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Liquid Polysulfide Polymer

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Polymers and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials. They typically consist of thermoplastic or thermosetting resins in the form of pellets, powders or liquid resins. These materials can then be molded into a variety of shapes for a wide range of uses.
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  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
  • Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Material Form: Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Parts by Number for Liquid Polysulfide Polymer Top

Part # Distributor Manufacturer Product Category Description
EP21TPHT   Master Bond, Inc. Specialty Adhesives, Sealants, and Compounds for polysulfide/epoxy type sealants. It is also available as a flowable liquid of moderate viscosity; EP21TP (viscosity 50,000 cps), or a lower viscosity (5,000 cps) system called EP21TPLV.
EP21TPHTQ   Master Bond, Inc. Laminating Adhesives and Composite Resins for years! The cured compound fully meets the requirements for polysulfide/epoxy type adhesive/sealants. It is also available as a flowable liquid of moderate viscosity; EP21TPHTQ (viscosity 50,000 cps), or lower viscosity version.
EP21TPHTQ   Master Bond, Inc. Polysulphide Adhesives and Sealants for years! The cured compound fully meets the requirements for polysulfide/epoxy type adhesive/sealants. It is also available as a flowable liquid of moderate viscosity; EP21TPHTQ (viscosity 50,000 cps), or lower viscosity version.
EP30BN   Master Bond, Inc. Polysulphide Adhesives and Sealants for polysulfide/epoxy type sealants. It is also available as a flowable liquid of moderate viscosity; EP21TP (viscosity 50,000 cps), or a lower viscosity (5,000 cps) system called EP21TPLV.

Engineering Web Search: Liquid Polysulfide Polymer Top

Polyurethane - Wikipedia, the free encyclopedia
A polyurethane (PUR and PU) is polymer composed of a chain of organic units joined by carbamate (urethane) links.
Sulfur - Wikipedia, the free encyclopedia
Liquid density at m.p. 1.819 g·cm?3 Melting point
Polysulfide polymer products | Technologies and Products |...
HOME > Technologies and Products > Polysulfide Polymers > Polysulfide Polymer Products
LP North America - Liquid Polysulfide Polymers - Datasheets
Thiokol Liquid Polysulfide Polymer THIOKOL LP-3 Thiokol Liquid Polysulfide Polymer THIOKOL LP-12
See LP North America Information
Sealant - Polysulfide Online Catalog
Choose Sub Category Anaerobic Low VOC Polysulfide Polyurethane Silicone Sily Modified Polymer (SMP) Solvent Based UV Curing
See Ellsworth Adhesives Profile & Catalog
Comparison of an Insulating Glass Polyurethane Sealant Based...

See ASTM International Information
Abs. 96, 205th Meeting, ? 2004 The Electrochemical Society,...
process, the lithium polysulfide dissolves into electrolyte, which Fig. 2. Cycle performance of Li / liquid electrolyte of causes the loss of sulfur
See Electrochemical Society (The) Information
Polymer Adhesives Information | Business.com
Polymer Adhesives Home » Directory » Chemicals » Polymers » Adhesives Manufacturers and suppliers of specialty adhesives.
See Business.com, Inc. Information
Untitled
comprising a liquid carrier and particles, the particles comprising a homogeneous mixture of a first additive and at least one polymer selected from
Reports by Title
A New Type of Discotic Liquid Crystals for Organic Solar Cells

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