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  • Dielectric Materials for Use in Radomes
    to eliminate dielectric framework scattering and wall insertion loss. [5]. Fabrication of such radomes generally involves layup or prepreg methods where a resin reinforced laminate material is bound to low or medium density polyurethane foam. Choice of layup or prepreg materials can vary depending
  • Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications
    capability of 2.4× and performance differences. of increased bandwidth and reduced gain, both of which were. attributed in part to the increase in the dielectric and magnetic. losses. A key finding of this paper is that a small amount of. permeability (µr~2.5) can provide a substantial capability
  • MICRO:Editor's Page (Jan '99)
    The semiconductor industry faces a daunting array of defect reduction and yield enhancement challenges as it implements copper and low-k materials and processes over the next couple of years. The SIA roadmap noted that yield losses caused by contamination-related defects and field failures
  • Highly Conductive Insulation for Large, High-Speed Machines
    Silicone-impregnated fiberglass insulation has long been used as stator-coil electrical-insulation for low-voltage, direct current, traction motors. Silicone-based insulation is particularly suited for this application because its thermo-oxidative stability ensures excellent long-term resistance
  • TA038: High Performance Wideband Amplifiers For Radar And Satcomm Applications
    functionality. The amplifiers have been created using M/A-COM's MSAG multi-level plating (MLP) process that utilizes multiple low dielectric constant polyimide layers and thick metallization layers atop the base GaAs. The MLP process allows for low loss, higher frequency operation and increased
  • High-Voltage ICs
    isolation between transistors, whichever is most restrictive. The ICs are fabricated on low-resistivity silicon wafers to reduce power loss and improve device speed. Wafer resistivity is lowered by heavy doping. But junctions formed in heavily doped material have low breakdown voltages. High-voltage
  • PWB Solutions for High Speed Systems
    layer registration capabilities. The system requirements may drive design attributes such as low loss dielectrics, subcomposites, microvias, buried vias, and/or back drilling. Such complex board designs will limit the number of capable suppliers that can be quoted so unnecessary complexity needs
  • Microwave Nondestructive Testing of Composite Materials using Free-Space Microwave Measurement Techniques
    techniques, the measured parameters are reflection coefficients, transmission coefficients, dielectric constants, loss factors, and complex permeabilities as a function of microwave frequency and temperature. These measured parameters can be related to material parameters of interest (e.g., flaws, binder

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  • Landolt-Börnstein
    The filissiges dielectric of high frequency-power capacitors has itself D i b u ty l se bazat (amerik. commercial designation: LEctronol) eingefiihrt because of its high Dielektrizitătskonstanten by low dielectric losses and because of the low decrease of the breakdown resistance …
  • Electronic components
    Because of the very much lower dielectric losses and that are clearly superior to the significantly higher thermal conductivity the circuit board substrates ceramic substrates at high frequencies.
  • Plastics
    Because of the low dielectric loss factor, PS not with aid of high frequency is weldable.
  • Material customer
    Latter has particularly low dielectric losses .
  • Passive electronic components
    Through small dielectric losses and the constant negative temperature coefficient, they are particularly suited as resonant circuit capacitors.
  • Polyolefin‐Folien as electroinsulation
    The polyolefin-films occupy in this respect a Sonderstellung as they have a particularly low dielectric loss factor and a Dielektrizitatskonstantevon only about 2,3 because of absence of polar groups (10-3 to 10-4).
  • Plastics
    Because of the low dielectric loss factor, PS not with aid of high frequency is weldable.
  • Dielectric properties of different insulating materials
    has 13 el of the temperature yon 18o (and probably also below) the Gutta- Gentzsch a significantly lower dielectric loss as gutta-percha.