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Supplier: Indium Corporation
Description: Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium 8.9E offers unprecedented
- Form / Shape: Paste
- Lead Free: Yes
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Supplier: Indium Corporation
Description: for die-attach, solder-based processes are still the most popular, as they provide high reliability with ease of processing. Indium Corporation's die-attach solder paste is typically a dispensable, high melting-point solder paste, which is reflowed in forming gas (H2N2 mix).
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Description: DESCRIPTION This paper, "The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes" was presented at the IPC APEX EXPO Technical Conference 2012 by Brandon Judd, technical support engineer at Indium Corporation. He has selected four different sizes
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Supplier: Indium Corporation
Description: Indium Corporation's Flux #3 is a more viscous flux that works best with tin-containing alloys. It has a high boiling point and works well with higher temperature solders. The Flux #3 is available in 1-ounce containers
- Form / Shape: Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Gesswein Co., Inc.
Description: Manufactured for Gesswein under strict quality guidelines so that composition, temperature and color are consistent and uniform from lot to lot. Contains no cadmium, no indium.
- Form / Shape: Paste
- Brazing Filler Alloys: Gold Alloy Braze
- Cadmium Free: Yes
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Featured Products for Indium Solder Paste Top
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Indium Corporation
Wafer & Substrate Bumping with Solder Paste
There are lots of ways of forming deposits of solder in a small form factor, and solder paste printing remains one of the most reliable, although yield drops dramatically at below 120microns pitch (some say 100microns). If you are stencil printing solder paste, there are two guiding principles Sbiroli's Rule & Anglin's Rule. Sbiroli's Rule: The width of the stencil opening must be 7 particles or greater. By the word "particle", we err on the side of caution and refer to the highest... (read more)
Browse Semiconducting Materials Datasheets for Indium Corporation -
Indium Corporation
Package-on-Package Solder Paste
Indium9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life ( >8 hours), and can be used on devices down to 0.4 mm pitch. Package-on-Package (PoP) and System-in-Package(SiP) are an exciting new technology that allows standard SMT assembly techniques to be used to manufacture combinations... (read more)
Browse Semiconducting Materials Datasheets for Indium Corporation -
Indium Corporation
High-Melting Lead-Free Mixed BiAgX Solder Paste
Indium Corporation Technology Experts Share Expertise at IEMT. Indium Corporation ’s Dr. Ning-Cheng Lee, vice president of technology, and Sehar Samiappan, area technical manager for North Malaysia, the Philippines, and Vietnam, will present at the 35th International Electronics Manufacturing Technology Conference November 6 –8 at the Kinta River Front Hotel, Ipoh, Perak, Malaysia. Sehar ’s paper, The High-Melting, Lead-Free, Mixed BiAgX Solder Paste System, explains... (read more)
Browse Semiconducting Materials Datasheets for Indium Corporation -
Indium Corporation
Custom Solder Pastes & Preforms,
Do you struggle with your solder paste to get consistently good, strong joints due to thinner stencils, smaller components, and smaller boards? Try Indium Corporation's Solder Fortification Preforms. We provide the right alloy with the right volume of solder in tape & reel that will integrate easily into your process. See the video below "SUPER-FAST Solder Preform Placement". Solder preforms are manufactured shapes of solder or braze metals designed to fit a specific joint configuration... (read more)
Browse Solder Datasheets for Indium Corporation -
Indium Corporation
Electronics Assembly Solder Fortification Material
. Given the reduction of pad and component lead sizes, the reduction of stencil thicknesses (especially <0.3mm thick), and increasingly densely-packed components, are you even able to design and manufacture products with strong and dependable solder joints?. The answer is YES!. Solder Fortification ™ Preforms are the solution for unreliable solder joints caused by product miniaturization. Solder Fortification ™ Preforms are shaped pieces of solder which are added to a solder paste... (read more)
Browse Solder Datasheets for Indium Corporation -
Indium Corporation
Materials for LED Manufacturing
when compared to standard solders. Die-attach thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280 ° C, eutectic AuSn satisfies these demands. Sub-mount to Assembly Indium Corporation offers a variety of solders that will fulfill sub-mount to assembly needs. Indium offers lead-free and lead-containing solder pastes, bar solder, wave solder, and flux-cored wire. Indium Corporation provides Solder Fortification ® preforms, which are designed... (read more)
Browse Electrical and Electronic Resins Datasheets for Indium Corporation -
Indium Corporation
Solar Materials Science & Solutions
From sputtering targets and solar flux to evaporation sources and metallization paste Indium Corporation offers 20 years of experience and application engineers with front & back-end solar expertise. Our teams work closely with customers to develop custom solutions to their technical problems and increase their productivity. Scroll down to see a video demonstration of LT-918 Low Temperature Metallization Paste developed for thin-film solar cell interconnection. LT-918 has been tested... (read more)
