Lens Polishing Compound

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• Substrates and Discs
  specification. Lensmakers use precision grinding compounds to form the proper surface curvatures, and then use a polishing rouge to create a precision polish. At this point, the surfaces are smooth to a few millionths of an inch, and a lens or colored filter can function as an optical device. Mirrors...
• MICRO: Products
  . A monitoring device for chemical-mechanical planarization applications provides rapid insight into the pressures applied during the polishing process and supplies data directly to personal computers. The easy-to-use I-Scan system measures the tactile force and pressure applied by a polishing head...
• MICRO: Products
  backside that come to the surface during backside polishing pose a risk of yield losses. Such defects cause front-surface distortion during lithography exposure and can migrate between processes. The BSIM applies the Surfscan SP1 platform to detect and classify a wide range of defect types and decreases...
• MICRO: Products
  The LuminaCu RL-CMP, a 300-mm system for copper planarization processes at the 90-nm technology node and below, is a single-wafer processing tool for polishing copper on soft ultra-low-k dielectrics. Combining a high-linear-velocity component that provides high polishing rates with a low-downforce...
• MICRO:Product Technology News (Feb 99)
  introduced a closed-loop control option for dielectric CMP processes. Installed on polishers, the system measures each process wafer immediately after polishing. Studies show throughput increases of 13 to 58%, according to the supplier. The system is designed to minimize the time required and reduce...
• Product Technology News
  to the glands of gas-system components during final high-pressure testing, obviating the need for polishing after testing. Compatible with existing VCR-type units, the fittings can be installed using standard wrenches. Units can be perfectly aligned without rotational displacement of attached lines...
• MICRO: Products
  , and chemically resilient dielectrics can be integrated with standard plasma etch, clean, and copper polishing interconnect module technologies. The Planar 300Ai is configured for low-k Flowfill processing of aluminum metallization dielectrics. Flowfill low-k materials have k values as low as 2.5...
• Introduction to Planos
  corresponds to about .025 microns or one millionth of an inch!. Special manufacturing tools have been developed to produce plano elements. One type is known as a planetary polisher. Thin glass sections, which have been ground to approximate flatness, float in a slurry of polishing compound between two...
• MICRO:Top 25 (November/December 2002)
  production wafers with the sensitivity to detect particles as small as 50 nm. As chip fabrication moves to the use of double-sided polished wafers for 300-mm applications, defects on the wafer backside that come to the surface during backside polishing pose a risk of yield losses. Such defects cause...
• MICRO: Products
  for high-voltage wiring. The compact units feature RS-232C interfaces for remote operation. They can be coupled with CMOS flat-panel x-ray detectors that have 12-bit dynamic range at 30 frames per second. Polishing Tool. Logitech. Westlake, OH. The CDP is a versatile polishing tool designed for use in CMP...

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