Products & Services
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Supplier: ULVAC Technologies, Inc.
Description: High resolution, high speed sampling, long life span
- Form Factor: Monitor / Instrument
- Applications: Semiconductor Wafers, CVD / PVD Films
- Measurement Capability: Thickness - Film / Layer
- Non-contact: Yes
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Supplier: KLA-Tencor Corporation
Description: The HRP-250 is an automated, advanced surface topography metrology tool, featuring high resolution/high-aspect ratio, stylus-based surface profiling for leading edge 200mm applications. This surface topography metrology tool's ultra-fine 20nm stylus tip option enables down to 45nm-generation
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Roughness / Waviness
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Supplier: Park Systems, Inc.
Description: Resolution Access to Undercut and Sidewall • Two independent, closed-loop XY and Z flexure scanners for sample and tip • Z-scanner is tilted sideways from -40 to +40 degrees • Use of normal high aspect ratio tips for high resolution imaging • XY scan of up to 100 μm x 100 μm
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
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Supplier: Hitachi High Technologies America, Inc.
Description: The HITACHI NB5000 FIB-SEM integrates a superior 40kV Ga ion FIB column with an ultra-high-resolution Schottky FE-SEM. The HITACHI NB5000 FIB-SEM integrates a superior 40kV Ga ion FIB column with an ultra-high-resolution Schottky FE-SEM. Like all our products, all components have been designed
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, CVD / PVD Films
- Measurement Capability: Critical Dimension / Trench Geometry, Shape / Flatness, Thickness - Film / Layer
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Supplier: NDC Infrared Engineering USA
Description: with sturdy, reliable hardware, to form the core of a scanning system that delivers high resolution measurements, day after day. All NDC scanners are designed for easy maintenance and features like easily separable sensor heads for gauge maintenance make NDC scanners the first choice
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Supplier: Filmetrics, Inc.
Description: High-Resolution Film Thickness Maps The Filmetrics F42 can map the thickness of films, such as OSP, at over one-million points, each with a spot size as small as 3 microns. Using an integrated CCD camera, live video makes it easy to pinpoint exact measurement locations. Once the feature
- Form Factor: Monitor / Instrument
- Applications: Semiconductor Wafers, CVD / PVD Films
- Measurement Capability: Optical Constants (n, k)
- Area Mapping: Yes
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Supplier: Piezosystem Jena, Inc.
Description: accuracy without parasitic motion and improves the settling time in an active manner. The stages can be equipped with a high resolution feedback system for closed loop control. Fields of application include high resolution metrology, x and xy scanning, and dynamic positioning. The stages
- Configuration: X-Y Open Frame
- Orientation: Horizontal
- Drive Mechanism: None / Direct Drive
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Supplier: Piezosystem Jena, Inc.
Description: without parasitic motion and improves the settling time in an active manner. The stages can be equipped with a high resolution feedback system for closed loop control. Fields of application include high resolution metrology, x and xy scanning, and dynamic positioning. The stages are available
- Configuration: X Axis Only
- Orientation: Horizontal
- Drive Mechanism: None / Direct Drive
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Supplier: MicroSense, LLC
Description: of the magnetic properties of entire wafers up to 300 mm. The system is available in a manual loading or fully-automated configuration for use in R&D and/or production. Using the proprietary direct field control technique of MicroSense magnetic metrology tools, the Polar Kerr for MRAM system offers high
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Magnetic Properties (Coercivity / Shift)
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Supplier: Xenemetrix Ltd.
Description: X-Calibur SDD Bench Top EDXRF Spectrometer versatile, high energy resolution Our X-Calibur SDD EDXRF spectrometer features similar configuration like X-Calibur but with Silicon Drift Detector. Thanks to SDD high count rates the instrument improves its response time thus minimizing down time
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone, Manual Loading
- Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films
- Measurement Capability: Composition
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Supplier: MTI Instruments Inc.
Description: : Menu-driven for Fast, Easy Setup. Proprietary Push-PullTM Probe Technology. High-resolution LCD Display. On-board Microprocessor for Accurate, Repeatable Measurements. Bubble Level. Adjustable Stage for Precise Leveling. Teflon Wafer Stage for Easy, Non-abrasive Positioning.
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Mounting / Loading: Manual Loading
- Applications: Semiconductor Wafers
- Measurement Capability: Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
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Supplier: Mahr Federal Inc.
