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  • One laser head, one plasma torch, one cutting table
    The fiber laser and plasma systems share similar delivery systems. Neither require any kind of optical alignment between the power source and cutting head. The two thermal cutting processes share many similarities, from an integration standpoint, which is why the two now can be integrated onto
  • Laser Wire Cutting
    Conventional cutting of fine wires for the medical industry can produce sharp, angular damaged ends. A novel laser technique has been developed to separate wires such that well rounded ends are produced. Results: Careful control of pulse energy and good beam positioning produce highly controlled
  • Laser Cutting Kapton
    the electronics and aerospace. sectors and is commonly cut with Diode Pump. solid state lasers. Set-up. Laser: SPI 200W Water-Cooled laser. Machining head: Laser Mechanisms cutting head. Focal length: 50 mm, X2 beam expander. Process gas: Argon, 10 bar. Laser Parameters: 70W P-Set 1.35kHz 0.7ms. Fig.1
  • Laser Cutting of Tungsten
    but much cleaner with far less heat affected zone. Cut width was 25 microns. Microsoft Word - Laser_Cutting_of_Tungsten_final. Laser Cutting of Tungsten. Material. Results. Tungsten (W) - 160ยต thick strip. Processing parameters: Laser Power: 200W, 150W Average Power. Pulse Width: 0.5ms. Repetition
  • Cutting LDPE
    SYNRAD's sealed CO2 lasers are used in a variety of industrial processes including cutting, welding, drilling, and marking. This news brief showcases some of the interesting materials and products that are processed daily by Synrad's line of CO2 lasers and marking heads. Low Density Polyethylene
  • Featured Application: Laser Marking and Cutting Decorative Cards
    vapor and debris away from the focusing lens when cutting with a marking head). For applications where a thin material must be both cut and marked, marking heads are considerably faster than laser engravers or XY tables, because marking heads use galvanometers to quickly steer and redirect the beam
  • Featured Application: Laser Cutting 13-Layer Dieboard
    lasers and marking heads. Newsletter 246: Laser Cutting 13-Layer Dieboard, Direct Part Marking on Stainless Steel, CO2 Lasers Aid Photovoltaic Manufacturing. Synrad, Inc. - Thursday, September 16, 2010. Issue 246. Applications at a Glance. Cutting 13-Layer Dieboard. Direct Part Marking
  • Featured Application: Laser Cutting Nylon/Foam Laminate
    lasers and marking heads. Newsletter 244: Laser Cutting Nylon/Foam Laminate, Marking Vinyl Fabric, Alternative Wavelength CO2 Lasers. Synrad, Inc. - Thursday, August 19, 2010. Issue 244. Applications at a Glance. Cutting Nylon/Foam Laminate. Marking Vinyl Fabric. News from Synrad