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Parts by Number for Low Temperature Solder Top

Part # Distributor Manufacturer Product Category Description
B-150-07 Allied Electronics, Inc. TYCO ELECTRONICS RAYCHEM Not Provided SOLDER SLEEVE DEVICE LOW FIRE HAZARD SHIELD TERMINATION LOW TEMPERATURE
31-10-RFX RS Electronics Amphenol Distr Div Not Provided BNC connector 50 Ohm Bulkhead Front Mount Isolated from Panel Receptacle with Solder Cup termination. Temperature range -65 degrees C to +165 degrees C. Commercial grade, meaning low cost and typically utilizes diecast and molded components.
31-221-RFX RS Electronics Amphenol Distr Div Not Provided BNC connector 50 Ohm Bulkhead Front Mount-1.06 inch long Receptacle with Solder Cup termination. Temperature range -65 degrees C to +165 degrees C. Commercial grade, meaning low cost and typically utilizes diecast and molded components.

Conduct Research Top

  • Solder Powder: IPC
    . Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste
  • Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)
    the bondline and time after reac-. the individual target and backing plate. tion initiation [5]. Because the Nano-. in separate operations. Any low-melting Figure 2. Schematic representation of a Nano- Foil reaches a maximum temperature. solder can be used with standard Nano-. Bond. [5]. of about 1500ºC
  • Flow Solder Machines
    position feedback from highly accurate, continuous, absolute output. * Low temperature coefficient for stable output with varying operational temperature. * Superior EMI and noise immunity ensure trouble free operation in a wide range of applications. * Simultaneous multiple position sensing
  • Adding Solder to a NanoBond (R) Assembly
    . Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel
  • Humidity and Solder Paste - Avoid Issues
    and Particles. Sputtering Target Bonding. Reclaim and Recycle. Solder and Solder Dross Recycle Program. Solar Assembly Materials. Metallization Paste. SUNTAB TM PV Ribbon. Liquid Tabbing Flux. Solders. Solder Paste and Powders. SACM TM. Indium8.9 Series. Lead-Free. Tin-Lead. Package-on-Package Paste. Low Temp
  • High Melting Lead-Free Mixed BiAgX Solder Paste System
    of the high-temperature lead-free. substitute solders [3], have a liquidus temperature above. Directly alloying Sn into BiAg could cause a low melting. 300°C while the solidus temperature is around 200°C. The. phase (BiSn) if Sn is excessive and/or cause the complete. pasty state of the ZnSn solder around 260°C may
  • Low Pass Filter Mounting Information
    ASSEMBLY CONSIDERATION Solder paste type 3 Use 0.005 inch stencil thickness Nitrogen purge is recommended during solder reflow This is a lead free part. A low temperature, leaded solder profile is shown. A lead free profile may be used. This is a recommendation based on third party testing. Each
  • Temperature Sensing Technologies
    microcontroller interface circuits. These cir-. cuits will offer the complete signal path from the low level. output signals of the sensor, through the analog signal. conditioning stages to the microcontroller. Techniques. such as sensor excitation, sensor signal gain, and digital. linearization are reserved
  • Crimp vs Solder: Pros and Cons
    offers several advantages for connectorization. PREFERRED. Solder around joint is smooth and shiny. No evidence of solder flow outside joint region. Solder hole is filled flush with outside pin surface. Tooling is simple: the main tool is a low-wattage solder iron with an assortment of tips
  • A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
    . A Room Temperature Low Stress Bonding Process for Sputtering Target Assembly Indium Corporation Tech Paper. A Room Temperature, Low-Stress Bonding. Process to Reduce the Impact of Use Stress. on a Sputtering Target Assembly. Authored by: Amanda Hartnett, Jacques Matteau, Ronnie Spraker

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