Description: The new MarSurf® UD 120 from Mahr Federal can generate both surface and contour measurements in a single pass. Designed for economy, the system provides high accuracy over a large measuring range in nanometer resolutions. The MarSurf UD 120 includes both automated motorized operation and joystick
- Technology: Non-contact - Optical / Laser
- Standards Compliance: ISO / EN
- Mounting / Loading: Benchtop
- Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
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Supplier: Polytec, Inc.
Description: Polytec's TopMap Metro.Lab is an affordable, high-precision, non-contact topography measurement system designed to characterize flat and curved surfaces. Incorporating a scanning white light interferometer, the Metro.Lab can measure flatness and general topography with 20 nanometer resolution
- Measurement Capability: 3D / Areal Topography, Flatness, Parallelism, Roundness
- Technology: Non-contact - Optical / Laser
- Industrial Applications: Aerospace / Defense, Automotive, Other
- Mounting / Loading: Benchtop
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Supplier: Bruker Nano Surfaces Division
Description: The NPFLEX-LA™ Non-Contact, 3D Surface Metrology System for Lead Angle is the first comprehensive, non-contact metrology solution that repeatably quantifies true lead angle and surface texture on dynamic sealing surfaces. Building on the open-gantry platform of the NPFLEX 3D Surface Metrology
- Measurement: Profiles / Topography, Step Height
- Number of Axes: Single
- Orientation: Vertical
- User Interface / Control: Computer Interface
Find Suppliers by Category Top
Featured Products for High Resolution Metrology Top
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Leica Microsystems, Inc.
3D Optical Surface Metrology System
The Leica DCM 3D system with dual core technology has been designed for fast, non-invasive assessment of micro and nano structures of technical surfaces, in multiple configurations. The DCM 3D combines confocal and interferometry technology for high speed and high-resolution measurements down to 0.1nm. And, the micro display confocal technology, with no moving parts, measures a variety of materials and provides confocal and bright field images simultaneously. (read more)
Browse Microscopes Datasheets for Leica Microsystems, Inc. -
Mahr Federal Inc.
MarSurf™ WS 1 Optical Surface Metrology System
resolution and measuring accuracy.". The white light optical sensor in the MarSurf WS 1 enables the rapid, high-precision recording of surface topography on a wide range of materials. Using white light and a CCD camera, the system is able to collect height information through the field of view of the camera. Both the test surface area and a high-precision reference surface built into the objective lens are imaged simultaneously by the camera. During measurement, the Mirau objective is moved... (read more)
Browse Surface Metrology Equipment Datasheets for Mahr Federal Inc. -
Bruker Nano Surfaces Division
Metrology for Process Quality Control
operation and analysis software to automated staging and integrated vibration isolation. The ContourGT-X is simply the most robust metrology available for high-volume manufacturing of ophthalmic lenses, medical devices, high-brightness LEDs, semiconductor devices, precision machined parts, and much more. (read more)
Browse Specialty Microscopes Datasheets for Bruker Nano Surfaces Division -
MicroSense, LLC
Polar Kerr System for Perpendicular MRAM
field control technique of MicroSense magnetic metrology tools, the Polar Kerr for MRAM system offers high field capabilities and low field resolution to characterize free and pinned layer properties in a single system. Benefits. • Non-contact mapping of the magnetic properties of perpendicular MRAM wafers up to 300mm. • Maximum field of ± 2.5 T for full stack measurements, field resolution of 0.05 Oe for free layer measurements in a single system. • Measurement of patterned... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MicroSense, LLC -
MTI Instruments Inc.
Semiconductor Wafer Thickness Gage
to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process. Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MTI Instruments Inc. -
Leica Microsystems, Inc.
Materials & Industrial Applications Microscopes
resolution guarantees a high-contrast yet natural monitor image. Specially matched system components allow a smooth workflow - even for complex 3D analysis. Thanks to the microscope's compact design and only a few cables between the optics and the system, the installation is lean and user-friendly. Operating costs are reduced by the use of the latest high-performance LEDs: With a lifetime of up to 30,000 hours, there are virtually no more downtimes and the environment benefits from the low energy... (read more)
Browse Surface Metrology Equipment Datasheets for Leica Microsystems, Inc. -
Piezosystem Jena, Inc.
