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Supplier: Jewell Instruments, LLC
Description: Our triCore design has a lower reluctance magnetic circuit resulting in reduced power, higher force performance. Very rugged and is completely interchangeable with industy standard tubular Solenoids. Termination: Teflon wire leads 26 AWG Plunger Weight: 0.308″ diameter, 0.041 oz. Solenoid
- Action: Push, Pull
- DC Power Input Options: 6VDC, 12VDC, 24VDC, Other DC Voltage
- Construction: Tubular
Description: 1.00mm, 1.27mm Pitch Removable Interposer for Dual-Piece Slimline Serial ATA Connector Assembly, Vertical, SMT, 0.76m Gold (Au) Plating, Lead-Free
- Applications: PCB Connectors
- RoHS Compliant: Yes
- Terminal Option: Screw-on or Lugs
- Contacts Pitch: 1.27 mm (0.05'')
Supplier: Indium Corporation
Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
- Fluxes & Cleaners: Soldering Flux / Rosin
Supplier: ValueTronics International, Inc.
Description: Tektronix TLA7SA16 Features: PCI Express Gen1 through Gen3 including Gen3 Protocol to Physical Layer Analysis for Link Widths from x1 through x16 with up to 8.0 GT/s Acquisition Rates Comprehensive PCI Express Probing Solutions, including Midbus, Slot Interposer, and Solder-down Probes
Board to Board Connectors - Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine -- H11795-NDSupplier: Digi-Key Electronics
Description: CONN INTERPOSER 200POS 25MM
- Connector Type: Other
- Contact Rows: Other
- Contacts Pitch: Other
- Contact Plating: Gold Plating
Supplier: Digi-Key Electronics
Description: BOARD INTERPOSER PMOD TO SDP
Description: GENERAL FEATURES · Increase your capacity for producing exceptional full-color documents without compromising the budget. · Produce documents quickly with a 72 page-per-minute print engine that is designed for heavy-duty applications and runs at rated speed regardless of media weight.
- Resolution: 1200 dpi
- Digital Interface: Other
- Copying / Scanning Capabilities: Yes
- Memory / Storage: Yes
Supplier: Teledyne LeCroy
Description: Designed for developers, the LeCroy PETracer ML is LeCroy's PCI Express Advanced Verification System supporting wider lane widths. PETracer ML x8 analyzer system allows for full bi-directional decode and capture of x8, x4, x2 and x1 PCI Express links. Through LeCroy's advanced technology, a single
- Network Protocol: Other
- Interface Port: USB
- Buffer Size: 2.00E6 KB
- Indicators: Yes
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Advanced Interconnections Corp.
Customized IC Adapter and Interposer Solutions
Advanced's patented technology utilizes our field-proven solder ball contact system to replace traditional QFP leads. The result is a lower cost, more robust interconnect solution. A number of solder spheres, depending on solder volume requirements, are attached to individual pads on the custom designed Adapter or Interposer. This unique process creates one large solder fillet on the QFP pad and multiple connections to the Adapter for redundancy. Other components such as resistors... (read more)
Browse IC Package Converters and Adapters Datasheets for Advanced Interconnections Corp.
Advanced Interconnections Corp.
Interposers: Package Conversion & Lead-free Issues
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. More information... Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom... (read more)
Browse Interposers Datasheets for Advanced Interconnections Corp.
Thermal Press International, Inc.
What Variables are Necessary for Good Heatsealing?
misalignment, broken or damaged components, and continuity inconsistencies on individual traces. While rejected assemblies in any production process are virtually unavoidable, HSCs can be bonded onto many substrates with a high rate of success if the following application requirements are met. Never use any HSCs that have been on the shelf past their expiration date. Maintain bonding blade planarity with the sealing area of a HSC. Proper use of an interposer material (separator) aids in maintaining... (read more)
Browse Plastic Welding and Assembly Equipment Datasheets for Thermal Press International, Inc.
Spin-Coating Waferbumping Fluxes - Semiconductors
Ensuring Pristine Microbumps in Dimensional Devices. WHITE PAPER Summary: Moore's Law, the driving force and sine qua non of the semiconductor industry for the last sixty years, is beginning to slow due to both physical and economic limitations. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices" - i.e., stacked-die and die-on-interposer (2.5D and 3D architectures... (read more)
Browse Thin Film Materials Datasheets for Indium Corporation
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"VICBricks " Utilize a PRM-VTM Chip-set in a Standard Quarter-Brick Package
;-brick interposer board. Fitting comfortably within the volume of the …-brick format, the VICBrick's V I Chip-set achieves unprecedented performance in power density, efficiency, transie VICBricks, high performance DC-DC converters from Vicor Corp. are only a quarter-inch high and conform
Optical Interconnections using Polymer Waveguides
Optical interconnections are under serious consideration for use throughout the backplane and/or motherboard to or from adjoining daughter cards or associated interposer peripheral boards due to increasing costs and adverse performance issues associated with high frequency electronics. A few years
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Electrical Design of Through Silicon Via
Power Distribution Network Modeling and Analysis for TSV and Interposer -Based 3D-ICs in the Frequency Domain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal performance and fabrication improvements of glass interposer in 3D packaging systems M. Faqir, M. Bouya, Y �
Session 24: Poster and Dessert Reception Thermal Performance and Fabrication Improvements of Glass Interposer in 3D Packaging �