|
|
||
Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:
Low Insertion Loss Material
Find Suppliers by Category
RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
Search by Specification |
Learn More
-
Supplier: Sheldahl, Inc.Description: insertion loss in the radio and microwave frequency ranges. The surface resistivity of germanium coatings is much higher than ITO (in the range of 107 to 108 ohms per square), but is still adequate for ESD control. Sheldahl's germanium coating has been specially developed to resist humidity
-
Supplier: Networks International CorporationDescription: housing material such as Invar. The design is also optimized with maximum resonator quality factor which ensures low insertion loss operation of the filter.
-
Supplier: Anaren, Inc.Description: loss are required for maximum and low power condition. It can be used in high power applications up to 200 watts. Parts have been subjected to rigorous qualification testing and they are manufactured using materials with coefficients of thermal expansion (CTE) compatible with common substrates
-
Supplier: Emhiser Research, Inc.Description: Features Broadband Surface Mount Low Cost High Temp Material
- Category: Passive
- Divider / Combiner Type: 90º Hybrid
- Package Type / Form Factor: Surface Mount Technology (SMT)
-
Supplier: Leister USADescription: Axetris fiber micro-lens arrays are optimized for coupling light efficiently to single mode fiber arrays for optical communication applications. Features Applications Small size Low insertion loss Fused Silica or Silicon material Low surface roughness 100 % inspection
- Cable Type: Single Mode
- Coupler Wavelength(s): 1300 nm, 1550 nm, Other
-
Supplier: Leister USADescription: Axetris fiber micro-lens arrays are optimized for coupling light efficiently to single mode fiber arrays for optical communication applications. Features Applications Small size Low insertion loss Fused Silica or Silicon material Low surface roughness 100 % inspection
- Lens Type: Aspheric Lens
- Lens Application: Infrared
- Materials: UV Grade Fused Silica
- Antireflection Coating: Yes
Featured Products for Low Insertion Loss Material Top
-
The uniform dispersion of ceramic throughout the laminate yields extremely low x and y coefficients of thermal expansion. The low modulus and low x - y CTE values make RF-35A2 an attractive material for the surface mounting of chip carriers. Other benefits of RF-35A2 include temperature stable Dk and Df, excellent peel strength, low moisture absortpion, low loss properties and ease of drilling. This material is used in power amplifiers, filters/couplers, passive components, wireless antennas (read more)Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Taconic -
TSM-DS is a ceramic-filled reinforced material with very low fiberglass content (~5%) that rivals epoxies in fabricating large format complex multilayers. TSM-DS core combined with fastRise ™27 (DF = 0.0017 at 40 GHz) prepreg is an industry leading solution for the lowest possible dielectric losses that can be attained at epoxy-like 390 - 420 ˚F (200 - 215 ˚C) fabrication temperatures. The low insertion losses of TSM-DS/ fastRise ™27 are only rivaled by fusion bonding... (read more)Browse RF and Microwave Laminates Datasheets for Taconic
-
DS3 is the newest addition to the TSM-DS family of thermally stable, industry leading low loss cores. This ceramic-filled laminate with low fiberglass content has a dissipation factor of 0.0011 @ 10 GHz and thermal conductivity of 0.65 W/M*K. Both materials are offered with Very Low Profile copper which yields lower insertion loss and excellent copper bond strength. (read more)Browse RF and Microwave Laminates Datasheets for Taconic
-
Xinger-III Doherty combiners are designed particularly for Doherty amplifier applications, where tightly controlled phase and amplitude imbalance as well as low insertion loss are required for maximum and low power condition. They can be used in high power applications up to 200 watts. Xinger-III Doherty combiners available now include: X3DC19P1S: 1.805-1.88 GHz Frequency Range, 0.17 dB Insertion Loss, 25 dB Return Loss. X3DC07E2S: 0.728-0.768 GHz Frequency Range, 0.15 dB Insertion Loss, 20 dB Return... (read more)Browse RF Power Dividers and RF Power Combiners Datasheets for Anaren, Inc.
