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Parts by Number for Indium Solder Paste

Part # Distributor Manufacturer Product Category Description
Indium6.3 Halide-Free: Water Wash   Indium Corporation Filler Alloys and Consumables Indium6.3 is a halide free, low voiding, water soluble solder paste. Indium6.3 has excellent wetting and solder joint appearance, exceptional printing and response to pause with a wide reflow profile window. Indium6.3 has outstanding slump resistance
SACM ™   Indium Corporation Filler Alloys and Consumables Mn-Doped SAC Solder. Low Cost. High Reliability. Superior Drop Testing. Excellent Thermal Cycling. Drop-in Replacement for SAC305 Solder Paste. Current Industry Dilemma. The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC...

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As a rule, solder pastes and solder flux (tacky flux), be they no-clean (rosin/resin based) or water washable, do not react well to moisture. Humidity and Solder Paste Do Not Mix - Eric Bastow | INDIUM. Indium Corporation (R). Indium Corporation Blogs. Select an area to search All Web Pages Only...

...in a high-melting. has nearly 30 years of experience in the. solder joint. In the mixed-powder paste system, a melting temperature above. development of fluxes and solder pastes. for SMT industries. He has extensive. 260°C was verified by both DSC and TMA data. The mixed-powder solders. experience...

Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste...

Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel...

...was used as the test vehicle. Each test coupon contains four SIR. patterns. Two IPC-B-24 SIR test. coupons (a total of eight SIR patterns). were prepared and tested for each. Figure 4. Solder paste reflow profile. From One Engineer To Another®. 2. Indium Corporation Tech Paper. temperature of ~249°C...

...of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. Thermal Pad Design and Process for Voiding Control at QFN Assembly Indium Corporation Tech Paper. Thermal Pad...

Recommended Solder. Recommended Flux. SMD. Paste. Indium 8.9. No additional flux needed. Flanged. Wire. Core 230 wire .020 ". Tacflux 18. Flangless Paste/preform. Indium 8.9 or SAC305 preform 2% NC-9 flux coated preform. Chip Paste/preform. Indium 8.9 or SAC305 preform 2% NC-9 flux coated preform...

...elements to enhance solderabil-. Vapor phase. ity). For more information, consult Du Pont's Thick-Film. zone. handbook or the factory. Heating. elements. It is best to prepare the substrate by either dipping it in a solder. bath or by screen printing a solder paste. Boiling liquid (primary medium). After...

Indium8.9 Series. Lead-Free. Tin-Lead. Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder...

/electropolish stencil, printing, it is not uncommon to look at only as resin) formulas. Because resins. 200mm squeegee with edge guards, finer powder solder pastes to optimize are not very soluble in the solvents used. From one engineer To Another®. 2. Indium Corporation Tech Paper. in water-soluble flux...

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