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Supplier: Advanced Technical Ceramics Company
Description: A Ceramic pedestal may be used in the package design to allow for self-jigging of metal or ceramic Seal-Ring. Microwave Design Assistance AdTech Ceramics produces HTCC and AlN packages for microwave applications in the X through K band frequency ranges. Electromagnetic Simulation This process can
- IC Package Type: BGA, MCM, LCCC, Other
- Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
- Package Material: Ceramic, Other
- Location: North America, United States Only, Southern US Only
Supplier: Heilind Electronics, Inc.
Description: Features / Options Applications / Uses Hermetically sealed Fast response Low Capacitance UL reconized under UL 497B I.C. Circuits Telephone Circuits Signal Lines Electro-static charge elimination Protection against switching surges
- Construction: Glass
- Package Type: Through Hole Radial Leads
- Discharge Current: 1500 amps
- Operating Temperature: -85 to 257 F
Supplier: Light in Motion LLC
Description: Description: The OSA15X family are OPTOLOGICTM ICs which feature a Schmitt trigger at output which provides hysteresis for noise immunity anti pulse shaping. The basic building block of this IC consists of a photodiode, a lineas amplifier, voltage regulator, Schmitt trigger and four output options
- Photosensor Type: PN Photodiode
- Output Type: Current Output
- Supply Voltage: 18 volts
Thermal Compounds and Thermal Interface Materials - Thermally Conductive Epoxy -- EPO-TEK® H65-175MPSupplier: Epoxy Technology
Description: is suitable for automatic syringe dispensers, although it can be applied by screen printing or manual hand operations. Performs exceptionally well as a die-attach for small chips such as GaAs, LEDs and diodes, as well as SMDs. Capable of resisting 260°C green reflow process, low outgassing in hermetic
- Material Type: Die Bonding Adhesive / Compound, Grease / Paste
- Industry: Electronics, Semiconductors / IC Packaging, Military / Government (MIL-SPEC / GG)
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
Supplier: Epoxy Technology
Description: Product Description: EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. EPO-TEK® H72 Advantages & Application Notes:
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Filler Material: Unfilled
- Resins & Compounds: Liquid
Description: This standard solid state display have a 7.4 mm (0.29 inch) dot matrix character and an on-board IC with data memory latch/decoder and LED driver in a glass/ceramic package. The hermetic HDSP-0781 displays utilize a solder glass frit seal. This numeric device decode positive BCD logic
- Display Type: Dot Matrix Display
- Characters Displayed: Numeric
- Number of Rows: 1 #
- Number of Characters: 1 #
Supplier: RFM (RF Monolithics, Inc.)
Description: • Designed for 802.11 Applications • Hermetically sealed Surface Mount package • Complies with Directive 2002/95/EC (RoHS)
- Filter Category: Active Filter, SAW Filter
- Filter Type: Band Pass
- Applications: General
- Cutoff or Center Frequency (Fc): 3.74E8 Hz
Description: The DSCC SMD 5962-8947701PC is a high reliability Class H single channel hermetically sealed voltage/current threshold detection optocoupler in an 8-Pin ceramic DIP package with gold plated leads. Solder dipped leads and various lead form options are also available. See the datasheet for details
- Optocoupler Input: AC, DC
- Optocoupler Output: Other
- Rise Time: 1.67E-7 minutes
- Operating Temperature: -67 to 257 F
Description: The HCPL-6751 is a high reliability Class H four channel hermetically sealed optocoupler in a 16-Pin ceramic flat pack with gold plated leads. The product is capable of operation and storage over the full military temperature range and may also be purchased as either commercial grade, with full
- Optocoupler Input: DC
- Optocoupler Output: Photodiode
- Isolation Voltage: 1500 volts
- Collector Emitter Breakdown Voltage: 5 volts
Supplier: NEC / Schott
Description: The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. In contrast to, for instance TO packages, these packages can be used to package not only a single component, but also several
- Product Type: Package Adapters / Converters
- Mounting: SMT, Through-hole
Supplier: Micropac Industries, Inc.
Description: regulator; i.e., full thermal overload and short circuit protection. It is packaged in a hermetically sealed 4-pin, TO-3 package providing 50W power dissipation. The regulator consists of a monolithic chip driving a discrete series-pass element and short circuit detection transistors.
- Regulator Category: Linear Regulator
- Output Voltage Type: Adjustable
- Regulated Output Voltage (Volt): -35 to -7 volts
- Output Current (IOUT): 5 amps
Supplier: Amphenol Aerospace Corporation
Description: of frequency or origin, transient caused failures generated by load switching, lightning, electrostatic discharge (ESD) and electromagnetic pulse (EMP) can destroy unpro tected IC components. Compatible with present flter connector assembly procedures, MOVs can be combined with existing flters
- Applications / Categories: Military Connectors, Other
- Gender: Male / Plug, Female / Jack
- Terminal Options: Crimp, PCB Solder / Solder Pin, Solder Cup, Wire Wrap, Other
- Mounting Style: PC Mount, Jam Nut Receptacle, Wall or Box Mount Receptacle
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Skyworks Solutions, Inc.
