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  • Medical Device Link .
    along the joining boundaries. This can cause considerable difficulty for mechanical designers, because it requires the surfaces to mate at frequent intervals. Designers must either provide frequent positive contact points or interpose a conductive resilient gasket. Even after taking such a step

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  • Electrical Design of Through Silicon Via
    Power Distribution Network Modeling and Analysis for TSV and Interposer -Based 3D-ICs in the Frequency Domain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
  • ZCP2012ISTFAPOS
    Thermal performance and fabrication improvements of glass interposer in 3D packaging systems M. Faqir, M. Bouya, Y …
  • ZCP2012ISTFA02214L
    Session 24: Poster and Dessert Reception Thermal Performance and Fabrication Improvements of Glass Interposer in 3D Packaging …