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Supplier: PI (Physik Instrumente) L.P.
Description: PIC 151 is a modified lead zirconate - lead titanate piezoelectric ceramics material with high permittivity, high coupling factor and high piezoelectric charge constant. This material is the standard material for actuators (PICATM Series) and suitable for low-power ultrasonic transducers
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Supplier: Master Bond, Inc.
Description: and encapsulation applications. Because of the superior retention of its electrical insulation characteristics, formulations based on Master Bond Polymer System EP112AO are successfully employed in electrical insulation applications including post and suspension insulators; high and low voltage
- Coating Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Industry Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Chemical / Polymer System Type: Epoxy (EP), Specialty / Other
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Description: Use with silver/lead electrode systems, excellent sintered density
- Material Type: Other
- Applications: Other
- Performance Features: Sintered / Fired
- Material Form: Ceramic / Inorganic
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Supplier: Quist Electronics
Description: Unreinforced construction, conformable, low hardness
- Material Type: Gap Filling Compound
- Industry: Electronics, Electrical Power / HV, Semiconductors / IC Packaging, OEM / Industrial, Other
- Features: Electrical Insulation / Dielectric, Flame Retardant (e.g. UL 94 Rated), UL Approved
- Chemical / Polymer System Type: Specialty / Other
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Supplier: Insaco, Inc.
Description: Zerodur® is a glass ceramic with an extremely low thermal expansion coefficient.
- Glass Type: Glass Ceramic
- Shape / Form: Fabricated / Custom Shape, Tube Stock, Specialty / Other
- Hollow Stock / Shape: Yes
- Applications: Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave
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Supplier: Master Bond, Inc.
Description: relatively low exotherm makes it an ideal material for large castings. In this regard it also possesses superior electrical insulation properties. The combination of high flexibility and lower exotherm helps prevent EP37-3FLF from stressing sensitive electronic components during cure. Also noteworthy
- Coating Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System, Specialty / Other
- Industry Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, OEM / Industrial
- Flexible / Dampening: Yes
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Supplier: ITT Under Sea Systems - Acoustic Sensors
Description: For hydrophones, receivers, low power projectors, micropositioning devices
- Material Type: Piezoelectric Ceramic
- Shape / Form: Fabricated / Custom Shape
- Applications: Dielectric / Electrical Insulation
- Performance Features: Metallized / Silvered
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Description: RTVS 3-95-1 is a low viscosity, thermally conductive RTV silicone compound, UL recognized under file E86165 for flame class 94V-0.
- Compound Type: Thermally Conductive
- Material Form: Die Bonding Adhesive / Compound, Conformal / Encapsulating Coating
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Quist Electronics
Description: Low "S-Class" thermal reistance at very low pressures
- Material Type: Gap Filling Compound
- Industry: Electronics, OEM / Industrial
- Features: Flame Retardant (e.g. UL 94 Rated), UL Approved
- Chemical / Polymer System Type: Specialty / Other
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Description: RTVS 27 LV is a low viscosity, general purpose, reversion resistant RTV Silicone Compound. RTVS 27 LV finds use in commercial potting/casting application. RTVS 27 LV's one-to-one ratio by weight or volume makes it ideal for dispensing equipment or unskilled labor. With the ability to cure rapidly
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Features: Electrical Insulation / Dielectric Material, Thermal / Heat Insulating
- Industry: Electronics
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Supplier: Piezo Technologies
Description: Modified Lead Zirconate Titanate ceramics is ideal when used in high frequency shear resonance applications. These PZT’s offer a high shear coupling coefficient, low permittivity and high temperature stability. Since this material has such a wide variety of uses in high frequency and high
- Applications: Other
- Piezoelectric / Electrostrictive Type: Lead Zirconate Titanate (PZT)
- Shape / Form: Fabricated / Custom Shape, Plate
- Material Type: Piezoelectric Ceramic
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Supplier: Protavic America, Inc.
Description: ANA-97173 is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (EB, Light), Two Component System
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Supplier: Epoxy Technology
Description: , glass, ceramic, kovar, and PCB. Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding. Passes NASA low outgassing standard ASTM E595 with proper cure - http://outgassing.nasa.gov/
- Form: Grease / Paste
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Electronics
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Supplier: Ellsworth Adhesives
Description: CONATHANE EN-20 is a two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin system. Gallon kit.
- Compound Type: Electrical Insulation / Dielectric
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Industry Applications: OEM / Industrial
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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
- Use: Die Bonding Adhesive / Compound
- Form: Grease / Paste
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Insaco, Inc.
Description: . Alumina is produced by firing a tightly packed powder form of Al2O3 which includes some binder material. Commercially available grades range from 90% up to 99.95% with the higher purity generating somewhat higher hardness. It is possible to machine alumina using diamond grinding techniques. Polishing
- Material Type: Alumina / Aluminum Oxide, Alumina-Zirconia, Specialty Ceramics
- Shape / Form: Fabricated / Custom Shape, Tube Stock
- Hollow Stock / Shape: Yes
- Applications: Structural, Wear Parts / Tooling, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperature Materials
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Supplier: ELANTAS PDG, Inc.
