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  • Humidity and Solder Paste - Avoid Issues
    As a rule, solder pastes and solder flux (tacky flux), be they no-clean (rosin/resin based) or water washable, do not react well to moisture. Humidity and Solder Paste Do Not Mix - Eric Bastow | INDIUM. Indium Corporation (R). Indium Corporation Blogs. Select an area to search All Web Pages Only
  • High Melting Lead-Free Mixed BiAgX Solder Paste System
    in a high-melting. has nearly 30 years of experience in the. solder joint. In the mixed-powder paste system, a melting temperature above. development of fluxes and solder pastes. for SMT industries. He has extensive. 260°C was verified by both DSC and TMA data. The mixed-powder solders. experience
  • Solder Powder: IPC
    . Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste
  • Adding Solder to a NanoBond (R) Assembly
    . Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel
  • No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
    was used as the test vehicle. Each test coupon contains four SIR. patterns. Two IPC-B-24 SIR test. coupons (a total of eight SIR patterns). were prepared and tested for each. Figure 4. Solder paste reflow profile. From One Engineer To Another®. 2. Indium Corporation Tech Paper. temperature of ~249°C
  • Thermal Pad Design and Process for Voiding Control at QFN Assembly (.pdf)
    of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. Thermal Pad Design and Process for Voiding Control at QFN Assembly Indium Corporation Tech Paper. Thermal Pad
  • ANN-8803 - Recommended Soldering Techniques
    . Recommended Solder. Recommended Flux. SMD. Paste. Indium 8.9. No additional flux needed. Flanged. Wire. Core 230 wire .020 ". Tacflux 18. Flangless Paste/preform. Indium 8.9 or SAC305 preform 2% NC-9 flux coated preform. Chip Paste/preform. Indium 8.9 or SAC305 preform 2% NC-9 flux coated preform
  • Teccor Thyristor Surface Mount Soldering Recommendations (.pdf)
    elements to enhance solderabil-. Vapor phase. ity). For more information, consult Du Pont's Thick-Film. zone. handbook or the factory. Heating. elements. It is best to prepare the substrate by either dipping it in a solder. bath or by screen printing a solder paste. Boiling liquid (primary medium). After

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