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Supplier: Epoxy Technology
Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Aerospace, Electronics
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled
Polymers and Plastic Resins - Single Component, Thermally Conductive And Electrically Insulating Epoxy -- EPO-TEK® T6067Supplier: Epoxy Technology
Description: A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Filler Material: Unfilled
- Resins & Compounds: Liquid
Supplier: Terra Universal, Inc.
Description: microelectronic packages. This oven features a double-door design for pass-through operation. An adjustable thermostat with a calibrated indicator controls the contact heating elements which are clamped to the chamber’s exterior walls. High heat-resistant silicon door and window gaskets provide
- Temperature Range: 50 to 300 F
- Capacity: 3.59 gallons
- Application: Aging, Annealing, Baking, Curing, Drying, Heat Treating, Preheating
- External Configuration: Bench / Cabinet, Other
Standards and Technical Documents - Field-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components -- IEC PAS 62162:2000
Description: Describes a uniform method for establishing charged-device model (CDM) electrostatic discharge (ESD) withstand thresholds. All packages semiconductor components, thin film circuits, surface acoustic wave (SAW) components, opto-electronic components, hybrid integrated circuits (HICS), and multi-chipShow More
Supplier: NEC / Schott
Description: The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. In contrast to, for instance TO packages, these packages can be used to package not only a single component, but also several
- Product Type: Package Adapters / Converters
- Mounting: SMT, Through-hole
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Reliability Study Conducted: Leadless Chip Thermistor with High Temperature Solder Leach Resistant Gold Contacts, Die Mounted with Eutectic Au/Sn Solder by Customer (.pdf)
. The application for this product was thermal control of a proximity-coupled laser assembled in a hybrid microelectronic package used for the fiber-optic telecommunications industry.
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Handbook of Thick- and Thin-Film Hybrid Microelectronics Complete Document
J. E. Ahearn, A. Duplex glass enhancement for improving hybrid microelectronic packages , Proc. ISHM, Minneapolis, MN, 1987, p. 275.
Practical Reliability Engineering 5th Edition
Hybrid microelectronic packaging is a technique for mounting unencapsulated semiconductor and other devices on a ceramic substrate.
Image Intensifier Modules For Use With Commercially Available Solid State Cameras
The modular cameras contain two, or sometimes three, hybrid microelectronic packages (Fig. 2).
1.13-Gbit/lightwave transmission system
rear-beam photo- detector, thermistor, and thermoelectric heat pump (THP) are hermetically sealed in a hybrid microelectronic pack- age .
Materials and Processes
The common metals presently selected for microwave and hybrid microelectronic packages are made from Kovar (COE = 5 ppm/°C), Alloy 42 (COE 4.4 ppm), aluminium (23 ppm), and copper (17 ppm).
The integration of InP /InGaAsP ridge waveguide structures with dielectric waveguides on silicon
This surface mount technology for optical components is inspired by the success of hybrid microelectronic packaging .
Hybrid microelectronic packages -a .
Room Temperature Hermetic Sealing of Microelectronic Packages with Nanoscale Multilayer Reactive Foils
Reactive multilayer joining is shown to be a viable alternative to laser welding and furnace reflow soldering for hermetic sealing of hybrid microelectronic packages .
Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University-Industry Design Project Collaboration
A team of engineering students at U.C. Davis collaborated on a design project investigation to develop a lead-free solder process for a hybrid microelectronic package assembly.
Advances in composite materials for thermal management in electronic packaging
C. Thaw, J. Zemany, and C. Zweben, “Metal Matrix Com- posite Hybrid Microelectronic Package Components” (Pa- per presented at the National Electronic Packaging Confer- ence—NEPCON East ’87, Boston, MA, June 1987).