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Low Dielectric Constant Substrate
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RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
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Supplier: PI (Physik Instrumente) L.P.Description: PIC 151 is a modified lead zirconate - lead titanate piezoelectric ceramics material with high permittivity, high coupling factor and high piezoelectric charge constant. This material is the standard material for actuators (PICATM Series) and suitable for low-power ultrasonic transducers
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Supplier: Insaco, Inc.Description: grades, with extruded shapes also available at low cost. As-fired tolerances are generally only possible within a few percent of dimension. Extremely tight tolerances are attainable, but only by precision machining the fired part using diamond grinding techniques. This adds considerable cost
- Material Form: Ceramic / Inorganic, Fabricated Part / Shaped Stock, Film / Sheet, Hollow / Tubular Stock, Plate / Board (e.g., Fiberboard), Wafer / Substrate
- Features: Electronics / Semiconductors, Electrical Power / HV
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Description: ECCOSTOCK® HiK500F is a series of controlled dielectric constants materials ranging from 3 to 30. These materials are usable up to 400°F (204°C) with intermittent temperatures to 500°F (260°C). Dielectric loss is low and the accuracy of the dielectric constant is ±3%
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Supplier: Wacker Chemical Corp.Description: LUMISIL® 419 UV is a low viscos, addition-curing, one-part silicone rubber that cures to a rubber. Special characteristics One-part, ready to use Thixotropic Rapid curing by UV-light initiation Forms a rubber on vulcanization Almost constant properties between -40 °C and +180
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System, UV / Radiation Cured (also EB, Light)
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics, Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Epoxy TechnologyDescription: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Electronics, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
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Description: NSULCAST 520 is a very low viscosity, two-component, epoxy curing varnish, designed for lightly coating printed circuit boards, ceramic substrates and plastics, and to quickly penetrate coils and transformers.
- Compound Type: Electrical Insulation / Dielectric Material, Thermal / Heat Insulating
- Material Form: Conformal Coating, Encapsulant / Potting Compound, Impregnating Resin
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Skyworks Solutions, Inc.Description: The D2900 series ceramic is optimized for high Qu in the 1800–2000 MHz range, especially for low-loss PCS and DCS filter and combiner applications. Qu x F product is cavity-dependent, but is generally 100,000 or more. Although usually cylindrical, virtually all parts are customer-specific
- Applications: Electronics / RF-Microwave
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Supplier: Master Bond, Inc.Description: strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer System EP21LVSP3 can be applied readily on a great variety of both inorganic and organic substrates
- Material Form: Adhesive, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
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Supplier: Epoxies Etc...Description: 20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties. 20-2145 has very good adhesion to most substrates, low exotherm during cure, low internal
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
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Description: Use with silver/lead electrode systems, excellent sintered density
- Material Form: Ceramic / Inorganic
Featured Products for Low Dielectric Constant Substrate Top
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geometries. In addition, powder formulations are tailored to achieve specific performance characteristics including dielectric constant, dielectric loss and insulation resistance. High Energy Density Film Capacitors - TPL has established specialty fabrication capabilities for production of high voltage capacitors with significantly reduced size and weight. TPL's metallized film capacitors have demonstrated energy densities of over twice that of current state-of-the-art capacitors. TPL's new... (read more) -
The uniform dispersion of ceramic throughout the laminate yields extremely low x and y coefficients of thermal expansion. The low modulus and low x - y CTE values make RF-35A2 an attractive material for the surface mounting of chip carriers. Other benefits of RF-35A2 include temperature stable Dk and Df, excellent peel strength, low moisture absortpion, low loss properties and ease of drilling. This material is used in power amplifiers, filters/couplers, passive components, wireless antennas... (read more)Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Taconic -
Polyflon has taken advantage of the qualities of PTFE and coupled them with a proprietary plating process to produce a microwave substrate whose loss performance cannot be equaled by any other substrate available at this time. PTFE has unique electrical and physical properties: low loss tangent and dissipation factor, very low dielectric constant, high volume and surface resistivity, high chemical inertness, and almost zero water absorption. Features and Benefits. Ultra Low Loss. Very Low Dk... (read more)Browse RF and Microwave Laminates Datasheets for Polyflon Company - a Crane Co. Company -
