The weight of 20-3035 Epoxy
Syntactic Foam System is less than half of most commercially available potting and encapsulating compounds. This new epoxy
foam from Epoxies, Etc... utilizes technologically advanced micro balloons. This provides for a
low density,
low coefficient of thermal expansions,
low shrinkage, and a stiff finished product. This unique epoxy system is an ideal material for the potting of electronic assemblies where a
low dielectric constant and
low weight are required...
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