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Supplier: Techwell, Inc.
Description: Key Features JESD204A/B High Speed Data Interface JESD204A Compliant JESD204B Device Subclass 0 Compliant JESD204B Device Subclass 2 Compatible JESD204 Output Lanes Run up to 4.375Gbps Highly Configurable JESD204 Transmitter Multiple Chip Time Alignment and Deterministic
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Supplier: Techwell, Inc.
Description: Key Features JESD204A/B High Speed Data Interface JESD204A Compliant JESD204B Device Subclass 0 Compliant JESD204B Device Subclass 2 Compatible JESD204 Output Lanes Run up to 4.375Gbps Highly Configurable JESD204 Transmitter Multiple Chip Time Alignment and Deterministic
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Supplier: Techwell, Inc.
Description: Key Features JESD204A/B High Speed Data Interface JESD204A Compliant JESD204B Device Subclass 0 Compliant JESD204B Device Subclass 2 Compatible Up to 3 JESD204 Output Lanes Running up to 4.375Gbps Highly Configurable JESD204 Transmitter Multiple Chip Time Alignment
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Supplier: Techwell, Inc.
Description: Key Features JESD204A/B High Speed Data Interface JESD204A Compliant JESD204B Device Subclass 0 Compliant JESD204B Device Subclass 2 Compatible Up to 3 JESD204 Output Lanes Running up to 4.375Gbps Highly Configurable JESD204 Transmitter Multiple Chip Time Alignment
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Supplier: Howard Computers
Description: The TRP10GVP200x/210x is a highly integrated, serial optical transponder module for high-speed, 10Gbit/s data transmission applications. It is ideally suited for 10 GbE datacom (belly-to-belly for high density applications) and storage area network (SAN / NAS) applications based on the IEEE 802.3ae
- Protocols: Fibre Channel
- Network Equipment Type: Transceiver
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Supplier: TriQuint Semiconductor, Inc.
Description: , such as the SerDes. The transimpedance amplifier is driven by a single +3.3 V power supply. The TGA4864 is manufactured in a reliable high-speed SiGe process that combines excellent performance together with cost-effectiveness.
- Package Type: Other
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Featured Products for High Speed SerDes Top
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Molex
100 Gbps Enabling Technology
for our e-nouncement newsletter at www.molex.com/link/register/. OIF Interoperability 2012. Ten companies, including Altera, Gennum and Molex, will unite under the banner of the Optical Internetworking Forum to showcase multi-vendor participation in OIF Interoperability 2012 Enabling High-Speed Dynamic Services. The OIFs PLL demonstration will showcase the draft CEI-28G-VSR implementation agreement, featuring host ASICs with VSR SERDES, host PCB traces, optical module connectors, module retimers... (read more)
Browse Power Connectors Datasheets for Molex
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Estimating Clock Tree Jitter
system-level margin to reliably meet the application jitter requirements. If this jitter. threshold is exceeded in high-speed SerDes applications, for example, it could have a detrimental impact on the. Bit-Error Rate (BER) of the associated high-speed communications link. By ensuring jitter design
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Synchronizing clock sources for Agilent Pattern Generator 70841B
. high-speed serial data and clock. test techniques, performance data. with the ATM standard's. signals. In turn, these signals are. and suggested layout. requirements serve the designer. converted to 8-bit parallel data by. recommendations for a 622 MBd. well. This reference design's. the SerDes IC
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Taking Shelf Management to New Levels
to achieve as close to 100% uptime as possible for High Availability systems, we need the functionality of a shelf manager. The various peripheral cards, power supplies (input voltage, output voltages and temperature), fan speed, airflow, and temperature need to be monitored and controlled closely. How can
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MicroTCATM: Compact, Flexible, Economical Shelf Architecture for Telecom Systems (.pdf)
. and supports all of the protocol options defined for AdvancedMC. provides high-speed connectivity for the AdvancedMC modules,. modules, including Gigabit Ethernet, RapidIO, and PCI Express. giving up to eight protocol independent 12.5 Gb/s SERDES based. The MicroTCA backplane provides an I2C-based
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Design Criteria for Optimum Cooling and Shielding of Enclosures
of challenges for the packaging engineer. In order to satisfy the demands of a given environment the engineer must consider: mechanical constraints, cooling requirements, EMI/RFI restrictions, shock/vibration, power distribution, cable management, system monitoring, high availability (HA), reliability
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622 MBd ATM/SONET/SDH PHY Reference Design Development
it is converted into high-speed. serial data and clock signals. In turn, the signals are converted to 8-bit parallel data by the. SerDes IC. The 8-bit data is then passed onto the framer IC and processed. The framer. output 16-bit bus is looped-back into the framer, this data is passed back to the 8-bit
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Advances in Radar Processing (.pdf)
Processing. Introduction. High Performance, Low Power, Space Efficient. Processing. For the past few years, at GE we have seen multifunctional. It is always desirable to have as much processing power as. radar systems which need to perform much more sophisticated,. possible for today's multifunctional
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The Evolution of Eurocard based Architecture from VMEbus to AdvancedTCA and Beyond
. - Important considerations for Central Office applications. Eventually, the slot limitations of compactPCI and the bottlenecks to higher data transfer rates (a must for I/O intensive applications) posed by bus based architecture prompted the foray into high speed serial buses and Switched fabric
Engineering Web Search: High Speed SerDes Top
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Fujitsu Introduces 65-Nanometer 10G SerDes from Prism Circuits...
?The Prism SerDes represents one of our core focuses in high-speed technology,? said Steve Della Rocchetta, vice president of FMA?s Semiconductor
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Fujitsu Introduces the Industry?s First 20-Port, Ethernet...
of 10Gbps connectivity for blade servers, the increasing need for high-speed aggregation in the enterprise core, and the proliferation of Ethernet
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High-Speed Differential I/O Interfaces and DPA in Stratix V...
Figure 6-2: High-Speed Differential I/Os with DPA Locations in Stratix V Devices Left Clock Right Clock Region Region General Purpose I/O and
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Chapter 9: High-Speed Differential I/O Interfaces with DPA in...
High-Speed Differential I/O Interfaces with DPA in Arria GX Devices AGX52009-1.2 Introduction The ArriaTM GX device family offers up to 840-Mbps
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Xilinx WP324 New High Speed Broadcast Video Connectivity...
Spartan-3E & Spartan-3A FPGAs R WP324 (v1.0) November 28, 2007 New High Speed Broadcast Video Connectivity Solution (3G) with Low-cost FPGAs By: Bob
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LatticeECP3 FPGA
They bring high-end innovations such as configurable SERDES, cascadable DSP slices, high-speed DDR3 memory, and programmable fabric for designing
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LatticeSC/M FPGA
High Speed SERDES: 4 to 32 SERDES per device @ 600Mbps to 3.8Gbps featuring:
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Semtech supplies analog and mixed-signal semiconductor...
High-Rel Discrete Semiconductors High-Speed Interfaces High-Speed Interfaces Index PCIe Re-Drivers