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  • "VICBricks " Utilize a PRM-VTM Chip-set in a Standard Quarter-Brick Package
    ;-brick interposer board. Fitting comfortably within the volume of the …-brick format, the VICBrick's V I Chip-set achieves unprecedented performance in power density, efficiency, transie VICBricks, high performance DC-DC converters from Vicor Corp. are only a quarter-inch high and conform
  • Optical Interconnections using Polymer Waveguides
    Optical interconnections are under serious consideration for use throughout the backplane and/or motherboard to or from adjoining daughter cards or associated interposer peripheral boards due to increasing costs and adverse performance issues associated with high frequency electronics. A few years

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  • Electrical Design of Through Silicon Via
    Power Distribution Network Modeling and Analysis for TSV and Interposer -Based 3D-ICs in the Frequency Domain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
    Thermal performance and fabrication improvements of glass interposer in 3D packaging systems M. Faqir, M. Bouya, Y …
  • ZCP2012ISTFA02214L
    Session 24: Poster and Dessert Reception Thermal Performance and Fabrication Improvements of Glass Interposer in 3D Packaging …