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IC Chip Inspection System
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MICRO:Defect Inspection Equipment, by Thomas Reuter (Oct '99)
to determine the AIT II's production worthiness, its applicability to IC production, and its advantages over its predecessor, the AIT I. During the study, inspection recipes were created for a range of IC products. The article summarizes data collected from 64- and 256-Mb memory applications, including
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MEMS Inspection and Testing
tests). Electrical functional MEMS testing is a process used to sort and/or mark die on wafers based on electrical performance. Wafer sorters or probes preform functional tests on dies in wafers or on packaged MEMS or IC devices. Functional tests verify the operation of all device functions
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Flexible circuit helps shed light on optical inspection line
The L2 Illuminator employed in an optical inspection system provides uniform, high-intensity light. The Illuminator is used with equipment that inspects IC carriers and lead frames. Careful placement of LEDS on lamp side panels provides uniform, highintensity lighting from all internal surfaces
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MICRO: Product Technology News (October 2000)
009;Highly stable Eclipse L200 and L200D IC-inspection microscopes incorporate patented CFI optics for clear images, high contrast, and minimal flare. Long working distances and high numerical apertures are possible even at the extremes of magnification, providing bright images with good edge
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MICRO: Defect Metrology
The ability to identify yield-limiting factors rapidly and accurately in order to determine and eliminate their causes is critical to optimizing advanced IC device processes. Because of the complexity and wide variation of defects at the pilot run stage, the inspection strategy used at that point
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MICRO: Defect Analysis
Nurit Raccah, Daniel Rogers, Ehud Tzuri, and Arik Shavit, As IC feature sizes continue to shrink well below the wavelength of visible light, there is an increasing need for high-resolution, high-throughput inspection tools to accelerate process development and optimize production. At the 90-nm
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MICRO: Defect/Yield Analysis
, if not all, IC technologies, poly is isolated from ground by a gate oxide, and a window from the poly to the substrate is not an option. Although poly may be grounded using metal 1, metal 1 processing occurs too late in the manufacturing sequence to permit voltage-contrast inspection of the gate level