Iron Polishing Slurry

Conduct Research

• Using surfactants in iron-based CMP slurries to minimize residual particles
  During recent years, the use of chemical-mechanical planarization (CMP) to remove excess coating material from wafer surfaces has increased dramatically, as has the literature on CMP research. Basically, the CMP process involves polishing wafers using a slurry that combines a chemical component...
• Treating wastewater from CMP using ultrafiltration
  of such polishing tools, new challenges arise, including in such nonprocess areas as facility capabilities and environmental requirements. For example, because the multipart abrasive slurry used in CMP to oxidize and abrade the substrate surface contains an enormous number of ultrafine particles, large...
• MICRO: Surface Conditioning - Hakanson (March 2000)
  , was absent. After the unexposed photoresist was removed and the NiFe-plated material was polished to reduce surface topography, the experiment commenced. The slurry used for polishing this layer was Ultrasol 7A (STI, Monroe, NC), which contains silicon dioxide (SiO2) with an average particle size...
• Next-generation plastics let wafers fly through manufacturing
  . These qualities help promote superior WID and WIF wafer planarity results during polishing. Advanced plastics can also be formulated so they are inherently free of ionic impurities and outgas very little. This is a boon to designers looking to thwart the trace contamination from sodium, aluminum, iron...
• MICRO:Building Copperopolis, by Hugh Li, p.35 (March '99)
  may come from the slurry abrasives, polishing pads, pad conditioners, and the polished material itself, while metallic and organic contaminants may come from the same sources. In the case of a copper interconnect structure, copper residue in the dielectric regions or on the silicon substrate backside...
• Product Technology News
  . CMP Filter Assemblies Pall Port Washington, NY The CMP Kleen-Change 100 filter assembly series is designed for the filtration of metal and oxide polishing slurries. The completely encapsulated, disposable polypropylene filters can reduce potential contamination, minimize contact with the process...
• MICRO: Product Technology News (July '2000)
  applications. Electro-Copper Deposition System. Ebara Technologies. Sacramento, CA. A damascene-type metal deposition system is based on a small-footprint platform already proven in use with the manufacturer's line of chemical-mechanical polishing systems. The Model DMP copper-plating system performs...
• MICRO: Product News
  NanoMaterials. Carlsbad, CA. Mazin SR 300, a stock-removal slurry formulation for enhanced silicon wafer polishing, offers high removal rates with very low metal contamination on the wafer surface. The slurry also has special additives that limit pad glazing and provide stable performance for applications...
• MICRO:Top 40 - Page 2 (Nov '99)
  potential, facilitating repulsion of planarization by-products from the wafer. The solution also minimizes PVA brush loading from copper oxides and polishing slurry. The nontoxic, biodegradable, high-flash-point chemical can be used in all post-CMP wafer-cleaning equipment at process temperatures...
• New Life for Shredded Plastic Waste
  to the next, Daniels continues, the polyolefins are removed from the "lights" followed by targeted polymers such as ABS, PC, ABS/PC, PS, and PVC. Final processing includes polishing and cleaning steps to remove dirt and contaminants for better economics and marketability....

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