Supplier: Grainger Industrial Supply
Description: Epoxy Adhesive, Hysol E-120HP, Container Size 50 Milliliters, Shear Strength 3000 to 6000 PSI, Substrates Metals, Thermoplastic, Thermoset Plastic, Glass, Ceramic, Masonry, Paper/Hardboard, Work Life 120 Minutes, Ultra Strength, Non Sag Aerospace Grade, Amber
- Use Temperature: 300 F
- Tensile Strength (Break): 4300 psi
Description: Loctite(R) 3165(TM) Hysol(R) Epoxy Hardener, Low Shrinkage; 1QT. Loctite(R) 3165(TM) Hysol(R) Epoxy Hardener, Low Shrinkage is one part of a two part epoxy system to be used with a variety of Loctite(R) Hysol(R) resins. Loctite(R) 3145/3165 and 3145/3162 Hysol Epoxy Systems meet UL 94V-O
- Features: Encapsulating / Potting
Supplier: Grainger Industrial Supply
Description: Acrylic Adhesive, Hysol(R) 3151(TM), Extended Open Time, Impact and Peel Resistant, Light Yellow, 50mL Dual Cartridge, Mixing Ratio 1:1, Full Cure 24 hr., Work Life 30 min., Extended Open Time Allowing For Adjustment Of Parts, Ideal For Aluminum And Steel, Impact And Peel Resistant
- Use Temperature: 0.0 to 212 F
- Tensile Strength (Break): 3800 psi
Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
Supplier: All-Spec Industries
Description: No Description Provided
- Substrate / Material Compatibility: Metal, Plastic, Wood / Wood Product
- Industry: OEM / Industrial
- Cure Type / Technology: Two Component System, Specialty / Other
- Thermal Conductivity: 0.5440 W/m-K
Description: Loctite(R) 9462(TM) Hysol(R) Epoxy Adhesive; 50ML. Loctite(R) 9462(TM) Hysol(R) Epoxy Adhesive is a beige, impact resistant, medium viscosity toughened adhesive with a 55 minute working life.
Encapsulants and Potting Compounds - Henkel Loctite Hysol ES1902 UV Epoxy Encapsulant 200ml Cartridge -- ES1902-A53Supplier: Ellsworth Adhesives
Description: Transparent, low viscosity epoxy resin formulation recommended for potting and laminating applications where low color and excellent electrical and mechanical properties are required.
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Strength: 5.47E7 V/m
Industrial Adhesives - Loctite(R) M-121HP(TM) Hysol(R) Medical Device Epoxy Adhesive; HP 50ML -- 079340-30680
Description: Loctite(R) M-121HP(TM) Hysol(R) Medical Device Epoxy Adhesive; HP 50ML. Loctite(R) M-121HP(TM) Hysol(R) Medical Device Epoxy Adhesive is a high viscosity, non-sag epoxy for applications that require high impact resistance and high peel strength. Bonds dissimilar materials including aluminum, steel
- Industry: Medical / Food (Sanitary / FDA)
Find Suppliers by Category Top
Parts by Number Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|EPOXY HYSOL EE1132 BLACK||National Microchip||Not Provided||Not Provided||Not Provided|
|1373425||Global Industrial||LOCTITE||Not Provided||Loctite ® 1373425 1c ™ Hysol ® 2-Component Epoxy Adhesive Kit, 4 Oz.|
|1390042||Digi-Key||Hysol||Tapes, Adhesives||ES2500-EPOXY POTTING MATERIAL|
|29324||ASAP Semiconductor||LOCTITE||Not Provided||HYSOL E-60NC EPOXY,50 ML DUAL CTG|
More Information Top
Assessment of Effects of a Radiofrequency Energy Field and Thermistor Location in an Electrode Catheter on the Accuracy of Temperature Measurement
The thermistor was hermetically sealed into the electrode with Hysol epoxy to provide thermal and electrical insula- tion.
LBNL four-side buttable CCD package development
To determine if the Hysol epoxy is fully compatible with our required epoxy characteristics it was tested for mass loss, outgassing, shear strength, shear modulus, bending modulus, CTE, thermal capacity, thermal conductivity, and radioactivity.
ES&H development activities for the W89 warhead
Scotchcast 8 Epon 828/U Green HYSOL Epoxy , Sprygap Epoxy/Mica/Z, Red Epoxy glass cloth .
Return to the shorted and shunted quartz gauge problem: Analysis with the SUBWAY code
The component materials of the gauge and impactor are labeled, with Hysol epoxy beiig used for the potting material in the simulation.
Then seal them at the surface with Hysol Epoxy -Patch and allow to harden for the recommended time (Fig. 3) (see Note 2).
ADVANCED WORKER PROTECTION SYSTEM
Hysol epoxy was selected to glue the hubs in place due to its strength and durability at cryogenic temperatures.
A multilayer-reflection technique for three-dimensional photoelastic studies of perforated plates in bending
Homalite 100 in several thicknesses was used for the model material in the investigation with lamina- tions cemented with either of two Hysol epoxy resins Nos. 2038 or 2039.
A bonded polariscope for three-dimensional photoviscoelastic studies
cement formulation consisted of the following: Hysol epoxy resin R9-2039 .
Finite element analysis on impedance matching layer thickness
Different from Grewe's  work, the two part HYSOL epoxy was chosen over SPURR for its simplicity and popularity in the transducer industry.
Journal of Spacecraft and Rockets > A guarded disk-type sample emissometer
HYSOL EPOXY .
Design, development, and assembly of sub-orbital space flight structural health monitoring experiment
Two layers of mesh, one of which was non-conductive, were affixed below the top face with Hysol epoxy .
Composite smart materials using high-volume microelectronics fabrication techniques
A special clamp was used to hold the stack together, while the actuators were bonded together with a HySol epoxy (1 unit of Part A and 0.58 unit of Part B) and cured at I 00°C for 1 hour.
Finite element and experimental study of impedance matching layer optimization
The 0-3 composite matching layer tested in this study consists of HYSOL 2038-3404 two part epoxy and 3 micron alumina, A1703 Different from Grewes  work, the two part HYSOL epoxy was chosen over SPURR for its simplicity and popularity...
Evaluation of Hand Lay-Up and Resin Transfer Molding in Composite Wind Turbine Blade Manufacturing
required for the cure of the Hysol epoxy and this was performed for each bonding .