in terms of materials, circuit layout, embedded or non-embedded components, manufacturing techniques, and more. The one constant, regardless of the techniques we employ? We are committed to achieving the tightest tolerances and highest performance levels possible with thick film - so your cost vs. performance trade-off is minimized. A few highlights: Flexibility: - sequentially applied layers of alternating conductor and dielectric to build. up the multilayer structure - affording you from 1 to 8... (read more) -
Trelleborg manufactures Eccospheres® glass microspheres which are are hollow thin-walled glass microspheres composed of sodium-depleted borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnification reveals them to be near perfect spheres. Due to their exclusive glass chemistry Eccospheres® glass microspheres exhibit superior dielectric properties. Our dielectric constants range from 1.1 to 1.6 depending on grade. Trelleborg also manufactures... (read more)Browse Electrical Insulation and Dielectric Materials Datasheets for Trelleborg Offshore
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Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium-depleted borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnification reveals them to be near perfect spheres. Due to their exclusive glass chemistry Eccospheres® glass microspheres exhibit superior dielectric properties (dielectric constants ranging from 1.1 to 1.6 depending on grade). Trelleborg's own microsphere containing composites (the TG syntactic... (read more)Browse Glass Powders and Precursors Datasheets for Trelleborg Offshore -
efficiency dielectric reflector that provides Rav > 99% @ 380-780 nm for all angles of incidence between 0° and 45° . BROADBAND HR @ 380-780 nm @ 0°±45° AOI THIN LINE R @ 0° AOI, THICK LINE R @ 45° AOI. In laser applications it is very important to achieve reflection as high as possible over very narrow bandwidth but over wide angular cone. Very high reflection together with proper choice of film and substrate materials, coating design, coating parameters, and substrate cleanliness and surface... (read more)Browse Optical Coating Services Datasheets for Cascade Optical Corp. -
and electrical properties. TPL's processes accommodate a range of capacitor and substrate geometries. In addition, powder formulations are tailored to achieve specific performance characteristics including dielectric constant, dielectric loss and insulation resistance. For additional information contact us: TPL, Inc. 3921 Academy Parkway North, NE. Albuquerque, NM 87109-4416. USA. Web site. E-mail Company. Phone:(505) 342.4439... (read more) -
For three decades, Device Technologies has been polymer coating linear (reel-to-reel) substrates for its own Spring-Fast® wire protection grommet edging as well as other strip materials. Our polymer coating method is a unique, reel-to-reel process. It applies thermoplastic resins such as nylon and polyethylene, or thermoset resins such as polyester and epoxy to linear metallic substrates such as wire, cable, stampings, or steel strip. The coating can be applied to fully encapsulate... (read more)Browse Electrical Insulation and Dielectric Materials Datasheets for Device Technologies, Inc. -
Used in a range of acoustic sensory equipment, as well as low dielectric radomes. Our proprietary manufacturing techniques produce the highest loading of Trelleborg Hollow Glass Microspheres (HGMS) resulting in INDUSTRY LEADING SPECIFIC STRENGTHS. Available now, please contact us to place an order! (read more)Browse Foams and Foam Materials Datasheets for Trelleborg Offshore
Parts by Number for Low Dielectric Constant Substrate Top
| Part # | Distributor | Manufacturer | Product Category | Description |
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| PIC 255 Material | PI (Physik Instrumente) L.P. | Dielectric Ceramics and Substrates | PIC 255 is a modified piezoelectric ceramics material with extremely high Curie temperature, high permittivity, high coupling factor and high charge constant. The material has been optimized for actuator applications under dynamic conditions and high ambient temperatures. The high coupling factor... | |
| Discs and Rings | CeramTec North America | Dielectric Ceramics and Substrates | of handling high control voltages and high mechanical pressure loads. Main features include the following: low dielectric losses. dielectric constants between 1000 and 1400. high Q factor (between 500 and 2000). high Curie temperatures. high coercive field strength. These materials are particularly... | |
| Hemispheres | CeramTec North America | Dielectric Ceramics and Substrates | of handling high control voltages and high mechanical pressure loads. Main features include the following: low dielectric losses. dielectric constants between 1000 and 1400. high Q factor (between 500 and 2000). high Curie temperatures. high coercive field strength. These materials are particularly... | |
| Hemispheres | CeramTec North America | Dielectric Ceramics and Substrates | of handling high control voltages and high mechanical pressure loads. Main features include the following: low dielectric losses. dielectric constants between 1000 and 1400. high Q factor (between 500 and 2000). high Curie temperatures. high coercive field strength. These materials are particularly... | |
| Discs and Rings | CeramTec North America | Dielectric Ceramics and Substrates | of handling high control voltages and high mechanical pressure loads. Main features include the following: low dielectric losses. dielectric constants between 1000 and 1400. high Q factor (between 500 and 2000). high Curie temperatures. high coercive field strength. These materials are particularly... |
Conduct Research Top
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The Anisotropy of Dielectric Constant in TLY-5A Material
Resistance of Microwave PCBs in the K-band. TLY-5A, TLC-32, DK, dielectric constant (e), df, loss tangent (tand), temperature dependance, -50°C to +70°C. Read Abstract Download PDF. Passive intermodulation in printed lines: effects of trace dimensions and substrate. microstrip lines, passive...