Description: Room-temperature or low heat cure trickle resin for motor armatures and stators
- Use: Impregnating Resin
- Form: Liquid
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Glotrax Polymers Inc.
Description: A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Industry: Electronics, OEM / Industrial
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Air Setting / Film Drying, Two Component System
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Thermal / Heat Conductive
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 921 is an addition curing RTV-2 silicone gel. Special Characteristics Low ion content Low volatile content Low viscosity Fast heat cure Good mechanical damping properties Application SEMICOSIL® 921 is a dielectric gel especially designed to seal, protect
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Features: Electrical Insulation / Dielectric Material, Flexible / Dampening
- Industry: Electronics
- Material Form: Polymer (Plastic / Elastomer)
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Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Use: Encapsulant / Potting Compound
- Form: Liquid
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Electronics
Find Suppliers by Category Top
Featured Products for Low Permittivity Material Top
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Radiall
NON-MAGNETIC MCX CONNECTORS SAVE SPACE IN MRI
use low permittivity materials to achieve a magnetic susceptibility of 10-5, about three orders of magnitude lower than brass/nickel connectors (10-2)-resulting in an extremely low distortion of the magnetic fields. The non-magnetic MCX line includes straight and right-angle board-mount receptacles and cable-mount plugs for RG-178 and RG-316 cable. Full-detent cable plugs for high-vibration environments. Plug connectors are available with limited or full detents. For high-vibration environments... (read more)
Browse RF and Microwave Connectors Datasheets for Radiall
Conduct Research Top
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Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications
for. miniaturization, while sufficiently low-magnetic loss can be in-. but magnetic materials for 2-D embedded planar antennas have. troduced for successful application at the targeted operating. not yet been successfully realized for standard use. As their. frequency. This magnetic composite shows the capability
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Development of Low Inductance High Power Plastic Case Capacitors For The SNS
, and the. materials used to achieve higher energy densities in low thickness of the layer is a few hundred Angstroms. The. average power applications, such as polyester (PET), tend. termination is almost always done by schooping (molten. to have higher dissipation factors. The ferroelectric metal
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Microwave Nondestructive Testing of Composite Materials using Free-Space Microwave Measurement Techniques
Microwave Nondestructive Testing (MNDT) techniques have advantages over other NDT methods (such as radiography, ultrasonics, and eddy current) regarding low cost, good penetration in nonmetallic materials, good resolution and contactless feature of the microwave sensor (antenna). For MNDT
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Enhanced High-Frequency LTCC for RF and Microwave Packaging (.pdf)
applications including advanced radar, antenna and filter applications. Recent work has shown that this material can also be successfully used to produce active devices that operate above 90 GHz.[1], [2]. The key attributes of A6M include its low and stable relative permittivity and low loss tangent
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Loss Tangent
current tan = | IR / IC | . The dielectric quality factor (Q) is equal the inverse of the loss tangent. High Q or low loss tangents are required to reduce insertion losses. Q = (average stored energy per cycle / energy dissipated per cycle)
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Soft Piezoelectric Ceramics
range or Curie temperature. Soft piezoelectric ceramics are used in various sensors, low-power motor-type transducers, receivers, and low power generators.
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Capacitor Engineering Bulletin: Polarization and Leakage Current Characterizations of High Voltage, Film Capacitors
materials and current conductors are highly stressed. The behavior of real capacitors deviates farthest from the ideal capacitor model during low-frequency transients such as during DC charging. This can impact the selection or design of compact charging power supplies, time delays between
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Recent Advances in High Voltage, High Energy Capacitor Technology (.pdf)
capacitors operating at about 5 kV, the packing. factor can be as high as 70-80%. In microsecond. Pulse power capacitors are generally high voltage, fast-. discharge capacitors the packing factor can be less than. discharge devices designed to have low inductance and. 50%. The relative permittivity
Engineering Web Search: Low Permittivity Material Top
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Permittivity - Wikipedia, the free encyclopedia
The linear permittivity of a homogeneous material is usually given relative to that of free space, as a relative permittivity ?r (also called
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Dielectric - Wikipedia, the free encyclopedia
Main article: permittivity The electric susceptibility ?e of
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ASTM D150 - 11 Standard Test Methods for AC Loss...
A low value of permittivity is thus desirable. Back to Electrical Insulating Material Standards
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ASTM D924 - 08 Standard Test Method for Dissipation Factor (or...
Back to Electrical Insulating Material Standards
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High permittivity tape transmission line supported by low...
High permittivity tape transmission line supported by low permittivity substrate at millimeter-wave frequencies
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A Generalized Formulation for Permittivity Extraction of...
A Generalized Formulation for Permittivity Extraction of Low-to-High-Loss Materials From Transmission Measurement
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PI Ceramic | Leader in Piezoelectric Actuator Technology, PZT...
PIC 152 is a PZT material whose permittivity has an especially low temperature coefficient.
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A microwave method based on amplitude-only reflection...
A microwave method based on amplitude-only reflection measurements for permittivity determination of low-loss materials
