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Product Announcements
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Bergquist Sil Pad 900S High Performance Insulator
Quist Electronics Durable Thermal Adhesive Cures at 20°F Master Bond, Inc. Best in Class Thermal Stability Arlon LLC - Silicone Technologies Division Bergquist Sil Pad 1500T Thermally Conductive Quist Electronics No-cure, 1-part Thermal Paste (Grease) TAICA Corporation (formerly Geltec Co., Ltd.) Pyrolytic Graphite PYROID® MINTEQ® International Inc, Pyrogenics Group |
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Phase Change Memory advanced electrical characterization for... Conference on Microelectronic Test Structures Conference Title: 2012 IEEE International Conference on Microelectronic Test Structures (ICMTS) Item |
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Highly automated sequence for Phase Change Memory test... Conference on Microelectronic Test Structures (ICMTS) Conference Title: 2010 International Conference on Microelectronic Test Structures (ICMTS) Item |
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Phase change memory alloys: GST cell array characterization... M. Zhang Abstract: alloy (GST) is the most widely used chalcogenide material for PCM application, and has many unique properties, including strong |
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Unified mechanisms for structural relaxation and... A. Redaelli, A. Pirovano Abstract: Data retention in phase-change memory (PCM) devices is the result of two physical phenomena: structural relaxation |
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Internships - Micron Technology, Inc. Phase Change Memory Serial PCM Parallel PCM PCM Software MCP MCP Multichip Packages See Micron Technology, Inc. Information |
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Photochemical Machining ? Precision Metal Parts ?... Microelectronic Lid Product Division Etched Leadframe Division See Photofabrication Engineering, Inc. (PEI) Profile & Catalog |
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Photochemical Maching Process - Our PCM Process - PEI Microelectronic Lid Product Division Etched Leadframe Division The photochemical machining (PCM) process consists of several important steps. See Photofabrication Engineering, Inc. (PEI) Profile & Catalog |
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CALCE EPSC Graduate Student Theses the stresses seen by the package during the reflow and guide modeling, material selection, and process improvement efforts. See Center for Advanced Life Cycle Engineering (CALCE) Information |
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CALCE EPSC Graduate Student Theses Plastic molding compounds have become the leading encapsulating materials in today's microelectronic packaging industry. See Center for Advanced Life Cycle Engineering (CALCE) Information |
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In array patent application class 257002000 - Bulk effect switching in amorphous material |