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Supplier: OMEGA Engineering, Inc.
Description: • Measures Temperature of Solder Iron Tips • Low Cost • Use in Conjunction with any of OMEGA's Handheld readout units • Solder Temperature Tester to Ensure Quality Solder Joints
- Display Type: None - No Display
- Mounting Configuration: Other
- Additional Specifications: Detachable Probe(s)
Supplier: Wolverine Tube, Inc.
Description: , select SILVABRITE "S". Because of its cadmium free and lead-free composition, SILVABRITE is an approved and widely used alloy for the plumbing and building industries. Silver/Tin solders are low temperature, lead-freesolders that can be used on most ferrous and non-ferrous metals, including
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Preform, Wire
- Approvals / Conformance: ISO / EN
- Soldering Filler Alloys: Tin-Silver (Sn-Ag)
Supplier: Grainger Industrial Supply
Description: Check Valve, Low Lead,Spring,Material of Construction Bronze,Size 1 In.,Solder Connection,Length 1-29/32 In.,Width (In.) 1,Overall Height (In.) 3.53,Rated For 1/2psi/353 Degrees F,Cracking Pressure (PSI) .75 to 1,Max. Temp. (F) 353,Mounting Position With Pressure Coming from Under the Disc,Flow
- Material of Construction: Brass / Bronze
Supplier: Ironwood Electronics, Inc.
Description: These BGA surface mount feet present a female interface. We utilize blind pin technology to isolate our low temperature solder balls (63/37 PbSn) from the pins.
- Center Spacing: Gold Plating
- RoHS Compliant: Yes
- Product Type: Pin Probes
- Package Type: BGA, Other
Supplier: Indium Corporation
Description: Fusible Alloys include a group of binary, ternary, quaternary, and quinary alloys containing Bismuth, lead, tin, cadmium and indium. The term fusible alloy refers to any of the more than 100 white-metal alloys that melt at relatively low temperatures. Fusible alloys are materials that melt at less
- Form / Shape: Preform
Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot water rinse. Typical
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
Standards and Technical Documents - An Investigation Into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Alloy Solder Pastes for Electronics Manufacturing Applications -- APEXPO12-S16-3
Description: DESCRIPTION "An Investigation Into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Alloy Solder Pastes for Electronics Manufacturing Applications" explores various tests to qualify tin-bismuth and tin-bismuth-silver solder pastes as viable solders to be used in lead-free electronics
Supplier: Measurement Specialties, Inc.
Description: temperature solders. DT elements are supplied with a thin urethane coating over the active sensor area; the lead attachment legs are free of the insulating urethane coating. Features: Available in a variety of different sizes and thicknesses Produces more than 10 millivolts per microstrain. Simplest
Supplier: OK International, Inc.
Description: at low temperatures Reduces your maintainence costs No calibration makes ISO 9000 compliance easy
- Equipment Type: Soldering Equipment
- Equipment Type: Complete System
- Brazing & Soldering: Rework / Desoldering
- Features & Technology: Self-Regulating Tip
Supplier: Status Instruments, Inc.
Description: The SEM104 series are low cost 4-20mA temperature sensor transmitters housed in a head mount DIN standard connector block. Available for RTD or Thermocouple inputs the SEM104 is field rangeable if necessary by solder links on the printed circuit board and the use of on board SPAN and ZERO
- Thermocouple: J, K, T
- Mounting: Thermohead / Thermowell Mounting
- Output: Analog Current (e.g., 4-20 mA)
- Sensor Connection: Lead Wires
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Featured Products for Low Temperature Solder Top
Low Temperature Alloys - Soldering 101
to offering many desirable physical properties (malleability, ductility, fatigue resistance. etc.), indium alloys offer relatively low melting points. Some of the more popular solder alloys are: 52In 48Sn (Indalloy 1E) 118C Eutectic. 50In 50Sn (Indalloy 1) 125C Liquidus. 97In 3Ag (Indalloy 290) 143C Eutectic. 80In 15Pb 5Ag (Indalloy 164) 154C Liquidus. 99.99 Indium (Indalloy 4) 157C Melting Point. 70In 30Pb (Indalloy 204) 175C Liquidus. 50In 50Pb (Indalloy 7) 210C Liquidus. Another low... (read more)
Browse Solder Datasheets for Indium Corporation
LOCTITE MULTICORE HF 212 Halogen-Free Solder Paste
