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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
B-150-07 Allied Electronics, Inc. TYCO ELECTRONICS RAYCHEM Not Provided SOLDER SLEEVE DEVICE LOW FIRE HAZARD SHIELD TERMINATION LOW TEMPERATURE
31-10-RFX RS Electronics Amphenol Distr Div Not Provided BNC connector 50 Ohm Bulkhead Front Mount Isolated from Panel Receptacle with Solder Cup termination. Temperature range -65 degrees C to +165 degrees C. Commercial grade, meaning low cost and typically utilizes diecast and molded components.
31-221-RFX RS Electronics Amphenol Distr Div Not Provided BNC connector 50 Ohm Bulkhead Front Mount-1.06 inch long Receptacle with Solder Cup termination. Temperature range -65 degrees C to +165 degrees C. Commercial grade, meaning low cost and typically utilizes diecast and molded components.

Conduct Research Top

  • Flow Solder Machines
    position feedback from highly accurate, continuous, absolute output. * Low temperature coefficient for stable output with varying operational temperature. * Superior EMI and noise immunity ensure trouble free operation in a wide range of applications. * Simultaneous multiple position sensing
  • Low Pass Filter Mounting Information
    ASSEMBLY CONSIDERATION Solder paste type 3 Use 0.005 inch stencil thickness Nitrogen purge is recommended during solder reflow This is a lead free part. A low temperature, leaded solder profile is shown. A lead free profile may be used. This is a recommendation based on third party testing. Each
  • Soldering Processes
    characteristics. Tin-silver alloys have the same characteristics as tin-antimony solders and are used for delicate instrument work and high-strength applications. Tin-zinc alloys are used mainly for soldering aluminum -- primarily where a low soldering temperature is
  • Lead
    journal bearings and piston-engine crank bearings. Lead is also widely used as a constituent in solders. Most common solders are the lead-tin alloys; melting temperature can be as low as 361 F. In its unalloyed form (defined by ASTM B29 as 99.85% minimum lead), lead is soft and weak; it requires
  • Metals and Ceramics
    -to-ceramic bonds. Seals between metals and glass can be made by collapsing a low-temperature glass around the glass/metal interface. As the intermediary glass is acting as a solder it is referred to as "solder glass. " There are four techniques for metallizing ceramics that rely on strong chemical
  • Tin
    Tin is characterized by a low-melting point (450 F), fluidity when molten, readiness to form alloys with other metals, relative softness, and good formability. The metal is nontoxic, solderable, and has a high boiling point. The temperature range between melting and boiling points exceeds

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