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High Relative Permittivity Glass
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Glass materials have a random, liquid-like (non-crystalline) molecular structure. They are excellent thermal insulators and electrical insulators, and have high dielectric strength. At ordinary temperatures, glass materials are relatively strong, inert, biologically inactive, and corrosion resistant.
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Supplier: SCHOTT North America, Inc. - DefenseDescription: BOROFLOAT® 33 borosilicate glass is SCHOTT's globally recognized name for high-quality, multi-functional float glass. This unique specialty float glass is manufactured by SCHOTT Technical Glass Solutions GmbH using the Microfloat process and the latest technology. Its wide range
- Glass Type: Borosilicate
- Shape / Form: Plate, Wafer / Substrate
- Applications: Ballistic / Bullet Protection, Chemical / Materials Processing, Optics / Optical Grade, Specialty / Other
- Performance Features: Machinable
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Supplier: Aremco Products, Inc.Description: Aremco offers a broad range of machinable and fully-dense ceramic materials for applications in which high temperature insulation, thermal shock resistance and high dielectric strength are required. Aremcolox™ and Super-Heat ceramics include compositions based on alumina, alumino-silicates
- Glass Type: Glass Ceramic
- Shape / Form: Plate, Rod Stock
- Applications: Chemical / Materials Processing, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperature Materials
- Performance Features: Machinable
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Supplier: Aremco Products, Inc.Description: Glass fiber- and kevlar-reinforced, epoxy-novolac, high strength
- Compound Type: Electrical Insulation / Dielectric
- Form / Function: Encapsulant / Potting Compound, Gap Filling Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: OEM / Industrial
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Supplier: Quist ElectronicsDescription: High performance, high reliability conductive insulator
- Compound Type: Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Cure Type / Technology: Thermosetting / Crosslinking, Contact / Pressure Sensitive (PSA)
- Features: Electrically Conductive, Electrical Insulation / Dielectric Material, Filled, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening
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Supplier: Quist ElectronicsDescription: Withstands high voltages, high dielectric strength, very durable
- Chemical / Polymer System Type: Specialty / Other
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Industry / Applications: Electronics, OEM / Industrial
- Features: Flame Retardant (e.g. UL 94 Rated), UL Approved
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Supplier: DuPont Performance PolymersDescription: Zytel HTN51G35HSL NC010 is a 35% glass reinforced, heat stabilized, lubricated high performance polyamide resin. It is also a PPA resin.
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Polymer / Chemical Type: Polyimide (PI, BMI)
- Filler Material: Glass Filler
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Supplier: Quist ElectronicsDescription: Ideal for applications with uneven topologies and high stackup tolerances
- Material Type: Gap Filling Compound
- Industry: Electronics, Optoelectronics / Photonics, OEM / Industrial, Other
- Features: Electrical Insulation / Dielectric, Flame Retardant (e.g. UL 94 Rated), UL Approved
- Chemical / Polymer System Type: Specialty / Other
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Supplier: Ellsworth AdhesivesDescription: Resinlab™ EP1026HV Black is a two part unfilled high viscosity epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics.
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Industry: OEM / Industrial
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Supplier: Victrex plc.Description: High performance thermoplastic material, 30% glass fibre reinforced PolyEtherKetoneEtherKetoneKetone (PEKEKK), semi crystalline, granules for injection moulding, standard flow, colour natural/beige. Typical Application Areas: Applications for higher strength and stiffness at elevated
- Material Form: Extrusion Grade Resin, Molding Resin
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Industry Applications: Aerospace, Automotive, OEM / Industrial
- Filler Material: Glass Filler
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Polyurethane Adhesives and Sealants - Flame retardant thermally conductive polyurethane -- 50-2185FRSupplier: Epoxies Etc...Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties. 50-2185FR meets
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Electrical Insulation / Dielectric Material, Flame Retardant (e.g. UL 94 Rated)
- Industry: OEM / Industrial
Conduct Research Top
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Introduction to Capacitive Sensing
: SIMPLE RC CIRCUIT TABLE 1: GLOSSARY OF TERMS Acronym Description ROSC ? Permittivity of Free Space o C s ? Relative Dielectric Constant r d Distance Between Capacitor Plates. AN1101, Introduction to Capacitive Sensing AN1101. Introduction to Capacitive Sensing. A SHORT HISTORY. Author: Tom
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Capacitives with Perspective
are obtained by grounding the conductive object. ·. Convergence with non-conductive objects: If a non conductive object is brought. into the field of the sensor - dependent upon the relative permittivity [dielectric number]. () - the field of the material to be included is strengthened
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Medical Liquid-Level Applications with Enhanced Capacitive Sensor Technology (.pdf)
also has certain relevance in the sensor selection process. Medical applications involve. mostly water-based reagents, process fluids, and various bodily fluids. Fortunately, high conductivity levels and. therefore high relative dielectric constants are common characteristics among all these liquids
Engineering Web Search: High Relative Permittivity Glass Top
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Dielectric - Wikipedia, the free encyclopedia
The susceptibility of a medium is related to its relative permittivity by
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EEStor - Wikipedia, the free encyclopedia
EEStor reports a large relative permittivity (19818) at an unusually high electric field strength of 350 MV/m, giving 10,000 J/cm³ in the dielectric.
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ASTM D1531 - 06 Standard Test Methods for Relative...
ASTM D1531 - 06 Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures
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Gigahertz Channel Design
εο = permittivity of free space εr = relative permittivity of the dielectric used
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Glass-ceramic on metal substrates for high performance...
of a lithium aluminosilicate type glass-ceramic on copper/Invar/copper and of a magnesium aluminosilicate type glass-ceramic on molybdenum and on
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Analysis of high gain multiband C-shaped and coupled C-shaped...
Keywords: high gain patch antennas multiband antennas coupled C-shaped microstrip patch antennas full wave analysis feed location glass-epoxy
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NEWTON, Ask a Scientist at Argonne National Labs
What is the significance of permittivity of free space? Relative motion and the twin paradox Is time travel possible?
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Elongated gold nanostructures in silica for metamaterials:...
We established several arrangements on silica glass substrate and show transmission measurements on fields of single nanowires.
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Complex RF Switching Architectures -- Part I - Developer Zone...
of a signal is: where co equals the speed of light (299,792,458 m/s) and ?r is the relative permittivity of the medium the signal travels through.
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Xilinx UG112 Device Package User Guide
To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements.
