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  • MICRO:Product Technology News (April '2000)
    009;A medium-current ion implanter for 0.18-um processes can deliver throughput up to 210 wafers/hr. The fully automated, serial processing 8250 features 4- to 3500-uA beam currents sufficient to run at mechanical limits for all high-tilt, medium-current applications. The throughput limit
  • MICRO: Defect/Yield Analysis
    for cleaning-process development. This article describes how Infineon Technologies (Dresden, Germany), a memory manufacturer, used the real-time classification (RTC) feature on an AIT II high-throughput patterned-wafer inspection tool from KLA-Tencor (San Jose) to systematically investigate post-oxide
  • Evaluating chemical mechanical cleaning technology for post-CMP applications
    they are caused by agglomeration of slurry particles. Class C defects, such as those shown in Figure 3, are formed from piles of individual slurry particles. SEM analysis has shown that these agglomerates are typically around 0.2 um across and 0.1 to >0.2 um high. There can be >105 of these particles
  • MICRO: Product Technology News (April 2001)
    reduction algorithm focus methods. These enhancements enable a 30% increase in precision to within 2 nm. High throughput of up to 150 200-mm wafers per hour and 120 300-mm wafers per hour, as well as heightened sensitivity, allow for tighter overlay budget control. An automated recipe setup and a Windows NT
  • Vibratory Screen Cleaning Methods Improve Screening Efficiencies and Save Money
    good for deblinding and ejecting fibrous or lint types. materials. ULTRASONIC. Ultrasonic screen cleaning uses vibrational energy generated by an ultrasonic frequency. transducer attached to the metal screen mesh to generate the screen cleaning action. Ultrasonic assisted screening is good for high

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