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Large Thin Organic PTFE Substrates for Multichip Applications
with a. PTFE based laminates. This is referred to as a PTFE-SIP stiffener, save for a few passive openings. The stiffener was. laminate. The high-speed nature of the PTFE based laminate. CTE-matched to the laminate to provide flatness control. material, having a dielectric constant of 2.7, provides...
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MICRO: Testing self-primed spin-on low-k materials to optimize the cost of ownership
, as well as the etch-stop layer. The ability to integrate both the via and trench of the dual-damascene interconnect layer from a single layer of dielectric resin differentiates this technology from the others being considered for use at 130 nm and delivers a very low effective dielectric constant...
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MICRO: Guerra (April 2001)
be used to reduce interelectrode capacitance. Employing low-k materials with a dielectric constant of 2.5 +- 0.1 at 1 MHz instead of silicon dioxide with a dielectric constant between 3.9 and 4.0 can reduce interelectrode capacitance by a factor of 1.6 if the dielectric layer's integrity can...
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Humidity sensors
Relative humidity, or RH, is the percentage of moisture in the air referenced to the maximum level of moisture the air can hold at that temperature and pressure. Relative humidity sensors come in both capacitive and resistive versions. Humidity changes the dielectric constant of the insulating...
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MICRO: Golden (February 2001)
in an intense worldwide research effort in preparation for the integration of low-k dielectric materials in ICs at the 180-nm technology node, which was scheduled for first shipments in 1999. This effort was driven by the desire to uphold Moore's Law and the various revisions of the industry roadmap...
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MICRO: BEOL Equipment
coverage, low defect density and contamination, good thickness uniformity, and accurate thickness control. However, surface preparation is essential for controlling the density of the functional groups, which are the prerequisite for the initial growth of ALD barriers on the dielectric substrate. Growing...
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MICRO:Building Copperopolis, by Qingyuan Han (Oct '99)
, Novellus has built dual-layer copper damascene structures using low-k film as the dielectric material. Low-k Materials and Selectivity Novellus's CVD-deposited insulator, or low-k dielectric, uses the carbon doping of silicon dioxide to form an SiO2-like material with a reduced dielectric constant...
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MICRO: The Hot Button
gate electrodes and high-dielectric-constant gate insulators, as well as thinner liners and lower-dielectric-constant materials for wiring, the microelectronics industry is seeking to introduce new materials and device structures at an unprecedented rate. New materials are also the key to nonvolatile...
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Product Technology News
coating technique for intermetal dielectric applications. An alternative to spin-on-glass technologies, the coating process is based on a closed-bowl technique that can enhance processing results for low-K dielectric applications, including high-speed logic and memory devices. The technique...
Engineering Web Search: Low Dielectric Constant Substrate Top
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Dielectric - Wikipedia, the free encyclopedia Although the term "insulator" implies low electrical conduction, "dielectric" is typically used to describe materials with a high polarizability. |
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MOSFET - Wikipedia, the free encyclopedia pMOS), opposite in type to the substrate, so nMOS is made with a p-type substrate, and pMOS with an n-type substrate (see article on semiconductor |
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Low Dielectric Constant Substrate invention Low dielectric constant substrate Abstract: A mesoporous silica powder. |
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Taconic RF & Microwave Laminates eliminate skew in differential transmission lines and eliminate dielectric constant fluctuations caused by fiberglass in filter and coupler |
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High-Speed Board Layout Guidelines Dielectric material can be assigned a Selection dielectric constant (r) that is related to the force of attraction between two opposite charges See Altera Corporation Profile & Catalog |
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Physical Review Special Topics - Accelerators and Beams Jean will be responsible for Low- and Intermediate-Energy Accelerators and Radio Frequency Calculations and Technology. |
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Low dielectric constant new materials for multilayer ceramic... Low dielectric constant new materials for multilayer ceramic substrate |
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Electrical design technology for low dielectric constant... Electrical design technology for low dielectric constant multilayer ceramic substrate |
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X-ray Spectroscopic Studies of Low Dielectric Constant... X-ray Spectroscopic Studies of Low Dielectric Constant Parylene and Fluorinated Amorphous Carbon Films J.-H. Guo1, Y. Ma2, H. Yang2, C. Sathe1, A |
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A Wilkinson Power Divider on a Low Resistivity Si Substrate... A Wilkinson Power Divider on a Low Resistivity Si Substrate with a Polyimide Interface Layer for Wireless Circuits John Papapolymerou1, George E. |
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