Hermetic GaAs IC DC-6 GHz SPST Switch
Through its Isolink subsidiary, Skyworks introduces a low-loss, high performance wideband DC to 6 GHz hermetic GaAs IC single-pole, single-throw (SPST) non-reflective switch. The ISO13316 is ideal for high reliability space, satellite, and defense applications. The device performs with 45 dB isolation at 2 GHz and low loss of 1.1 dB at 6 GHz. Testing is available to the screening requirements of MIL-PRF-38535 Class B and S, in addition to the required quality conformance inspection (QCI... (read more)
Browse RF Switches Datasheets for Skyworks Solutions, Inc.
Skyworks Solutions, Inc.
Hermetic GaAs IC DC to 8 GHz SPDT Switch
Through its Isolink subsidiary, Skyworks introduces a low-loss, high performance wideband DC to 8 GHz hermetic GaAs IC single-pole, double-throw (SPDT) absorptive switch. The ISO13286 is ideal for high reliability space, satellite, and defense applications. The device performs with 50 dB isolation at 4 GHz and low loss of 1.5 dB at 4 GHz. Testing is available to the screening requirements of MIL-PRF-38535 Class B and S, in addition to the required quality conformance inspection (QCI... (read more)
Browse RF Switches Datasheets for Skyworks Solutions, Inc.
Custom Hermetic Microwave Packaging
PA &E custom manufactures hermetic electronic packaging for space, airborne, and other applications that need to operate reliably in the harshest environments. We can bring your design to life in titanium, aluminum, stainless steel or Kovar. We can provide turn-key packaging solutions -- complete with RF/microwave connectors, ceramic-sealed DC connectors and sight/waveguide windows all integrated via laser welding. Our unique materials and manufacturing processes can provide innovative... (read more)
Browse Electronic and IC Packaging Services Datasheets for PA&E
Light in Motion LLC
Convex Lens Package Hermetic Silicon Photosensor
The basic building block of this IC consists of a photodiode, a lineas amplifier, voltage regulator, Schmitt trigger and four output options. The TTL/LSTTL compatible output can drive up to ten TTL loads over supply current from 4.5 to 16.0volts. The monolithic die packaged in a norrow angle, hermetically sealed, TO-18 metal can package. Features: High noise immunity. Direct TTL/LSTTL interface. Hermetically sealed package. Reception angle of +/- 12 Deg. (read more)
Browse Photosensor Modules Datasheets for Light in Motion LLC
More Information Top
Horton, R. M., T-AES 76 May 431 (2C07)reliability of hermetically sealed IC .
Environmental testing and component reliability observations of telecommunications equipment operated in tropical climatic conditions
An earlier exception to this was in the deliberate comparison between a range of plastic and hermetically sealed ICs assessed to a range of THB and high temperature with bias (HTB) tests, in which the hermetically packaged ICs came bottom of the …
Fundamentals of Space Systems
Systems builders such as AT&T, Honeywell, and General Dynamics found that the performance, reliability, average failure rate, and failure modes of systems employing PEMs were better than or equal to those constructed with hermetically sealed ICs .
A product feasibility study of assembling Pb-free BGAs in a eutectic Sn/Pb process
Will other non- hermetically sealed IC ’s designed for a Sn/Pb assembly process be driven to a temperature beyond their rated moisture sensitivity level?
Behavior of radiation-induced defects in bipolar oxides during irradiation and annealing in hydrogen-rich and -depleted ambients
For hermetically sealed ICs used in radiation environments, such as those in satellites and other space-based systems, the presence of high concentrations of H2 in the package can further enhance radiation-induced degradation and greatly reduce their operation reliability .
Study on Leak Rate Formula and Criterion for Helium Mass Spectrometer Fine Leak Test
Among the ICs on which internal gas analysis are carried out in the Fourth Institute of Electronics of China, six are hermetically sealed ICs from five foreign companies ( including four US semiconductor companies), and their charged gases are the dry air; some …
High-speed GaAs SCFL monolithic integrated decision circuit for Gbit/s optical repeaters
Thus we developed the high-speed her- metically sealed IC package with 1 mm-long signal lead.
Moisture Determination in IC Packages by Conductance Technique
Moisture in hermetically sealed IC packages and hybrid packages is a known reliability hazard .
Reliability of electronic devices containing epoxy resins
Thus even Sinnad~rai'~'), in a comparison that showed the greater reliability of plastic encapsulated over hermetically sealed IC op-amps, conducted only 150% high temperature environment.
High performance, low-cost chip-on-board (COB) FDDI transmitter and receiver for avionics applications
Encouraging reliability results in hot, humid environments have been obtained by applying organic and inorganic moisture barrier coatings on non- hermetically sealed IC and optoelectronic devices [18-23].