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Low Dielectric Constant Material
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RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
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Supplier: Ferro CorporationDescription: insulation resistance, high breakdown voltage, low dielectric constant and excellent performance in humid environments.
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Supplier: Glotrax Polymers Inc.Description: A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors, UL Approved
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Supplier: PI (Physik Instrumente) L.P.Description: PIC 151 is a modified lead zirconate - lead titanate piezoelectric ceramics material with high permittivity, high coupling factor and high piezoelectric charge constant. This material is the standard material for actuators (PICATM Series) and suitable for low-power ultrasonic transducers
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Supplier: DeWAL Industries, Inc.Description: % to 50%. The material can be rendered hydrophilic through surface treatments and by plasma surface modification. Application areas include gas and liquid filtration, medical diagnostic test kits, wicks, low dielectric constant wrap for microwave cables, batteries and other applications where
- Material Form: Polymer (Plastic / Elastomer), Specialty / Other
- Features: Electronics / Semiconductors, Electrical Power / HV
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Supplier: Saint-Gobain Plastic Films and TapesDescription: electrical properties, dielectric strength and dielectric constant in continuous operating temperatures from -100°F to 350°F (-73°C to 177°C). Applications include transformer and capacitor wrapping, printed circuit board fabrication, splicing tapes, composite bonding protection
- Material Form: Polymer (Plastic / Elastomer), Tape
- Features: Electrical Power / HV
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Supplier: Aremco Products, Inc.Description: High temperature, low viscosity, room temp curing potting compound
- Material Form: Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
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Description: Use with silver/lead electrode systems, excellent sintered density
- Material Form: Ceramic / Inorganic
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Supplier: Insaco, Inc.Description: . Alumina is produced by firing a tightly packed powder form of Al2O3 which includes some binder material. Commercially available grades range from 90% up to 99.95% with the higher purity generating somewhat higher hardness. It is possible to machine alumina using diamond grinding techniques. Polishing
- Material Form: Ceramic / Inorganic, Fabricated Part / Shaped Stock, Film / Sheet, Hollow / Tubular Stock, Plate / Board (e.g., Fiberboard), Wafer / Substrate
- Features: Electronics / Semiconductors, Electrical Power / HV
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Description: conductivity, low electric conductivity, extremely low dielectric constant, strength even under extreme temperature conditions ,outstanding chemical resistance even against fluorination agents, perfect crystal lattice.
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Supplier: Ellsworth AdhesivesDescription: STYCAST 4640 is a RTV condensation cure, silicone rubber syntactic foam. It yields a flexible, low density material having a low dielectric constant and dissipation factor. STYCAST 4640 is readily pourable and is room temperature curable. Sold as a pack (4/pk).
- Industry Applications: OEM / Industrial
- Polymer / Chemical Type: Silicone
Featured Products for Low Dielectric Constant Material Top
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ECCOSTOCK® HiK is a series of controlled dielectric constants materials ranging from 3 to 15. Dielectric loss is low and the accuracy of the dielectric constant is less than 3%. The material does not support fungal growth per MIL-STD-810E, has low water absorption and low outgassing for space applications. Intended for RF and microwave applications, ECCOSTOCK® HiK is primarily used for reducing the overall size of a waveguide by increasing the dielectric constant. It is also used in cavity (read more)Browse Electrical Insulation and Dielectric Materials Datasheets for Emerson & Cuming Microwave Products, Inc. -
and rigid foams including foam in place systems, rigid thermoset materials, composites with controlled K values as well as powders and adhesives. Emerson & Cuming Microwave Products has been serving the needs of RF/Microwave and antenna engineers for over five decades with a broad range of low loss dielectric materials. The ECCOSTOCK® brand is known worldwide by antenna engineers that seek materials to optimize antenna performance based on dielectric constant and loss property requirements... (read more)Browse Electrical Insulation and Dielectric Materials Datasheets for Emerson & Cuming Microwave Products, Inc.
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geometries. In addition, powder formulations are tailored to achieve specific performance characteristics including dielectric constant, dielectric loss and insulation resistance. High Energy Density Film Capacitors - TPL has established specialty fabrication capabilities for production of high voltage capacitors with significantly reduced size and weight. TPL's metallized film capacitors have demonstrated energy densities of over twice that of current state-of-the-art capacitors. TPL's new... (read more)Browse Electrical and Electronic Resins Datasheets for TPL, Inc.