Henkel ’s Loctite HF 212 solder paste is designed for applications that require a halogen free solution. Solderability on challenging surface finishes is excellent for both high reliability and high temperature (low Ag) alloys. Product Description. Henkel ’s Loctite HF 212 is a halogen-free, no clean, high tack, low voiding Pb-free solder paste designed for medium-large size boards. Excellent abandon time and stencil work-life down to 0.3mm pitch. HF 212 is suitable for open blade... (read more)
Browse Solder Datasheets for Ellsworth Adhesives
BVT Precision Low-Ohmic Resistor
55 to +170 °C due to special design - Max. solder temperature up to 350 °C / 30 sec - AEC-Q200 qualification... (read more)
Browse Current Sensing Resistors Datasheets for ISOTEK Corporation
BVS Precision Low-Ohmic Resistor
BVS "3920". ISA-WELD ® technology, two terminal SMD. Used in power hybrid applications, Frequency converters, Power modules, High current applications for the automotive market. Features - 5 W permanent power* - Continuous current load up to 160 A (0.2 mOhm) - Heavy copper connectors - Excellent long term stability - Ideal suited for mounting on DBC / IMS substrate - Max. solder temperature up to 350 °C / 30 sec - AEC-Q200 qualification (read more)
Browse Current Sensing Resistors Datasheets for ISOTEK Corporation
Conduct Research Top
Solder Powder: IPC
and Particles. Sputtering Target Bonding. Reclaim and Recycle. Solder and Solder Dross Recycle Program. Solar Assembly Materials. Metallization Paste. SUNTABTM PV Ribbon. Liquid Tabbing Flux. Solders. Solder Paste and Powders. SACMTM. Indium8.9 Series. Lead-Free. Tin-Lead. Package-on-Package Paste. Low
Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)
the bondline and time after reac-. the individual target and backing plate. tion initiation . Because the Nano-. in separate operations. Any low-melting Figure 2. Schematic representation of a Nano- Foil reaches a maximum temperature. solder can be used with standard Nano-. Bond. . of about 1500ºC
Flow Solder Machines
position feedback from highly accurate, continuous, absolute output. * Low temperature coefficient for stable output with varying operational temperature. * Superior EMI and noise immunity ensure trouble free operation in a wide range of applications. * Simultaneous multiple position sensing
Adding Solder to a NanoBond(R) Assembly
. Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification(R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification(R). Spheres. Tape and Reel Packaging
Humidity and Solder Paste - Avoid Issues
. Sputtering Target Bonding. Reclaim and Recycle. Solder and Solder Dross Recycle Program. Solar Assembly Materials. Metallization Paste. SUNTABTM PV Ribbon. Liquid Tabbing Flux. Solders. Solder Paste and Powders. SACMTM. Indium8.9 Series. Lead-Free. Tin-Lead. Package-on-Package Paste. Low Temp/High
High Melting Lead-Free Mixed BiAgX Solder Paste System
of the high-temperature lead-free. substitute solders , have a liquidus temperature above. Directly alloying Sn into BiAg could cause a low melting. 300°C while the solidus temperature is around 200°C. The. phase (BiSn) if Sn is excessive and/or cause the complete. pasty state of the ZnSn solder around 260°C may
Low Pass Filter Mounting Information
ASSEMBLY CONSIDERATION Solder paste type 3 Use 0.005 inch stencil thickness Nitrogen purge is recommended during solder reflow This is a lead free part. A low temperature, leaded solder profile is shown. A lead free profile may be used. This is a recommendation based on third party testing. Each
Temperature Sensing Technologies
microcontroller interface circuits. These cir-. cuits will offer the complete signal path from the low level. output signals of the sensor, through the analog signal. conditioning stages to the microcontroller. Techniques. such as sensor excitation, sensor signal gain, and digital. linearization
Engineering Web Search: Low Temperature Solder Top
Solder - Wikipedia, the free encyclopedia
Solder From Wikipedia, the free encyclopedia
Epoxy - Wikipedia, the free encyclopedia
a highly crosslinked polymer network displaying high temperature and chemical resistance, but low flexibility.
SEMIKRON leading manufacturer of igbt, diode thyristor power...
Low temperature sinter technology Die attachment for automotive power electronic applications C. G?bl1, P. Beckedahl2, H. Braml3 1: SEMIKRON
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Ultra-low impedance down to 0.035 ? for better filtering
- Omron Electronic Components - G6A-274P-ST-US-DC24 -...
AD8605 | Precision, Low Noise, CMOS, Rail-to-Rail,...
Temperature Sensing and Thermal Management Temperature to Digital Converters Touchscreen Controllers