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  • Tips for Selecting the Best Direct Marking Method for Your Part (.pdf)
    success. Whichever method is chosen, whether it is Electro-Chemical Etch, Ink Jet, Laser Etch, or Dot Peen, it is important to review and experiment with as many methods as possible before selecting the appropriate one.
  • Compact Disk Cleaning: Cleaning Glass Master Disks - Aqueous Chemistry and Solvent Drying
    in a chemical solution that etches away areas exposed to the laser light and silver is thin deposited over the etched photoresist.
  • Blasted away
    Abrasive etching is an economical way to precision machine ceramics and other brittle materials. The Photo-Machining Process from Ikonics Corp., Duluth Minn., simultaneously etched 0.012-in.-diameter thru-holes in a thin silicon wafer in about 15 min. Laser drilling could take hours depending
  • MICRO: Archive: Back Issue TOC
    deposition controller, aqueous develop/etch tool, excimer laser micromachining, sample-preparation platform, stainless-steel gas springs, wireless autoleveling sensor, wireless maskmaking sensor, linear CD source, FPD measurement tools, mask metrology system Vendor offers RF atom source/RF ion source
  • Real-TimeVisualization and Prediction of Solder Paste Flow in the Circuit Board Print Operation
    . Chemical etch, laser. machined and electro-formed stencils from two manufacturers are studied to determine critical design parameters. Third, a model describing the release mechanism including sheer and adhesion forces is developed and compared to experimental results. Additionally, a real-time
  • Medical Device Link .
    Unconventional Machining Options Make Their Mark Chemical and laser processes shine in shaping thin parts. You designed it thin. Now you have to make it thin. How are you going to do it? While considering your options, don�t forget about a pair of effective, but sometimes overlooked
  • MICRO:Defect Inspection Equipment, by Thomas Reuter (Oct '99)
    low-angle laser illumination and dark-field collection optics. While drawing on the design of its predecessor, the new inspection tool offers enhanced sensitivity and throughput. Developed to meet the inspection requirements of 0.18- um design rules and
  • MICRO:Product Technology News (Oct '99)
    Matrix S200 metrology systems for CMP and etch provide application-specific sets of metrology techniques. The S200 CMP system has a 5 ' 10-mm-spot, 633-nm HeNe laser ellipsometer for measuring on-product substrate n and k and a 2.5-mm-spot, 470 905-nm reflectometer for measuring film thickness

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