Browse Thin Film Materials Datasheets for Indium Corporation -
Indium Corporation
Gold Based Solder Alloy Advantages
are used for medical products, as well as for aerospace, defense, package sealing, optics, and specialty MEMS packaging. Gold-based alloys can be processed in a variety of soldering applications, including vacuum solder, die-attach, reflow, laser soldering, vapor phase reflow, and manual soldering. Indium Corporation offers gold-based alloys in a variety of forms, including solder paste, solder preforms, solder wire, and solder spheres. Visit Indium Corporation at IMAPS in San Diego Sept... (read more)
Browse Semiconducting Materials Datasheets for Indium Corporation
Conduct Research Top
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Humidity and Solder Paste - Avoid Issues
As a rule, solder pastes and solder flux (tacky flux), be they no-clean (rosin/resin based) or water washable, do not react well to moisture. Humidity and Solder Paste Do Not Mix - Eric Bastow | INDIUM. Indium Corporation(R). Indium Corporation Blogs. Select an area to search All Web Pages Only
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Wafer & Substrate Bumping with Solder Paste
. Tin. Germanium. Reclaim and Recycle. NanoFoil(R). Sheets. Preforms. Powders and Particles. Sputter Target Bonding. Reclaim and Recycle. Solder and Solder Dross Recycle Program. Solar Assembly Materials. Metallization Paste. SUNTABTM PV Ribbon. Liquid Tabbing Flux. Solders. Solder Paste and Powders
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High Melting Lead-Free Mixed BiAgX Solder Paste System
in a high-melting. has nearly 30 years of experience in the. solder joint. In the mixed-powder paste system, a melting temperature above. development of fluxes and solder pastes. for SMT industries. He has extensive. 260°C was verified by both DSC and TMA data. The mixed-powder solders. experience
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Solder Powder: IPC
solder paste users) group to help Brian Toleno, chair of the IPC 5-24b (Solder Paste Task Group) put the finishing touches to the final version of the J-STD-005A. Semiconductor / Power Semiconductor Assembly | INDIUM. Indium Corporation(R). Indium Corporation Blogs. Select an area to search All Web
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Adding Solder to a NanoBond(R) Assembly
. Sputter Target Bonding. Reclaim and Recycle. Solder and Solder Dross Recycle Program. Solar Assembly Materials. Metallization Paste. SUNTABTM PV Ribbon. Liquid Tabbing Flux. Solders. Solder Paste and Powders. Die-Attach. Indium8.9 Series. Low Temp/High Temp. Lead-Free. Package-on-Package Paste
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No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
was used as the test vehicle. Each test coupon contains four SIR. patterns. Two IPC-B-24 SIR test. coupons (a total of eight SIR patterns). were prepared and tested for each. Figure 4. Solder paste reflow profile. From One Engineer To Another®. 2. Indium Corporation Tech Paper. temperature of ~249°C
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Thermal Pad Design and Process for Voiding Control at QFN Assembly (.pdf)
of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. Thermal Pad Design and Process for Voiding Control at QFN Assembly Indium Corporation Tech Paper. Thermal Pad
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ANN-8803 - Recommended Soldering Techniques
. Recommended Solder. Recommended Flux. SMD. Paste. Indium 8.9. No additional flux needed. Flanged. Wire. Core 230 wire .020". Tacflux 18. Flangless Paste/preform. Indium 8.9 or SAC305 preform 2% NC-9 flux coated preform. Chip Paste/preform. Indium 8.9 or SAC305 preform 2% NC-9 flux coated preform
Engineering Web Search: Indium Solder Paste Top
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Indium Corporation Global Solder Supplier Electronics Assembly...
Select Application Compounds Engineered Solder and Alloys Fusible Alloys Medical Devices and Electronics PCB Assembly Semiconductor and Advanced
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Die-attach solder paste and powder made by Indium Corporation
Wafer Bumping Paste Gold-Based Solder Paste Solder Fortification® Solder Paste and Powders
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Solder - Wikipedia, the free encyclopedia
Solder From Wikipedia, the free encyclopedia
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Surface-mount technology - Wikipedia, the free encyclopedia
Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil
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Package-on-Package Solder Paste from Indium Corporation
Home > Company Directory > Indium Corporation > Package-on-Package Solder Paste Indium Corporation - Package-on-Package Solder Paste
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Wafer & Substrate Bumping with Solder Paste from Indium...
Home > Company Directory > Indium Corporation > Wafer & Substrate Bumping with Solder Paste
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Solder Plus Support | Home || AIM Solder
Solder Analysis Dross Reclamation Stencil Design Support
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POWER RELAY 1 POLE--15 to 25 A (FOR AUTOMOTIVE APPLICATIONS)...
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf) l Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.
