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Supplier: Advanced Interconnections Corp.
Description: BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles.
Electrical Connectors - Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine -- H11795-NDSupplier: Digi-Key Corporation
Description: CONN INTERPOSER 200POS 25MM
- Connector Type: Other
- Contact Rows: Other
- Contacts Pitch: Other
- Contact Plating: Gold Plating
Supplier: Jewell Instruments, LLC
Description: High-Performance “TriCore” Tubular Technology. The outer shell is machined out of solid stock, resulting in only three magnetic air gaps instead of the usual four. Termination: Teflon wire leads 30 AWG Plunger Weight: 0.04 oz. Solenoid Weight: 0.3 oz.
- Action: Pull
- DC Power Input Options: 6VDC, Other DC Voltage
- Construction: Tubular
Supplier: Zones, Inc.
Description: Networking > Hubs & Switches > Managed Switches
Description: 1.00mm, 1.27mm Pitch Removable Interposer for Dual-Piece Slimline Serial ATA Connector Assembly, Vertical, SMT, 0.76m Gold (Au) Plating, Lead-Free
- Applications: PCB Connectors
- RoHS Compliant: Yes
- Terminal Option: Screw-on or Lugs
- Contacts Pitch: 1.27 mm (0.05'')
Supplier: Indium Corporation
Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
Supplier: Zones, Inc.
Description: IBM System x introduces the EXP3000 500GB Dual Port HS SATA HDD. This new HDD provides dual port function using a state of the art interposer between the HDD and controller. This drive represents the next capacity point in the IBM System x family of SATA HDDs. Product Description IBM Dual Port
- Device Type: Hard Drive
Supplier: Teledyne LeCroy
Description: allowing fully unaltered data pass-through. Connecting to systems in development is simplified through 3 methods. Interposer Card- Ideal for Add-in-Boards and PC/Server systems Midbus Probe- Motherboards and other system boards Multi-lead Probe- Ideal for embedded systems where probing real estate
- Network Protocol: Other
- Interface Port: USB
- Indicators: Yes
- Software Included: Yes
Featured Products for Interposers Top
Advanced Interconnections Corp.
Interposers: Package Conversion & Lead-free Issues
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. More information... Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom... (read more)
Browse Interposers Datasheets for Advanced Interconnections Corp.
Spin-Coating Waferbumping Fluxes - Semiconductors
Ensuring Pristine Microbumps in Dimensional Devices. WHITE PAPER Summary: Moore's Law, the driving force and sine qua non of the semiconductor industry for the last sixty years, is beginning to slow due to both physical and economic limitations. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices" - i.e., stacked-die and die-on-interposer (2.5D and 3D architectures... (read more)
Browse Thin Film Materials Datasheets for Indium Corporation
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Optical Interconnections using Polymer Waveguides
Optical interconnections are under serious consideration for use throughout the backplane and/or motherboard to or from adjoining daughter cards or associated interposer peripheral boards due to increasing costs and adverse performance issues associated with high frequency electronics. A few years
"VICBricks" Utilize a PRM-VTM Chip-set in a Standard Quarter-Brick Package
;-brick interposer board. Fitting comfortably within the volume of the …-brick format, the VICBrick's V I Chip-set achieves unprecedented performance in power density, efficiency, transie VICBricks, high performance DC-DC converters from Vicor Corp. are only a quarter-inch high and conform
Medical Device Link .
are limited and where low leakage current is necessary. XP Power, Littleton, MA. www.xppower.com. Ball-grid array interposer. A ball-grid array (BGA) interposer converts a lead-free integrated-circuit (IC) package into a device-adapter board assembly with tin-and-lead-solder ball terminals. IC packages
Medical Device Link .
. Available in up to 648 positions, low-inductance Interposer contacts connect to the instrument through printed wiring board technology. AMP Inc., P.O. Box 3608, Harrisburg, PA 17105. Micro PCB terminal block According to its manufacturer, a micropitch PCB terminal block with 2.54-mm pin spacing
Medical Device Link .
various characteristics and options. Having such a variety available has contributed to the reasons CSP has not achieved the mainstream deployment enjoyed by kindred BGA devices. The options often confuse even the most knowledgeable product designers and systems developers. Interposer/Substrate
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly: Ensuring Pristine Microbumps in Dimensional Devices
are. interposer (2.5D and 3D architectures)-- primarily to: as key enablers of "More than Moore". · Allow high I/O ultrafine pitches. Andy C. Mackie, PhD, MSc, Senior. Product Manager, Semiconductor. As a concomitant, flip-chip on interposer. (<100microns) without solder bridging. Assembly Materials
Port Sealing: An Effective Heat Sealing Solution
. There also usually is a layer of interposer material to prevent sticking between the heat seal die and the film material during the heat sealing process. Some port heat sealing applications require an engineered material to be underneath the port to act as a back stop or heat sink for the heat
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BGA Interposers SMT Value Added Services BGA Interposers BGA Interposers from Advanced Interconnections are a cost-effective method for
ThinkPad Mailing-list Archive: Re: [Thinkpad Ultraport Camera
Re: [Thinkpad Ultraport Camera II (04P6135) Interposers Next message: AC Brown: "Re: [Thinkpad Ultraport Camera II (04P6135) Interposers"
Low Cost Glass Interposers and Packages Silicon & Glass Interposers EMAP MEMS
Guidelines to select underfills for flip chip on board...
Home > Publications > Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies
Interposers - Product Announcements
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Interposers Information on GlobalSpec
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Agilent | Agilent Technologies, Nexus Technology Deliver DDR3...
The new interposers are designed for use with the Agilent 16900 Series logic analyzer providing state analysis and protocol decode at up to 1,867
Interposers suit wafer-level chip scale package testing.,...
Interposers suit wafer-level chip scale package testing. Interposers suit wafer-level chip scale package testing.
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