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  • Bonding Non-Metallic Materials Using Indium and High Indium Alloys (.pdf)
    Application: A unique property of indium is that it will wet and bond to certain non-metallics such as glass, glazed ceramics, mica, quartz and various metallic oxides.
  • Indium for Sealing (.pdf)
    Indium is an ideal material to create a compression seal due to its softness. It remains malleable and ductile even at cryogenic temperatures. Alloys containing high amounts of indium are sometimes used but the addition of an another element such as Pb, Sn or Ag reduce the indium's ability
  • Indium Thermal Interface Materials (.pdf)
    Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered
  • Sintered Sm2Co17-Based Magnets With Small Additions of Indium
    In an attempt to develop anisotropic high-temperature permanent magnets consisting of Sm2 ( Co,Fe) 17 grains separated by thinlayers of a nonmagnetic phase, small amounts of Ag, C, Ga, In, and Sn were added to the Sm2 Co17 -based alloys and sintered magnets.Grain-boundary phase(s) with the melting
  • Adding Solder to a NanoBond(R) Assembly
    ). NanoFoil(R). Preforms. Ribbon and Foil. Other. Solder TIM. Thin-Film Materials. Featured Products. Sputtering Targets. Indium. Gallium. Others. Applications. Compounds. Batteries. Catalysts. Fiber Optics. LED MOCVD Precursors. Optical Lens. Reclaim and Recovery. Engineered Solder and Alloys. Connector
  • Humidity and Solder Paste - Avoid Issues
    (Traditional). Categories. Alloys Solder. Antimony Solder. AuSn. B2B Marcom. Ball Attach. Bar Flux. Bar Solder. Bar Wave. BGA. BGA Process. Bismuth. Bismuth Alloys. Bismuth Tin Alloy. Bonding Ribbon. BtoB Marcom. Burn In. Bus Ribbon. Chip Attach. CIG. Clad Preforms. Connected Preform. Copper Indium
  • The Miracle of Soldering - an Historical Perspective
    . Burn In. Bus Ribbon. Chip Attach. CIG. Clad Preforms. Connected Preform. Copper Indium Gallium. Cored Solder. Cored Solder Wire. Cored Wire Solder. Die Attach. Dipping Flux. Dipping Paste. Epoxy Flux. Flux. Flux Cleaning. Flux Cored Solder. Flux in Soldering. Flux Pen. Fusible Alloy. Gallium Alloy
  • Wafer & Substrate Bumping with Solder Paste
    Packaging. Solder Paste and Powders. Wire. Alloy Chart. Thermal Interface Materials. Heat-Spring(R). NanoFoil(R). Preforms. Ribbon and Foil. Other. Solder TIM. Thin-Film Materials. Featured Products. Sputtering Targets. Indium. Gallium. Others. Applications. Compounds. Batteries. Catalysts. Fiber Optics

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