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  • The Linear and Digital Integrated Circuits Design Primer
    The Linear and Digital Integrated Circuits Design Primer. Written for beginning circuit designers and electrical engineering students, this book covers the basics of both linear and digital circuits, and explains logic gates and families, and includes a variety of specific digital circuits.
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    of BeSang Inc. (Beaverton, Oregon) a fabless semiconductor company, founded in 2003 with strong Korean connections that is developing a 3-D integrated circuit technology. Process variability becoming competitive weapon? Manufacturing process variability has for years been demonized by tool vendors
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    products. AMI Semi purchases Colorado IC design lab AMI Semiconductor has agreed to to purchase certain assets of Starkey Laboratories Inc.'s integrated circuit design center located for $6 million in cash. ATI set to double Indian R &D staff size Graphics chip firm ATI Technologies has readied a new
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    and Reuse, a global collaboration network for sharing system-on-chip design resources, has formed a partnership with China Software and Integrated Circuit Platform. Amino, Philips team on IPTV reference design Amino Communications has announced that its advanced software stack for IPTV set-top boxes
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Samsung finds X architecture hard to adopt, says EDA expert The radical nature of the X architecture approach to integrated circuit manufacture, being pushed forward by the X Initiative consortium, means that it is difficult to adopt for organizational reasons according to Jeong-Taek Kong, vice
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    : Will integrated-circuit technology continue to scale? UMC seeks control of Japan joint-venture fab United Microelectronics Corp. is seeking to gain management control of its 300-mm wafer joint venture with Hitachi Ltd., UMC chairman and chief executive Robert
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    in fabricating multi-layer integrated circuit interconnect that combines copper metal lines with a low-k porous film insulation, the company reported. Over-the-phone electronic-commerce applications should be easier to develop with a new release of the flagship software suite from SpeechWorks International
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    collaboration network signs agreement with CSIP Design and Reuse, a global collaboration network for sharing system-on-chip design resources, has formed a partnership with China Software and Integrated Circuit Platform. Japan's UWB emission policy advances Japan's Ministry of Internal Affairs

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