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Supplier: Jewell Instruments, LLC
Description: High-Performance “TriCore” Tubular Technology. The outer shell is machined out of solid stock, resulting in only three magnetic air gaps instead of the usual four. Termination: Teflon wire leads 30 AWG Plunger Weight: 0.04 oz. Solenoid Weight: 0.3 oz.
- Action: Pull
- DC Power Input Options: 6VDC, Other DC Voltage
- Construction: Tubular
Supplier: Digi-Key Corporation
Description: BOARD INTERPOSER PMOD TO SDP
Supplier: Indium Corporation
Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
- Fluxes & Cleaners: Soldering Flux / Rosin
Description: 1.00mm, 1.27mm Pitch Removable Interposer for Dual-Piece Slimline Serial ATA Connector Assembly, Vertical, SMT, 0.76m Gold (Au) Plating, Lead-Free
- Applications: PCB Connectors
- RoHS Compliant: Yes
- Terminal Option: Screw-on or Lugs
- Contacts Pitch: 1.27 mm (0.05'')
Electrical Connectors - Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine -- H11795-NDSupplier: Digi-Key Corporation
Description: CONN INTERPOSER 200POS 25MM
- Applications: Board-to-Board Connectors, Rectangular Connectors, Heavy Duty, PCB Connectors
- Connector Type: Other
- RoHS Compliant: Yes
- Contacts Pitch: Other
Supplier: Teledyne LeCroy
Description: Designed for developers, the LeCroy PETracer ML is LeCroy's PCI Express Advanced Verification System supporting wider lane widths. PETracer ML x8 analyzer system allows for full bi-directional decode and capture of x8, x4, x2 and x1 PCI Express links. Through LeCroy's advanced technology, a single
- Network Protocol: Other
- Interface Port: USB
- Buffer Size: 2.00E6 KB
- Indicators: Yes
Description: GENERAL FEATURES · Increase your capacity for producing exceptional full-color documents without compromising the budget. · Produce documents quickly with a 72 page-per-minute print engine that is designed for heavy-duty applications and runs at rated speed regardless of media weight.
- Resolution: 1200 dpi
- Digital Interface: Other
- Copying / Scanning Capabilities: Yes
- Memory / Storage: Yes
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Advanced Interconnections Corp.
Interposers: Package Conversion & Lead-free Issues
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. More information... Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom... (read more)
Browse Interposers Datasheets for Advanced Interconnections Corp.
Thermal Press International, Inc.
What Variables are Necessary for Good Heatsealing?
misalignment, broken or damaged components, and continuity inconsistencies on individual traces. While rejected assemblies in any production process are virtually unavoidable, HSCs can be bonded onto many substrates with a high rate of success if the following application requirements are met. Never use any HSCs that have been on the shelf past their expiration date. Maintain bonding blade planarity with the sealing area of a HSC. Proper use of an interposer material (separator) aids in maintaining... (read more)
Browse Plastic Welding and Assembly Equipment Datasheets for Thermal Press International, Inc.
Aries Electronics, Inc.
Test Sockets.. any device on 0.2mm pitch & up
Aries Electronics - unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time. Quick and Easy Probe Replacement System: the complete set of probes can be removed and a new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent back within one day.  ... (read more)
Browse IC Sockets and Headers Datasheets for Aries Electronics, Inc.
Spin-Coating Waferbumping Fluxes - Semiconductors
Ensuring Pristine Microbumps in Dimensional Devices. WHITE PAPER Summary: Moore's Law, the driving force and sine qua non of the semiconductor industry for the last sixty years, is beginning to slow due to both physical and economic limitations. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices" - i.e., stacked-die and die-on-interposer (2.5D and 3D architectures... (read more)
Browse Thin Film Materials Datasheets for Indium Corporation
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"VICBricks " Utilize a PRM-VTM Chip-set in a Standard Quarter-Brick Package
;-brick interposer board. Fitting comfortably within the volume of the …-brick format, the VICBrick's V I Chip-set achieves unprecedented performance in power density, efficiency, transie VICBricks, high performance DC-DC converters from Vicor Corp. are only a quarter-inch high and conform
Optical Interconnections using Polymer Waveguides
Optical interconnections are under serious consideration for use throughout the backplane and/or motherboard to or from adjoining daughter cards or associated interposer peripheral boards due to increasing costs and adverse performance issues associated with high frequency electronics. A few years
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Electrical Design of Through Silicon Via
Power Distribution Network Modeling and Analysis for TSV and Interposer -Based 3D-ICs in the Frequency Domain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs
Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs .
Development of Large Die Fine-Pitch Cu/Low-
$k$...formula formulatype="inline"> $k$FCBGA Package With Through Silicon via (TSV) Interposer .
Reliability of RoHS-Compliant 2D and 3D IC Interconnects > Through-Silicon-Via (TSV) Interposer Reliability
Reliability of RoHS-Compliant 2D and 3D IC Interconnects > Through-Silicon-Via (TSV) Interposer Reliability .
Contactless stacked-die testing for pre-bond interposers
Contactless stacked-die testing for pre-bond interposers .
Pulse-Vanishing Test for Interposers Wires in 2.5-D IC
Pulse-Vanishing Test for Interposers Wires in 2.5-D IC .
Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections
Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers -to-Printed Wiring Board...
Mid-bond Interposer Wire Test
Mid-bond Interposer Wire Test .
Effect of TSV interposer on the thermal performance of FCBGA package
Effect of TSV interposer on the thermal performance of FCBGA package .
Fabrication and performances of a novel copper-ordered-reinforced polymer composite interposer
Fabrication and performances of a novel copper-ordered-reinforced polymer composite interposer .
Thermal performance and fabrication improvements of glass interposer in 3D packaging systems M. Faqir, M. Bouya, Y...
Session 24: Poster and Dessert Reception Thermal Performance and Fabrication Improvements of Glass Interposer in 3D Packaging...
SOLDER JOINT RELIABILITY & PROGNOSTICATION OF LEAD FREE ELECTRONICS IN HARSH THERMO-MECHANICAL ENVIRONMENTS
Post-Processing Results: Partial Interposer (Eutectic Sn-Pb Solder Joints)..
Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs
Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs .