Products & ServicesSee also:
Supplier: Jewell Instruments, LLC
Description: Our triCore design has a lower reluctance magnetic circuit resulting in reduced power, higher force performance. Very rugged and is completely interchangeable with industy standard tubular Solenoids. Termination: Teflon wire leads 26 AWG Plunger Weight: 0.308″ diameter, 0.041 oz. Solenoid
- Action: Push, Pull
- DC Power Input Options: 6VDC, 12VDC, 24VDC, Other DC Voltage
- Construction: Tubular
Supplier: Digi-Key Electronics
Description: BOARD INTERPOSER PMOD TO SDPShow More
Heavy Duty Rectangular Connectors - Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine -- H11795-NDSupplier: Digi-Key Electronics
Description: CONN INTERPOSER 200POS 25MM
- Standards / Approvals: RoHS Compliant
Description: Plateau HS Dock Interposer Assembly, 144 Circuits, 8.74mm Centerline
- Applications / Categories: Header Connectors
- Contacts Pitch: Other
- Voltage Rating: 12 volts
- Current Rating: 2.7 amps
Supplier: ATLANTA Drive Systems, Inc.
Description: This simple cast-iron claw coupling with interposed elastic ring of oil-resistant and temperature-insensitive special material (Perbunan) largely fulflls the requirements for a trouble- free and maintenance-free shaft connection.
- Coupling Type: Sliding Block / Oldham, Other
- Bore Diameter: 1.65 inch
- Coupling Diameter: 3.82 inch
- Coupling Length: 4.06 inch
Supplier: Indium Corporation
Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
Technical Books - AWWA Task Group Report: Survey of Methods for Evaporation Control (PDF) -- JAW_0067033Supplier: American Water Works Association (AWWA)
Description: ) and interposing an additional physical resistance. Lessons from field trials are discussed, along with computation of water savings, and evaluation of control compounds.Show More
Standards and Technical Documents - Dwell-Rise-Fall-Dwell and Dwell-Fall-Rise-Dwell cam laws. Sections 14 to 23: examples. -- 06004Supplier: IHS ESDU
Description: ESDU 06004 contains examples illustrating the application of Dwell-Rise-Fall- Dwell (DRFD) and Dwell-Fall-Rise-Dwell (DFRD) cam motions, including blended motions and those having a constant velocity component interposed between components controlling the acceleration and retardationShow More
Supplier: ASTM International
Description: for very plastic clays. However, there are instances in the literature where load durations have exceeded 105 min. The clogging of porous stones by migration of soil fines is conventionally prevented by interposing filter paper separators between the porous stones and the soil specimen. The presentShow More
Supplier: ValueTronics International, Inc.
Description: Tektronix TLA7SA16 Features: PCI Express Gen1 through Gen3 including Gen3 Protocol to Physical Layer Analysis for Link Widths from x1 through x16 with up to 8.0 GT/s Acquisition Rates Comprehensive PCI Express Probing Solutions, including Midbus, Slot Interposer, and Solder-down ProbesShow More
Supplier: Rotork plc
Description: moist applications with ease. Design of the T6100 relies on a proprietary integrated solenoid valve module interposed between the flapper-nozzle pilot and the booster section. Upon signal failure, an electrical charge stored within the active electronic circuit controlling the integrated solenoid
- Working Pressure Range: 40 psi
- Device Category: Transducer
- Pressure Reading: Gauge
- Accuracy: 0.5000 ±% FS
Supplier: Acromag, Inc.
Description: The XTA-MRNO-6 is an interposing relay module with six digital inputs and six mechanical relay outputs. It is intended for use with BusWorks XT Series discrete I/O or other digital output modules for the purpose of driving high energy loads. This module serves as an interim digital interface
- Digital I/O Channels: 6
- Interface: TTL
- Form Factor: DIN Rail
- Relay Output: Yes
Supplier: LORD MicroStrain Sensing Systems
Description: Differential Variable Reluctance Transducer Overview Ideal for difficult sensing applications, the Non-Contact DVRT® is designed to measure the displacement and proximity of a metal target without physical contact. The measurement is unaffected by interposed nonmetallic, non-conductive
- Technology: Variable Reluctance Linear Position Sensor/Switch
- Measurement Range: 0.0394 to 0.1969 inch
- Operating Temperature: -67 to 347 F
- Body: Cylindrical
Supplier: Aries Electronics, Inc.
Description: FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual or Automated Handler applications GENERAL SPECIFICATIONS INSERTION LOSS: less than -1dB
- Product Type: IC Socket
- Package Type: BGA, CSP, QFN, QFP
- Current Rating: 4 amps
- Operating Temperature: -40 to 150 F
Supplier: Carl Stuart Co.
Description: Pan made of stainless steel 50mm HeightShow More
Description: interposed irregularly with clusters of the neuraminidase protein. Strains of influenza A are by convention described by geographic origin, strain number, year of isolation and hemagglutinin (H) and neuraminidase (N) sub-types.Show More
Standards and Technical Documents - Cinematography - Spectral response of photographic audio reproducers for analog dye sound tracks on 35 mm film -- ISO 20859:2005
Description: ISO 20859:2005 specifies the spectral response of the photographic audio reproducer light source and receptor as a unit, including any optical filtering that can be interposed. The analog sound track formats suitable for reproduction using such a reproducer include the cyan dye-only track (withoutShow More
Supplier: GE Digital Energy
Description: Interposing relay in conjunction with transformer SP relay Protection and Control Auxiliary contacts and targeting
- Supply Voltage Range: 125 volts
Supplier: Watson McDaniel Company
Description: down on installation and maintenance time, but also provides freeze protection. The FSM Manifold has a sealing system that utilizes an austenitic stainless steel piston that slides into two rings, one upper made of reinforced graphite, and one lower made of graphite interposed with thin stainless
- Outlet Ports: 8
- Port Type: Other
- Integral Manifold Valves: Yes
- Body Material: Steel
Description: The Federal Signal Model AM50 is a compact, two–watt, transformer coupled speaker for use in public address or paging applications. The unique design of this four–inch square speaker centers around the short, folded, re–entrant horn that is interposed between the diaphragm
- Sound Pressure Level: 87 dB
- Nominal Input Power: 2 watts
- Frequency Response: 140 to 10000 Hz
- Speaker Size: 4.5 inch
Supplier: ARGAL s.r.l.
