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  • Proper Stack-Up in a Multilayer PCB to Reduce Noise Coupling and Improve EMI
    PCBs.4,5. ­60. S 21. On modern high performance digi-. ­80. tal circuits, the energy increases and. ­1000. 0.4. 0.8. 1.2. 1.6. 2.0. is provided by PWR planes embed-. FREQUENCY (GHz). ded in the multilayer structure of the. PCB. These PWR planes can induce. s Fig. 2 S21 correlation between measured. noise
  • High Speed Data Port Connector Assembly (.pdf)
    fluid, allowing them to take advantage of the "Design For Assembly" expertise that was available. The new connector needed to be assembled at high speed, and with great precision. Contact wire forming and positioning within the housing was absolutely critical to the functionality of the product
  • Considerations for PCB Layout and Impedance Matching Design in Optical
    The optical module offers an effective high-speed solution for a growing telecom market. Data rates range. from 155 Mbps to 6 Gbps and even up to 10 Gbps. Transmitter optical sub-assemblies (TOSAs) and laser. drivers may have different resistances in a given application, so the reflection could
  • Methodical Socket Selection Speeds up Time-to-Market for IC Development Projects
    challenge is to design the PCB with thru-holes for high density devices (0.8mm pitch and below). The thru-hole design increases the final PCB layer count which reflects in the cost. SMT socket uses standard reflow method for mounting and uses minimal PCB area. Higher the pin count, larger the force needed
  • Backplane Design Commands a Critical Role in New Open Specifications For High Performance Systems
    ", is a Motorola-led initiative. The VXS design starts with a standard VME64x backplane design and implements a high speed fabric by replacing the existing P0 connector with a new high-speed Multi-Gig 7 Row connector and adding hub slots fully populated with the new connector. The PICMG effort is AdvancedTCA (PICMG
  • Great Connections for Better Design
    those designs with other teams. Design datasets require version. control of their source files, and verification sign-off steps must occur at each. Graham Bell is Director of Business. stage of the design process. Questions naturally arise whether design IP has been. Development for EDA and PCB
  • Rectifier Assemblies - Analysis and Design
    . Environmental Conditions. high altitude. chemical exposure. humidity. extreme temperatures. 268. RECTIFIER ASSEMBLIES. Design Guide. I. Assembly Type. The following schematics show the types of rectifier assembly elements typically. encountered. It is not uncommon to have combinations
  • Power converter application notes - heat radiation in design
    converters, because they use electrolytic capacitors, are particularly sensitive to heat. Long term operation in high temperatures will significantly reduce the life time of electrolytic capacitors, and may lead to potential problems or safety issues. Appropriate heat radiation design will extend

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