetic Solutions DiaCool TM Materials offer Superior Thermal Management for the Next Generation of Higher Power Density
Electronic systems are rapidly evolving, where electronic circuits and components are being designed to handle greater amounts of power in smaller packages. The amount of power used or transmitted per unit mass, area or volume is often referred to as the "power density. "
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Implantable Neural Prostheses 2
The techniques covered include biocompatibility and biostability, hermetic packaging , electrochemical techniques for neural stimulation applications, novel electrode materials and testing, thin-film flexible microelectrode arrays, in situ charac- terization of microelectrode arrays, chip-size thin-film device encapsulation, microchip-embedded capacitors and …
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MEMS Materials and Processes Handbook
He, C.J. Kim: On-chip hermetic packaging enabled by post-deposition electro- chemical etching of polysilicon.
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Springer Handbook of Nanotechnology
He, C.J. Kim: On-chip hermetic packaging en- abled by post-deposition electrochemical etching of polysilicon, Proc. 18th Int. Conf.
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Springer Handbook of Nanotechnology
He, C. J. Kim: On-Chip Hermetic Packaging En- abled by Post-Deposition Electrochemical Etching of Polysilicon, Proceedings of the 18th Inter- national Conference on Microelectromechanical Systems (IEEE, Piscataway NJ 2005) pp. 544–547 10.20 S. K. Ghandhi: VLSI Fabrication Principles – …
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RF MEMS: Theory Design and Technology
… DC-Contact Series Switches, 161 Fabrication of Lateral DC-Contact Switches, 164 MEMS Release Procedures, 165 Substrate Transfer Process, 167 Fabrication, Substrate Transfer, and Packaging of the Omron DC-Contact Series Switch, 169 6.8 Conventional Hermetic Packaging of MEMS Switches, 171 …
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Springer Handbook of Nanotechnology
Fig. 36.7 DMD products in hermetic packages .
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Microsystems and Nanotechnology
Hermetic packaging is desirable in most cases because it provides a moisture free environment to avoid charge separation in capacitive devices, corrosion in metallization, or electrolytic conduction, in order to prolong the lifetime of the electronic circuitry.
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Fundamentals of Microsystems Packaging > FUNDAMENTALS OF SEALING AND ENCAPSULATION
Finally, the difference in hermetic vs. non- hermetic packaging , and how to achieve reliability without hermeticity, is indicated.