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  • Medical Device Link . International EMC Compliance Simplified Selecting the right standard is crucial to attaining product certification for electromedical devices.
    Medical Device & Diagnostic Industry In the early days of electronics, electromagnetic compatibility (EMC) was not a major problem. With the advent of the computer, the introduction of electronic equipment increased exponentially. In addition, logic families began to use lower voltages
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Samsung reportedly mulls purchase of LSI Logic fab LSI Logic is working with city and state government agencies in Oregon to help lure South Korean electronics giant Samsung Electronics Co. Ltd. to the state, according to a report by the Portland Business Journal. IBM, amid layoffs, scours globe
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Samsung reportedly mulls purchase of LSI Logic fab LSI Logic is working with city and state government agencies in Oregon to help lure South Korean electronics giant Samsung Electronics Co. Ltd. to the state, according to a report by the Portland Business Journal. IBM, amid layoffs, scours globe
  • Using the Tsi310 to Migrate I/O Adapters
    efficient delayed transactions, block data transfer vs series, and data phase parity error recovery. The first approach is to place the Tsi310 in front of existing PCI I/O adapter logic to get an adapter with PCI-X capability (Figure 1). In this configuration, the Tsi310 operates in PCI-X mode
  • Solid-state relays
    be switched by 3 to 32 Vdc and have input resistance of about 1 k. The lower switching voltage limit is set by the need for compatibility with TTL circuits. (TTL devices can sink 5 V to ground with enough current capacity to switch on the LED in an SSR.) Conversely, programmable logic controllers use 24
  • MICRO: Wet Surface Technologies
    . (Recent semiconductor trends have favored the development of logic and communications-oriented device applications.) The second development is the implementation of mid- and low-k dielectrics using copper for the interconnect material. These developments have made it incumbent on the industry to reduce

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