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  • Image Processing and Analysis: Variational, PDE, Wavelet, and Stochastic Methods
    Image Processing and Analysis: Variational, PDE, Wavelet, and Stochastic Methods. Presenting a general framework from the analysis of image structures and patterns to their processing, this text covers the four powerful classes of mathematical tools in contemporary image analysis and processing.
  • Particle Analysis with the Camera
    Dynamic Image Analysis is a perfect method if not only the particle size of powders is to be determined, but if you also want to ascertain something about their shape. For this purpose the FRITSCH GmbH provides with the Particle Sizer ANALYSETTE 28 ImageSizer a functional, economically priced
  • Lasernet Fines Q200 - A Solution to Oil Analysis Including Particle Count and Particle Shape Classification
    The focus of this paper is to provide details on how the LNF operates and how its method of particle counting and optical image analysis compares to laser style particle counters and traditional analytical ferrography. Finally, two cases studies, one for an Engine Test Cell and one for a Gearbox
  • Full-Field Dynamic Displacement and Strain Measurement Using Advanced 3D Image Correlation Photogrammetry
    Full-field optical techniques are increasingly appreciated as deformation, stress and strain measuring tools. This article discusses an advanced deformation and strain analysis method based on 3D image correlation photogrammetry that is substantially more robust and has greater dynamic range than
    to expedite the sharing, tracking and analysis of angiograms and intravascular ultrasound (IVUS) studies for the company's DESTINY I clinical trial. The DESTINY I multi-center trial is the tenth drug-eluting stent trial to benefit from the streamlined, web-based image management solution for clinical
  • AN01: Interfacing the RadEye1 Image Sensor to the National Instruments PCI-6111E Data Acquisition Board
    This application note describes a simple method to acquire images from the RadEye1 large-area image sensor into a PC for display, storage and analysis. The system makes use of the PCI-6111E data acquisition board from National Instruments for digitizing the analog output from the RadEye sensor
  • MICRO: Defect/Yield Analysis
    , and unreliable. The latest generation of automated defect-analysis tools may help change that perception. Based on the use of focused ion-beam (FIB) and scanning electron microscopy (SEM) technology to cross-section and image buried defects, surface defects, and 3-D structures, the new tools offer fast
  • MICRO: Failure Analysis
    expensive and more difficult to perform. Scanning transmission electron microscopy (STEM) is finding growing acceptance in semiconductor failure analysis laboratories as a viable alternative, providing image resolution approaching that of a TEM but with a cost and ease of use more like that of a SEM

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