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  • Two Solutions to Static Problems in Semiconductor Die Bonder Operation
    to opposing leads on the hermetic package. Eventually, this hermetic package encases the entire die or chip. These leads are the link from the semiconductor die to the rest of the circuit when it is mounted on a circuit board or flex circuit substrate.
  • Case Study # 3 - DRO Housing
    hermeticity.Telecommunication and other microelectronic devices need to be protected by being sealed in a hermetic package. This housing is used in a microwave telecom application. It was originally developed by machining of a popular Fe 49% Ni alloy. The material is expensive to throw away chips, and is 'tough and gummy

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