Industrial Coating Impregnating Resin

Description: Air-drying protective coating

• Use: Impregnating Resin
• Material Form: Varnish / Impregnating Resin
• Features: Electronics / Semiconductors, Electrical Power / HV, UL Approved
• Substrate / Material Compatibility: Metal, Paper / Paperboard, Plastic

Description: Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin

• Use: Die Bonding Adhesive / Compound, Conformal Coating, Gap Filling Compound, Impregnating Resin
• Material Form: Adhesive, Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Grease / Gel, Polymer (Plastic / Elastomer), Powder / Grain, Varnish / Impregnating Resin
• Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
• Dissimilar Substrates: Yes

Description: Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room

• Use: Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound, Impregnating Resin
• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound, Varnish / Impregnating Resin
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
• Dissimilar Substrates: Yes

Description: Silver filled epoxy system for coating tantalum capacitor slugs. This product offers ideal protection from moisture and excellent high temperature operation. Consistent operation of 175C is typical. The product is design for use with dipping machines and requires only one blotting stage. Solvent

• Use: Impregnating Resin
• Substrate / Material Compatibility: Metal
• Industry: Automotive, Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
• Chemical / Polymer System Type: Epoxy (EP)

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.)
• Features: Electronics / Semiconductors
• Use: Conformal Coating
• Form: Liquid

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Industry: Aerospace, Electronics, Industrial, Tooling / Molds
• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Industry: Electronics, Electric Power, Industrial
• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy
• Filler Material: Mineral

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Liquid

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors, Electrical Power / HV
• Compound Type: Electrical Insulation / Dielectric
• Form / Function: Encapsulant / Potting Compound

Description: Dark-brown silicone impregnating resin that offers processing ease and versatility, and features good dielectric properties and moisture resistance. In service, it exhibits good retention of bond strength. Used as an impregnate and coating material for various electrical coils including

• Industry: Industrial, Tooling / Molds
• Chemical / Polymer System Type: Silicone
• Compound Type: Liquid

Description: Class B epoxy ester, dielectric strength 1200V/mil wet, 2100V/mil dry

• Material Form: Coating, Polymer (Plastic / Elastomer), Varnish / Impregnating Resin
• Type: Sealer / Surface Sealant, Varnish
• Chemistry: Epoxy, Resin Base / Polymer Binder
• Substrate / Surface: Other

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Dissimilar Substrates: Yes
• Industry: Aerospace, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Chemical / Polymer System Type: Epoxy (EP)
• Filled / Reinforced: Yes