Description: tension. ( i.e.: H2SO4 98%, HCl 33%). HERMETIC PUMP MA magnetic drive pumps are “hermetic” for the liquid pumped is totally restrained in the pump by mean of a single static sealing O ring interposed between of front and rear casings and no use of rotary sealing means (like fix and sliding
- Water Temperature: -4 to 194 F
- Type: Centrifugal Pumps
- Maximum Discharge Flow: 634 GPH
- Market Segment: General Industrial, Commercial
Description: Federal Signal's Model 50GC SelecTone® Speaker Amplifier is designed to produce crisp, clear tones, digital voice messages and live public address. In the Model 50GC a short, folded re–entrant horn is interposed between the diaphragm and surrounding air space. This design provides optimal
- Types: Siren, Bell, Buzzer, Speakers, Whoop Sounder
- Specialty Application: Access Control / Security, Fire, Machine Failure, Process Monitoring, Safety
- Sound Level: 88 dB
- Operating Voltage: 24 volts
Supplier: Aries Electronics, Inc.
Description: (for small quantities) or custom molded (for large quantities) pressure pads and interposers Pressure pad compression spring provides proper force against device and allows for height variations in device thickness 4-point crown insures scrub on solder balls, and raised tip probe provides scrub on pads
- Product Type: IC Socket
- Package Type: Test / Prototyping Socket
- Mounting: Press-fit
- Operating Temperature: -67 to 302 F
Description: ; Insert different stock or other documents as cover sheets for reports, plans or training materials using the CI5010 2-Tray Cover Interposer. · Manage production workflow with confidence using a Fiery Print Controller that pushes the Pro C720s to achieve optimal performance. This fully
- Resolution: 1200 dpi
- Digital Interface: Other
- Copying / Scanning Capabilities: Yes
- Memory / Storage: Yes
Find Suppliers by Category Top
Featured Products Top
Advanced Interconnections Corp.
Customized IC Adapter and Interposer Solutions
Advanced's patented technology utilizes our field-proven solder ball contact system to replace traditional QFP leads. The result is a lower cost, more robust interconnect solution. A number of solder spheres, depending on solder volume requirements, are attached to individual pads on the custom designed Adapter or Interposer. This unique process creates one large solder fillet on the QFP pad and multiple connections to the Adapter for redundancy. Other components such as resistors... (read more)
Browse IC Package Converters and Adapters Datasheets for Advanced Interconnections Corp.
Advanced Interconnections Corp.
Interposers: Package Conversion & Lead-free Issues
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. More information... Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom... (read more)
Browse Interposers Datasheets for Advanced Interconnections Corp.
Thermal Press International, Inc.
What Variables are Necessary for Good Heatsealing?
misalignment, broken or damaged components, and continuity inconsistencies on individual traces. While rejected assemblies in any production process are virtually unavoidable, HSCs can be bonded onto many substrates with a high rate of success if the following application requirements are met. Never use any HSCs that have been on the shelf past their expiration date. Maintain bonding blade planarity with the sealing area of a HSC. Proper use of an interposer material (separator) aids in maintaining... (read more)
Browse Plastic Welding and Assembly Equipment Datasheets for Thermal Press International, Inc.
Spin-Coating Waferbumping Fluxes - Semiconductors
Ensuring Pristine Microbumps in Dimensional Devices. WHITE PAPER Summary: Moore's Law, the driving force and sine qua non of the semiconductor industry for the last sixty years, is beginning to slow due to both physical and economic limitations. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices" - i.e., stacked-die and die-on-interposer (2.5D and 3D architectures... (read more)
Browse Thin Film Materials Datasheets for Indium Corporation
AGC Chemicals Americas, Inc.
Adhesive Perfluoro Resins For One-Step Processing
for use in printed circuit boards, interposers, steel plate laminates, heat-resistant insulating tape and heat-resistant laminated tubing. Fluon ® PFA Resins Product Information. Fluon PFA Technical Brochure. Fluon ® EA-2000 Data Sheet. Fluon ®PFA Resins. Copolymers of tetrafluoroethylene and a perfluorinated vinyl ether, Fluon ® PFA Resins can be used over a wide range of temperatures from extremely low to high (-200 °C to 260 °C) without losing excellent chemical... (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc.
Conduct Research Top
Medical Device Link .
along the joining boundaries. This can cause considerable difficulty for mechanical designers, because it requires the surfaces to mate at frequent intervals. Designers must either provide frequent positive contact points or interpose a conductive resilient gasket. Even after taking such a step
More Information Top
Electrical Design of Through Silicon Via
Power Distribution Network Modeling and Analysis for TSV and Interposer -Based 3D-ICs in the Frequency Domain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal performance and fabrication improvements of glass interposer in 3D packaging systems M. Faqir, M. Bouya, Y …
Session 24: Poster and Dessert Reception Thermal Performance and Fabrication Improvements of Glass Interposer in 3D Packaging …