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L8 is a glass-ceramic composite, Low Temperature Co-Fire Ceramic (LTCC) for components and modules with applications up to 31 GHz. L8 features a stable Dielectric constant up to 31 GHz and exhibits one of the lowest dissipation factors in a glass-ceramic formulation. L8 is available in 2, 5, and 10 mil tape as well as powder for internal tape manufacture. The polymer binder formula used in L8 tape can be easily laminated and cut in the green state. L8 can be fired in both batch and belt furnace... (read more)Browse Industrial Ceramic Materials Datasheets for Ferro Corporation
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The weight of 20-3035 Epoxy Syntactic Foam System is less than half of most commercially available potting and encapsulating compounds. This new epoxy foam from Epoxies, Etc... utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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thermal conductivity. Low dielectric constant. Low dissipation factor. Eccospheres® glass microspheres help reduce costs, enhance properties and improve processability. Trelleborg Emerson & Cuming manufacture five distinct product series. All five series are produced from a high silica glass resulting in material integrity up to 800°C / 1,472°F. Eccospheres® glass microspheres exhibit excellent density/strength ratios - due to the removal of sinkers - and high packing factors. However... (read more)Browse Composite Fillers and Reinforcements Datasheets for Trelleborg Offshore
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dielectric constant (2.0 – 2.6) materials that possess inherently better electrical properties than standard insulation material such as PVC. Using highly controlled extrusion processes, these materials are foamed yielding a dielectric medium with a high air concentration. The result of this process is a significantly reduced dielectric constant (1.45 – 1.8) that approaches the nearly ideal properties of air without sacrificing structural integrity. This results in a significant capacitance... (read more)Browse Coaxial Cables and Triaxial Cables Datasheets for New England Wire Technologies Corporation
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The uniform dispersion of ceramic throughout the laminate yields extremely low x and y coefficients of thermal expansion. The low modulus and low x - y CTE values make RF-35A2 an attractive material for the surface mounting of chip carriers. Other benefits of RF-35A2 include temperature stable Dk and Df, excellent peel strength, low moisture absortpion, low loss properties and ease of drilling. This material is used in power amplifiers, filters/couplers, passive components, wireless antennas (read more)Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Taconic
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Polyflon's NorCLAD laminates, made from the thermoplastic PPO (Polyphenylene Oxide), have an ideal dielectric constant of 2.55, very uniform and reproducible electrical properties, and are stable over temperature. When first introduced in the early 1960s PPO was touted as the ultimate dielectric for use as a microwave laminate. However, as a circuit board material, its usage was limited due to the solvent based processing chemicals used at the time. Polyflon's NorCLAD, being impervious... (read more)Browse RF and Microwave Laminates Datasheets for Polyflon Company - a Crane Co. Company
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strength when highly expanded. In fact, LTE maintains its structural integrity at up to 70% air by volume. Additional LTE attributes include high velocity of propagation, low dielectric constant of 1.38, reduced attenuation and capacitance, enhanced flexibility and space savings. Key Advantages of MaxFlite Cables. MaxFlite cables provide the following attributes: Ideal for a range of high-speed Ethernet applications. Small size, light weight. Good flexibility for tight bend radius applications... (read more)Browse Ethernet Cables Datasheets for Thermax
Conduct Research Top
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The Anisotropy of Dielectric Constant in TLY-5A Material
compensated parallel coupled microstrip lines. RF-35, RF-60, coupled-line resonator, Marchand balun, microstrip, parallel coupled filter, parallel coupled lines. Read Abstract Download PDF. The Anisotropy of Dielectric Constant in TLY-5A Material. anisotropy, woven fiberglass, PTFE, Dielectric Constant, Er
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AN0006 Dielectric Ageing
) product. The crystalline structure for Barium Titanate based ceramics changes on passing through its Curie temperature (known as the Curie Point) at approximately 125oC. The domain structure relaxes with time and in doing so, the dielectric constant reduces logarithmically, this is known
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Dielectric Properties of Polymers (.pdf)
), PE, PP and PS and these materials tend to have high resistivities. and low dielectric constants. The structure of the polymer determines if it is polar or non-polar and this determines many of the. dielectric properties of the plastic. Measurements of Electrical Properties. Dielectric Constant
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Electrical Insulators and Dielectric Materials
are used especially as supports for electric oven resistors or heating elements. Ceramics used for high frequency insulator applications require a low dielectric constant and a small loss tangent. The careful choice of raw materials saves the surface from having to be vitrified. A vitrified surface would
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Measuring Thickness of Dielectric Materials using MTI AccumeasureTM Capacitance Instrumentation
materials may be slightly conductive or may be coated on one or both sides with very thin films of conductive material. If this is the case, then care should be taken before using the Accumeasure System to measure thickness or dielectric constant to insure that the results are valid. This can be done
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MICRO: 300-mm Imperative
Axcelis Technologies says its new resist strip tool is the first such system that won't damage low-k materials. Introduced May 27, the ES3Lk uses chemistries that preserve the insulating and structural properties of the low-dielectric-constant materials in dual-damascene processes, according
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MICRO: Brave New Materials
of >0.2-um particles after high-density plasma silicon oxide deposition. Three wafers were processed using the cryogenic aerosol clean and one using a DI-water scrubber. Copper/Low-k Dielectric Cleaning. The adoption of copper and low-dielectric-constant materials for IC interconnection layers has
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MICRO: Testing self-primed spin-on low-k materials to optimize the cost of ownership
, as well as the etch-stop layer. The ability to integrate both the via and trench of the dual-damascene interconnect layer from a single layer of dielectric resin differentiates this technology from the others being considered for use at 130 nm and delivers a very low effective dielectric constant
Engineering Web Search: Low Dielectric Constant Material Top
- Dielectric - Wikipedia, the free encyclopedia
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Permittivity - Wikipedia, the free encyclopedia
A dielectric medium showing orientation of charged particles creating polarization effects.
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National Semiconductor | High-performance Analog
A capacitor exhibiting dielectric absorption acts as if during its long precharge time the dielectric material has soaked up some charge that remains
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High-Speed Board Layout Guidelines
Dielectric material can be assigned a Selection dielectric constant (r) that is related to the force of attraction between two opposite charges
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HITACHI GLOBAL : News Release : Development of ultra low-k...
that they have developed an ultra low dielectric constant spin-on glass (ultra low-k SOG) with a dielectric constant of k=2.4 and an interconnect
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HITACHI GLOBAL : News Release : Highly-reliable low-k material...
To reduce this capacitance, the dielectric constant*2) of the insulating material needs to be reduced.
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IBM Research - Almaden | Dielectric Materials Research for...
H. Treichel, G. Ruhl, P. Ansmann, R. Wurl, C. Muller and M. Dietlmeier, Low dielectric constant materials for interlayer dielectric, Microelectron.
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Physical Review Special Topics - Accelerators and Beams
Jean will be responsible for Low- and Intermediate-Energy Accelerators and Radio Frequency Calculations and Technology.
