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Conduct Research Top

  • Copper
    shapes, forgings, wire, and castings. These metals are grouped according to composition into several general categories: coppers, high-copper alloys, brasses, leaded brasses, bronzes, aluminum bronzes, silicon bronzes, copper nickels, and nickel silvers. Copper-based alloys form adherent films
  • Teccor Thyristor Surface Mount Soldering Recommendations (.pdf)
    start activation and begin to reduce the. Pad Outline. oxides on component leads and PCB pads. Dimensions are in inches (and millimeters). •. PCB components are brought nearer to the temperature at. which solder bonding can occur. Figure AN1005.4. Modified DO-214 Compak — Three-leaded Surface. Mount
  • The Proliferation of Lead-Free Alloys
    additions of. at the melting point versus the tombstoning rate. small quantities of Manganese, added to SAC105,. dramatically improve performance. Although it is true that eutectic lead-free solder will. tombstone more than eutectic leaded solders, the favored
  • DC/DC CONVERTER Modules Assembly Tips
    before adding the solder wire. With. RoHS iddentified GAIA Converter modules. converter module, it may take more time than with. certain other smaller components. 6. For leaded process we recommend the use of the tin/lead. or. • Cooling : first remove the solder wire then the iron. tin/lead/silver
  • A Resistance Primer
    In Action!!. Riedon releases high resistance values & high temperature performance chip resistors. Current Sense Resistor / Current Shunts. Riedon introduces ultra high precision foil resistors in leaded and surface mount packages. Applications for Wirewound Resistors. Riedon
  • Rohs/WEEE Guidelines (.pdf)
    processing temperatures than their leaded counterparts. To put this into perspective, consider the tin/lead solder alloy that was most commonly used in. electronics. Comprised of 63% tin and 37% lead, this solder alloy becomes liquidus @ 183°C. For comparison sake, SAC305 and SN100C alloys become liquidus
  • Surface Enhancements Eliminate ESD Damage During Operation of State-of-the-Art I.C. Handlers
    and ceramic leaded integrated circuits sliding down the 6061T6 aluminum trackwork. The solution (now used on all of Exatron's most advanced equipment) was to coat the trackwork with General Magnaplate's high-tech, multi-step surface active coatings called NEDOX® and MAGNAPLATE HCR®. The coating
  • Secure Attachment in Pulsed Power Applications
    and. leaded Resistors. Construction “A” consists of a Copper/Tungsten (Cu/W) flange with. Gold/Germanium (Au/Ge) preforms and .060” thick BeO, 270-ohm chip resistor with leads. Construction “B” consists of a Copper (Cu) flange with Lead/Silver preforms and .060” thick BeO,. 270-ohm chip resistor