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Parts by Number for Ic Green Top

Part # Distributor Manufacturer Product Category Description
40MM IC CLIPS208001 GREEN National Microchip Not Provided Not Provided Not Provided
40MM IC TEST CLIPS(208-001) GREEN National Microchip UNKNOWN Not Provided Not Provided
LED - GREEN 570 NM ASAP Semiconductor SAMTEC Not Provided IC
FSCM0465RJX Digi-Key Fairchild Semiconductor Integrated Circuits (ICs) IC SWIT PWM GREEN OVP HV D2PAK
UCC28600D Digi-Key Texas Instruments Integrated Circuits (ICs) IC CTRLR PWM GREEN CM OVP 8SOIC
TEA1533T/N1,518 Digi-Key NXP Semiconductors Integrated Circuits (ICs) IC CTRLR SMPS GREEN OVP 14SOIC
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Conduct Research Top

  • Ceramic Electronic and IC Packaging Design Guide
    . punched in the tape. Because of. metal ized areas, and can have metal. employee base with a manufacturing. the abrasive nature of ceramics,. components attached by brazing. Microwave Packages. Green Processing. capability for multilayer co-fired electronic. special tooling must be used
  • MICRO: Green Manufacturing
    (TLVs) and immediate-danger-to-life-and-health (IDLH) levels of these gases. In order to ensure safe operations, many IC manufacturers use sub-atmospheric-pressure gas-delivery sources and implement other measures to minimize personnel exposure to implant dopants. Only small fractions of the dopants
  • MICRO: Green Manufacturing
    Semiconductor devices have sensitive metal layers that can be damaged by exposure to traditional aqueous cleaning methods. Hence, IC manufacturers rely on specialized solvent-chemical mixtures to prepare the wafer surface. However, many commercially available solvents still rely on water
  • MICRO: Green Manufacturing
    surveys ozone applications in the semiconductor manufacturing industry and provides sample data from users and researchers. Ozone Uses in the IC Industry For more than 20 years, semiconductor industry researchers have investigated the use of ozone for wafer-cleaning and resist-stripping applications
  • 622 MBd ATM/SONET/SDH PHY Reference Design Development
    ) fiber optic application by using HP's. interchangeable HFBR-5208 (multimode) or HFCT-5208 (single-mode) 1x 9 pinout fiber. optic transceivers. The fiber optic transceivers are used with Vitesse Semiconductor. VSC8117, a serializer/deserializer/clock recovery/clock generation integrated circuit (IC
  • Synchronizing clock sources for Agilent Pattern Generator 70841B
    . transceivers are used with a. Vitesse Semiconductor VSC8117. serializer/deserializer/clock. recovery/clock generation. integrated circuit (SerDes IC). along with a PMC-Sierra PM5355. framer and ATM cell processor. IC. ApNt1178 622.08 Mb/s OC-12 ATM-SONET/SDH. Reference Design for Multimode
  • Microporous Insulation in Fuel Cell Applications
    A fuel cell is an alternative energy source that utilizes hydrogen to provide continuous energy without the use of an internal combustion operation. The reaction is "clean", provides power comparable to or more efficient than current electric "grid", diesel and gasoline generators, and other IC
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Flomerics, Gradient partner on die-level thermal issues Gradient Design Automation and Flomerics have announced a partnership to co-develop software solutions for the IC design market. Green Hills refutes copyright infringement charge Green Hills Software has refuted claims by Express Logic Inc

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