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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21LP-IND is a two component, high strength epoxy adhesive for high performance general purpose bonding and sealing formulated to feature long pot life (2-4 hours) at room temperature and cure well at moderately elevated temperatures e.g. 148°F (60°C) or more
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Porous Surfaces, Wood / Wood Product, Other
- Dissimilar Substrates: Yes
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Filled / Reinforced: Yes
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Supplier: OMEGA Engineering, Inc.
Description: Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS 1. Type of Application Potting
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Cure Type / Technology: Air Setting / Film Drying, Single Component System, Two Component System
- Features: Thermal / Heat Conductive, Electrically Insulating / Dielectric, Encapsulating / Potting
- Coating Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP35 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP35 produces high strength bonds whose
- Compound Type: Electrically Conductive
- Material Form: Die Bonding Adhesive / Compound, Grease / Paste, Gap Filling Compound, Specialty / Other
- Cure Type / Technology: Two Component System, Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
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Supplier: Quist Electronics
Description: Withstands high voltages, high dielectric strength, very durable
- Form: Film / Sheet
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Contact / Pressure Sensitive (PSA)
- Industry: Semiconductors / IC Packaging, Electronics
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Supplier: Quist Electronics
Description: Ideal for applications with high standoff and flatness tolerances
- Compound Type: Thermally Conductive
- Material Form: Gap Filling Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Optoelectronics / Photonics
- Industry Applications: Automotive, OEM / Industrial, Other
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Supplier: Ellsworth Adhesives
Description: Sold as a pack (100/pk). FUSION 508 is an extremely high viscosity, medium fixturing, single component, industrial quality instant adhesive. 20 gram tube.
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Industry: Other
- Chemical / Polymer System Type: Cyanoacrylate
- Cure Type / Technology: Air Setting / Film Drying, Single Component System
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Supplier: Master Bond, Inc.
Description: excellent adhesion to both metallic and nonmetallic substrates, from bonderized steel to Mylar polyester film. Impact strengths are high - Gardner impact measurements exceed 320 inch #. Properties of typical UV15LV coatings are summarized in table #1. Storage stability of Master Bond UV15LV is 6
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging, Building / Construction, Other
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Sauereisen, Inc.
Description: Sauereisen Electric Heater Cement No. 6 is a versatile high-temperature cement used for refractory coatings, lining furnaces, embedding electric heating elements, coating resistors, molding and insulating. No. 6 is supplied in Powder form and needs only be mixed with water to apply.
- Material Type: Conformal / Encapsulating Coating, Die Bonding Adhesive / Compound
- Industry: Electronics, Electrical Power / HV
- Features: Electrical Insulation / Dielectric
- Composition: Unfilled
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Supplier: Hi-Tech Seals, Inc.
Description: . The adhesive base reacts upon contact with the Activator layer to initiate the curing mechanism. The key word is layer – Activator is applied as a thin film or layer to one or both surfaces to be bonded. Adhesive base resin is applied to one surface and parts mated to start the cure reaction
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Master Bond, Inc.
Description: Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Rubber Based / Elastomeric: Yes
- Composition: Unfilled, Filled
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Recent Advances in High Voltage, High Energy Capacitor Technology (.pdf)
capacitors operating at about 5 kV, the packing. factor can be as high as 70-80%. In microsecond. Pulse power capacitors are generally high voltage, fast-. discharge capacitors the packing factor can be less than. discharge devices designed to have low inductance and. 50%. The relative permittivity
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The Effect of Voltage Reversal on Capacitor Life
are typically 4-12 um-thick aluminum foils. The dielectric layers are typically 5-20 um-thick Kraft. In the last fifteen years, self-healing high voltage cellulose paper, polypropylene, or polyester film. capacitors have become standard technology for single-. Termination of the foil electrodes
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Novel Passivation Ledge Monitor in an InGaP HBT Process
the InGaP ledge thickness by using a value of. 11.75 for the InGaP relative permittivity. Figure 4 shows. that the average ledge thickness for this sample is 340 A,. while Figure 5 shows the average ledge thickness. distribution across the wafers. The results across multiple. lots show consistently
Engineering Web Search: High Relative Permittivity Film Top
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Capacitor - Wikipedia, the free encyclopedia
of Pomerania in Germany found that charge could be stored by connecting a high-voltage electrostatic generator by a wire to a volume of water in a
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Dielectric strength - Wikipedia, the free encyclopedia
If the applied electric field is sufficiently high, free electrons from background radiation may become accelerated to velocities that can liberate
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ASTM D2305 - 10 Standard Test Methods for Polymeric Films Used...
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Power Frequencies D150 Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation D257 Test
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Broadband Permittivity Measurements of High Dielectric Constant Films
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High dielectric permittivity of polyethylene oxide in humid atmospheres
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induced deformation are considered for many potential applications where high actuation strain and energy are required.
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Fabrication and characterization of ferro- and piezoelectric...
capacitors and AlN bulk acoustic wave resonators, allows for high-quality ceramic film growth on suitable substrate and seed layers and, most
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