Products & Services
See also: Categories | Featured Products | Technical Articles | Engineering Web Results-
Supplier: Softchoice Corporation
Description: heat spreaders. Ballistix Tracer memory features a black PCB, black integrated heat spreaders, and one or two rows of eight "chasing" red and green LEDs atop the module, circulating in a random pattern based on memory utilization. A custom-designed circuit relays bus activity to the LEDs, allowing
- Form Factor: DIMM
- Memory Type: DRAM
-
Supplier: Howard Computers
Description: features advanced speed grades, low latencies, and integrated aluminum heat spreaders.
- Form Factor: DIMM
- Supply Voltage: Other
- Memory Type: DRAM
- Error Checking and Correction: Nonparity
-
Supplier: Zones, Inc.
Description: features advanced speed grades, low latencies, and integrated aluminum heat spreaders. Product Description Crucial Ballistix - memory - 6 GB : 3 x 2 GB - DIMM 240-pin - DDR3 Storage Capacity 6 GB : 3 x 2 GB Upgrade Type Generic Technology DDR3 SDRAM Form Factor DIMM 240-pin Memory Speed
- Memory Type: DRAM
- Form Factor: DIMM
- Supply Voltage: Other
-
Supplier: CompUSA
Description: with an integrated heat spreader and tested at their highest-rated speeds and voltages to ensure maximum performance when you install them in your system!
- Memory Type: Other
- Form Factor: DIMM
- Applications: Personal Computing
-
Supplier: Larson Electronics LLC
Description: manufacturers reduce the output of their LEDs to reduce the amount of heat produced. These LED light bars utilize an extruded aluminum housing that incorporates an advanced heat radiating fin design which dissipates heat efficiently to produce the maximum amount of power and longevity from the integrated Edison
Page:
1
Find Suppliers by Category Top
Heat Exchangers
(1,414 Companies)
Heat Pipes
(54 Companies)
Heat Pumps
(269 Companies)
Heat Detectors
(95 Companies)
Heat Sinks
(375 Companies)
Featured Products for Integrated Heat Spreader Top
-
MINTEQ® International Inc, Pyrogenics Group
Graphite Heat Spreader...lightweight options
thermal vias. Increased component reliability. Significant weight savings. Lowered component and system costs. Ideal for thermal spreader applications such as high heat flux semiconductor power electronics found in RF and MW, LEDs, laser diodes, wide gap semiconductors, power amps, integrated circuit lids to name a few. (read more)
Browse Carbon, Graphite, and Diamond Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group -
MINTEQ® International Inc, Pyrogenics Group
Graphite Thermal Spreaders...PYROID® Pyrolytic
can finally get a handle on thermal issues resulting from high heat flux semiconductor power electronics found in RF and MW, LEDs, laser diodes, wide gap semiconductors, power amps, integrated circuits. What about hot spots?. For hot spot issues, our HT standard spreader material offers maximize normal component of thermal conductivity at a cost effective solution without the need for special vias. We solve customer's material problems in a variety of industries including aerospace, defense... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group -
Interplex Industries, Inc.
Wire-Bondable Plating: A Key Process Step
Automotive. Military. Aerospace. Industrial. Consumer Electronics. Medical. Die & Wire-Bondable Electronic Packages. Sensor Connector Housings. Power Electronics. Temperature Sensors. Motor Controllers. Power Leadframes. Pressure & Vacuum. Wire-bondable Ag, Ni, Pd, Au, NiP Platings. Metal or Plastic Die Paddles. Reel to Reel options. Ductile Thermal Heat Spreaders... (read more)
Browse IC Interconnect Components Datasheets for Interplex Industries, Inc. -
Acromag, Inc.
New I/O Server is the Only Compact, Industrial PC
allows users to execute custom logic routines and algorithms on TTL, differential or LVDS I/O signals. Up to four IOS modules can be combined in any mix on the carrier card for flexible, high-density I/O to meet custom requirements. The IOS modules employ advanced heat sink techniques to manage excessive heat. A thermal pad wicks heat away from the module and transfers the energy to a conductive cover that contacts a large heat spreader plate within the I/O Server unit. Heat then moves... (read more)
Browse Computers Datasheets for Acromag, Inc. -
H.C. Starck Inc. - Fabricated Products Group
Tungsten, Molybdenum, Tantalum in LED Lighting
and Tungsten Furnace Components in Phosphors Production for LEDs. MOCVD equipment plays an important role in the LED manufacturing process. H.C. Starck ’s product solutions are fabricated from molybdenum and tungsten materials for complex assembly configurations: . > Collector rings. > Heaters. > Wafer carriers. > Heat sinks . Additionally, we offer molybdenum and Mo-Cu clads materials for base plates and heat spreaders for heat dissipation in LED devices. ... (read more)
Browse Tungsten and Tungsten Alloys Datasheets for H.C. Starck Inc. - Fabricated Products Group
Conduct Research Top
-
An Integrated Fan Speed Control Solution Can Lower System Costs, Reduce Acoustic Noise, Power Consumption and Enhance System Reliability
of the graphic chip. lack the rotating magnetic fields of AC motors and the. To date, there are three basic approaches to thermal. arching of conventional DC motors and, thus, are. cooling: heat spreaders, heat sinks and fans: electrically quiet. 1. Heat spreaders, which are made of a tungsten-. While BDC
-
BGA Socket with Heatsink for High Power Devices
are the characteristics of the IC to be considered: - Thermal resistance from die to IC heat spreader (case). - Size and material of the heat spreader on the IC. Heat sink is designed to transport the heat from the heat spreader on the IC to ambient air. The other characteristics to be considered
-
Thermal Management in Embedded PC Systems (.pdf)
, notably "component SBC". (single board computer) or "System-On-Module" (SOM) type. embedded PCs, offer a thermal interface at layer 2 in order. Common thermal transport layers. to simplify system design. The cover plate of these modules. is a heat spreader assembly that dissipates the heat of the. Layer
Engineering Web Search: Integrated Heat Spreader Top
-
Processors — Do not place a sticker on the desktop...
Do not place a sticker on the desktop processor Integrated Heat Spreader
-
Desktop — How to apply Thermal Interface Material...
Interface Material (TIM) is used to provide efficient thermal exchange between the processor Integrated Heat Spreader (IHS) and the fan-heatsink.
-
Pentium III - Wikipedia, the free encyclopedia
The Coppermine T is the only Coppermine to feature an integrated heat spreader.
-
Computer cooling - Wikipedia, the free encyclopedia
[edit Generators of unwanted heat Integrated circuits (e.g., CPU and GPU) are the prime generators of heat in modern computers.
-
Device and method for package warp compensation in an...
and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being
-
Integrated Heat Spreader With Intermetallic Layer And Method...
Integrated heat spreader with intermetallic layer and method for making
-
Effect of integrated heat spreader on thermal performance and...
Effect of integrated heat spreader on thermal performance and bump joint reliability for flip chip packages
-
Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for...
Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management
-
SOI built-in heat spreader with temperature and pressure...
SOI built-in heat spreader with temperature and pressure integrated sensors for cooling optimization and in situ monitoring
-
125°C-Rated Memory for SiP : Fujitsu Global
Heat dispersers not necessary Reduced cost with no heat sink or heat spreader necessary.