-
fiberglass stretches very little before breaking, resulting in typical elongations of 3 - 4%. Chopped fiber equivalents typically elongate closer to 6%. The more stable structure of TLY lends itself to high volume manufacturing and larger panel fabrication. With a Dk range between 2.17 and 2.40, low moisture absorption, superior laser hole quality, low loss and high peel strength, the TLY family is ideal for mobile communication systems, microwave transmission devices, phased array antennas, RF... (read more)Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Taconic
Conduct Research Top
-
Loss Tangent
current tan = | IR / IC | . The dielectric quality factor (Q) is equal the inverse of the loss tangent. High Q or low loss tangents are required to reduce insertion losses. Q = (average stored energy per cycle / energy dissipated per cycle)
-
Specifying a Low Pass Filter
depending on the design of the filter. In order to quote/specify a low pass filter, the following information must typically be provided: 1. The extent of the passband (i.e.; what frequencies does the low pass filter PASS?). 2. The passband insertion loss (how much power is dissipated by the filter) 3
-
Optimizing Insertion Extraction Force in a Pin-Socket Interconnect
due to substrate warping and wicking of solder into the contacts. Large integrated circuits with pin counts over 1000 and approaching more than 2000 are becoming common. Because of high pin counts a low insertion force is important for usability. This paper will discuss optimizing insertion
-
The Anisotropy of Dielectric Constant in TLY-5A Material
in printed lines. TLX-8, TLX-9, RF-30, passive intermodulation, PIM, long-term stability, base station antenna. Read Abstract Download PDF. Low insertion loss substrate integrated waveguide quasi-elliptic filters for V-band wireless personal area network applications. TacLamPLUS, SIW filter, personal area
-
Panduit Laboratories: Choosing the Best Ferrule Material for Your Network Application (.pdf)
. Figure 2. Magnified view of composite ferrule endface before use (left) and after being subject to many moves,. add and changes (right). Defects in connector endfaces such as pits, cracks, chips, and deep scratches can. result in high insertion loss and low return loss, which in severe enough cases
-
Quadsplitter Connectors
In current Fibre Channel systems, greater demand is put on cable and connector designers to address the high data rates already here and the ones fast approaching. At the moment, cable suppliers have produced excellent cable with tight tolerance characteristic impedance and low insertion loss
-
The Impact of Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip and Stripline
Transmission line attenuation is known to be influenced by conductor surface profile (Rrms), an effect that worsens as frequency increases. Using microstrip transmission lines, copper conductive losses are characterized from 0.03 - 30 GHz in low loss materials incorporating various copper types
-
Why Use White Bronze Plating?
White Bronze plating for RF connectors offers many advantages over Nickel or Silver plated connectors. Improved electrical and intermodulation performance, better wear characteristics in harsh conditions and low insertion loss compared to Nickel are just a few. Although Silver has been
Engineering Web Search: Low Insertion Loss Material Top
-
Optical fiber - Wikipedia, the free encyclopedia
Fibers are used instead of metal wires because signals travel along them with less loss and are also immune to electromagnetic interference.
-
Universal Serial Bus - Wikipedia, the free encyclopedia
introduced in January 1996, defined data transfer rates of 1.5 Mbit/s "Low Speed" and 12 Mbit/s "Full Speed".[5 The first widely used version of USB
-
Physical Review Special Topics - Accelerators and Beams
Jean will be responsible for Low- and Intermediate-Energy Accelerators and Radio Frequency Calculations and Technology.
-
RF-35A2 Ultra Low Loss Power Amplifier Substrate from Taconic
Home > Company Directory > Taconic > RF-35A2 Ultra Low Loss Power Amplifier Substrate Taconic - RF-35A2 Ultra Low Loss Power Amplifier Substrate
-
Special Publication 800-58 Security Considerations for Voice...
Because of the time-critical nature of VOIP, and its low tolerance for disruption and packet loss, many security measures implemented in traditional
-
TIFFTM Revision 6.0 Final -- June 3, 1992 Adobe Developers...
Permission to copy without fee all or part of this material is granted provided that the copies are not made or distributed for direct commercial
-
High performance organic substrate with high dielectric...
High performance organic substrate with high dielectric constant, low loss, and low temperature coefficient of resonant frequency for high frequency
-
Low cost phase shifters and integrated phased antenna arrays...
materials technology multi-dielectric material CPW design low loss thin dielectric layer insertion loss figure of merit continuous transverse stubs
