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  • Product Extra!
    for tungsten plug and aluminum fill as well as advanced Ta(N)/Cu barrier/seed processes for copper interconnects. The source provides uniform bottom coverage of high-aspect-ratio devices without the use of a collimator. (Semicon West, Yerba Buena Center) Laser thermal processing technology combines
  • Medical Device Link .
    ASTM International Committee F02, Flexible Barrier Packaging, completed balloting for a test method in June 2007. The test is used to rank porous packaging materials in sterile applications by their ability to hold out bacteria. The result of this balloting was test method ASTM F2638-07, Standard
  • MD&DI Web Site Directory- N-Z
    services are also available. Salt Lake City, UT 84123 Microbiology, barrier testing, chemistry, EtO validations, radiation validations, steam validations Customers can use the Web site and index to find testing services, pricing information, industry updates, study outlines, sample requirements
  • MICRO: Behind the Mask
    Device specifications for critical dimensions (CDs) and CD uniformity have driven laser pattern generators to shorter wavelengths in order to enhance productivity and shorten cycle times. Current laser pattern generators operate in the range of 248 257 nm. Exposure doses at those wavelengths
  • MICRO:Defect Inspection Equipment, by Thomas Reuter (Oct '99)
    front-end capacitor and isolation trench formation, tungsten CMP, and metal etch processes. In addition, data from the inspection of logic products, such as barrier metal deposition and second and third metal etch steps, are presented. Finally, the tool's throughput and availability are discussed
  • MICRO: Defect/Yield Analysis & Metrology
    led manufacturers to adopt damascene processes, using chemical-mechanical planarization (CMP) to remove excess copper and associated barrier metals. The challenge is to optimize CMP process uniformity, which means minimizing copper dishing and dielectric erosion and ensuring that structures

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