• Supplier: Inspec Inc.

    Description: Key featuresd High resolution & accuracy laser stripe scannerd Cutting edge compact & lightweight designd Fully compatible with Renishaw PH10d Automated qualification of the PH10 orientationsd Compatibility with ACR-3 auto-exchange rack for easy tool exchanged Easy macro based path

    • Technology: Non-contact - Optical / Laser
    • Surface Metrology: 3D / Areal Topography
    • Mounting / Loading: Machine Mounted

  • Description: The new MarSurf® UD 120 from Mahr Federal can generate both surface and contour measurements in a single pass. Designed for economy, the system provides high accuracy over a large measuring range in nanometer resolutions. The MarSurf UD 120 includes both automated motorized operation and joystick

    • Technology: Non-contact - Optical / Laser
    • Standards Compliance: ISO / EN
    • Mounting / Loading: Benchtop
    • Display & Special Features: Computer Interface / Networkable, SPC / Software Capability

  • Description: environments and under varying temperature conditions. Features: Latest CCD Technology Visible Laser spot for easy setup Interchangeable laser heads without the need to recalibrate Direct Ethernet Connection and Control Cost Effective No External Controller Needed High Accuracy

    • Technology: Non-contact - Optical / Laser
    • Surface Metrology: 2D / Line Profile, 3D / Areal Topography
    • Measurement Capability: Spacing Parameters (PC, Sm), Waviness Parameters (Wa,Wt ), Defects / ADC, Flatness, Lay / Pattern, Step Height, Thickness, Warp / Bow, Specialty / Custom
    • Common Specific Parameters: Maximum Peak Height (RP), Maximum Valley Depth (RV), Profile Depth (Pt)

  • Supplier: Starrett

    Description: For visually checking the flatness of seals, gages and mating surfaces. Through means of interpreting light interference patterns or bands, the optical flat provides a simple, accurate precision method for measuring surface flatness. Flats are crafted from high quality fused quartz and provide

    • Technology: Contact / Stylus Based
    • Form Parameters: Flatness
    • Industrial Applications: Mechanical Parts (Bearings, Shafting)
    • Mounting / Loading: Handheld / Portable

  • Description: The ContourGT-X8 provides the highest speed, accuracy, and range for 3D, non-contact surface measurement of ophthalmic lenses, medical devices and tools, high-brightness LEDs, semiconductor devices, through-silicon vias and trenches, solar cells, and precision machined parts. The gauge-capable

    • Surface Metrology: Surface Profilometry
    • Measurement Capability: 3D / Areal Topography, Step Height
    • Technology: Non-contact - Optical / Laser
    • Industrial Applications: Medical, Optics / Photonics, Precision Machining / Grinding, Semiconductor Manufacturing, Other

  • Description: Production-based 3D reference metrology for 45 nm and below For unparalleled accuracy and precision – the kind needed for non-destructive, high-resolution 3D measurements of critical 45nm and 32nm semiconductor features -- the InSight™ 3D Atomic Force Microscope (AFM) is the clear

    • Form Factor: Monitor / Instrument
    • Mounting / Loading: Floor Mounted / Stand-alone
    • Applications: Semiconductor Wafers
    • Measurement Capability: Critical Dimension / Trench Geometry, Roughness / Waviness

  • Description: The SpectraCD-XTR optical CD/profile metrology system delivers improved precision accuracy, and tool-to-tool matching at the highest throughput and lowest cost-of-ownership (CoO) available. Evolved from the industry-leading, fourth-generation SpectraCD-XT system, the SpectraCD-XTR optical CD

    • Form Factor: Wafer Probing System
    • Mounting / Loading: Floor Mounted / Stand-alone
    • Applications: Semiconductor Wafers
    • Measurement Capability: Critical Dimension / Trench Geometry, Roughness / Waviness

  • Description: accuracy of less than 0.1 degrees • Fully automatic Critical Angle Measurement acquisition and analysis software High Throughput Inline Automation • Allowable sample size: 200/300mm wafers • Automatic data acquisition and analysis of critical angles, roughness and trench measurements

    • Form Factor: Monitor / Instrument
    • Mounting / Loading: Floor Mounted / Stand-alone
    • Applications: Semiconductor Wafers
    • Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness

Page: 1

Conduct Research Top

  • Inspecting Hard-to-Reach Surfaces (.pdf)
    Surfaces. with a Fiber-based Profilometer. Keywords: low coherence interferometry, white light. Fiber-based Profilometers vs. interferometry, fiber-based profilometry, hard-to-reach. Microscope-type Profilometers. surfaces, high-aspect ratio imaging, 3D industrial. inspection, mapping internal surface

Engineering Web Search: High Accuracy Profilometer Top

It takes just 30 seconds to join.
For full access to this free information, please register now.
Please take
30 seconds to
CLICK HERE to Register
Already registered
with GlobalSpec?
CLICK HERE to Sign In
Members Log-in
 
Your E-mail Address:

Password:
Step 1 of 3Free Registration
 
Required Fields
Required Field
First Name:
Required Fields
Last Name:
Required Fields
E-mail Address:
Required Fields
 
(This will be your login id.)
Password:
Required Fields
Retype Password:
Required Fields
Company Location:
 
Country:
Required Fields
Zip/Postal:
Required Fields
[ You are only seconds away from the Web's largest industrial catalog database ]
   
Step 2 of 3Free Registration

Company:
Required Fields
Address:
Required Fields
 
 
City:
Required Fields
State/Province:
Required Fields
Only required for US and Canada.
State (Other):
 
For addresses outside US or Canada.
Zip/Postal:
Required Fields
Country:
Required Fields

 
privacy policy
Step 3 of 3Free Registration

Job Function:
Required Fields
Industry:
Required Fields
Your Phone:
 
(Optional)

Select Your Free Newsletters
 
Product-specific e-Newsletters
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 


 
privacy policy