High speed positioner: nanoSX 400
be equipped with a high resolution feedback system for closed loop control. Fields of application include high resolution metrology, x and xy scanning, and dynamic positioning. The stages are available in cryogenic and vacuum versions as well. If you wish to receive further information about this product please use our contact form or send an email to : sales@piezojena.com... (read more)
Browse Linear Slides and Linear Stages Datasheets for Piezosystem Jena, Inc.
Conduct Research Top
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Non-Contact 3D Surface Metrology of Large Grain High Purity Niobium by SLCM and FESEM
Abstract - Non-Contact 3D Surface Metrology of Large Grain High Purity Niobium by. SLCM and FESEM. Z.H. Sung, P.J. Lee and D.C, Larbalestier. Applied Superconductivity Center, National High Magnetic Field Laboratory,. Florida State University, FL, 32310. Microsoft Word - abstract_v1.2.doc
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Optical Metrology for Large Telescope Optics
quality. assurance throughout the process. Laser interferometry is the most widely used technique for verifying surface. quality of large optics. A laser interferometer measures the phase difference between beams reflecting from a. high quality reference optic and from a test optic. In a traditional
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MICRO: Defect Analysis and Metrology - Ge (Feb 2000)
of this technique. Two high-resolution defect review techniques, scanning electron microscopy (SEM) and atomic force microscopy (AFM), can be used to characterize deep submicron defects. While SEM provides information on lateral defect size and shape, it does not provide quantitative height information
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Utilizing Laser Technology in Dimensional Metrology Applications
The wavelength of light provides a very high resolution, linear, and stable reference for dimensional measurement. Labmaster(R) instruments effectively couple the wavelength of light to the part to be measured. They do this by using a fringe counting laser interferometer1 to detect linear motion
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3D Atomic Force Microscopy as an Alternative to X-SEM and TEM for Advanced Process Metrology (AN91) (.pdf)
important for process benefit is its attractive cost savings. performance at a fraction of the cost. control. At 110nm and above, Unlike X-SEM and TEM, AFM The X3D reduces cost per wafer pass traditional top-down CD-SEMS (critical measurements are nondestructive by a factor as high as 10 and provides
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MICRO: Defect/Yield Analysis and Metrology
, and capacitors, which cannot be detected using traditional lamp-based optical inspection tools. E-beam inspection uses voltage contrast to detect defects that exhibit abnormal electrical behavior and are therefore called electrical defects. While its high resolution and large focal depth make E-beam inspection
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Nanopositioning with ALIO Ceramic Stages and Galil Controllers (.pdf)
When dealing with high precision, high resolution applications where positioning down to sub-micron resolution is critical - a ceramic stage coupled to a Galil controller is an excellent motion control solution. This application note describes the actual hardware that was used for a nanometer-level
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SmartMovesTM Spotlights: Veeco Instruments, Inc. (.pdf)
roughness and topography, with subnanometer resolution. The measurements are accurate, repeatable and high speed. Veeco chose Galil's Ethernet-based DMC-3425 motion controllers for its profilers because they provide a highly versatile and powerful form of distributed control where many controllers can
Engineering Web Search: High Resolution Metrology Top
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Carl Zeiss SMT, Germany
2010-09-15: Carl Zeiss AURIGA 60 CrossBeam Workstation ? High Resolution Slicing and 3D-Imaging with Unrivaled Variety of Analytical Options
- Interferometry - Wikipedia, the free encyclopedia
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Optical coherence tomography - Wikipedia, the free...
It captures micrometer-resolution, three-dimensional images from within optical scattering media (e.g., biological tissue). Optical coherence
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Process Control and Yield Management Solutions | KLA-Tencor
eS805 ? e-Beam inspection system leveraging exceptional resolution, sensitivity to material contrast and ability to detect buried electrical defects
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Physikalisch-Technische Bundesanstalt (PTB): High resolution...
Structure > Div. 5 Precision Engineering > 5.2 Dimensional Nanometrology > 5.25 Scanning Probe Metrology > High resolution probing systems
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A Brief History of High-Energy Astronomy
of the dates of operation of high-energy astrophysics missions, some common questions (and their answers!) about high-energy astronomy, a detailed
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Mark L. Schattenburg
the Einstein Observatory (HEAO-2) x-ray satellite, which performed high-resolution x-ray spectroscopy.
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Olympus - Non Destructive Ultrasonic Test Equipment, Innov-X,...
Optical Metrology Videoscopes, Borescopes High Speed Video Cameras XRF and XRD Analyzers