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Amplifier and Comparator Chips - 1.7 – 2.7 GHz Dual-Channel, Variable Gain Amplifier Front-End Module -- SKY65185
Description: is a 6-bit attenuator with an 0.5 dB step size that provides 31.5 dB of total attenuation. The DSA is controlled using an on-chip Serial Peripheral Interface (SPI) logic circuit. The SKY65185 is provided in a 32-pin, 7 x 7 mm Multi-Chip Module (MCM) package, which allows for a highly manufacturable low
- Device Type: Variable Gain Amplifiers
- Package Type: Other
GPS Chips and Modules - Low-Noise Amplifier Front-End Module with GPS/GNSS Pre-Filter -- SKY65702-11
Description: of a 2.5 x 2.0 mm Multi-Chip Module (MCM) package, which allows for a highly manufacturable and low-cost solution.
- IC Package Type: Other
Description: Compression Point (IP1dB), and a superior noise figure (NF). The GPS pre-filter provides the low in-band insertion loss for excellent rejections of the cellular and WLAN frequency bands. The SKY65713-11 uses surface mount technology (SMT) in the form of a 1.1 x 1.5 mm Multi-Chip Module (MCM) package, which
- Amplifier Type: Low Noise Amplifier
- Applications: Mobile / Wireless Systems
- Maximum Gain: 16.5 dB
- Noise Figure: 1.6 dB
Description: of an SP9T switch, GSM transmit signal low-pass harmonic filters, and a GPIO controller. The low current consumption makes this device very suitable for battery operated applications. The SKY18108-11 is manufactured in a compact, 3.2 x 2.5 mm, 20-pin Multi-Chip Module (MCM) package.
- Frequency Range: 4.00E8 to 2.70E9 Hz
- Actuator Type: Other
- Package Type: Surface Mount
Description: is mounted in a 28-pin, 6 x 6 mm Multi-Chip Module (MCM) surface-mount technology (SMT) package, which allows for a highly manufacturable low-cost solution. Transmit output power > +30 dBm High-efficiency PA Analog power control Integrated control logic Internal RF match and bias circuits All
- Interface: Other
- Device Type: Receiver, Transmitter, Other
- Supply Voltage: Other
- IC Package Type: Other
Description: down is achieved by setting the VEN pin to 0 V. No external supply side switch is needed since typical “off” leakage is a few microamps with full primary voltage supplied from the main power supply. The SKY66002-11 is packaged in a 10-pin, 3 x 3 mm Multi-Chip Module (MCM), which allows
Supplier: Qorvo (TriQuint + RFMD)
Description: the typical P1dB is over 13 dBm. The small size of 2.46 mm² allows ease of compaction into Multi Chip Modules (MCMs). The TGA2512 is 100% DC and RF tested on-wafer to ensure performance compliance. The part is lead-free and RoHS compliant. Product Features Typical frequency range: 5 to 15 GHz 1.4
- Supply Voltage (VS): 5 volts
- Quiescent Current (IQ): 0.1600 amps
- Life Cycle Stage: Maturity
RF Switches - 0.6-2.7 GHz DP12T (SP7T/SP5T) Receive Diversity Switch with MIPI RFFE Interface for Carrier Aggregation -- SKY13484
Description: are required on the RF paths as long as no DC voltage is applied to those paths. The SKY13484 is manufactured in a compact, 2.5 x 2.9 x 0.8 mm, 22-pin surface mount Multi-Chip Module (MCM) package.
Description: for GSM/EDGE base stations. The SKY73089-11 is manufactured using a robust silicon BiCMOS process and has been designed for optimum long-term reliability. The SKY73089-11 diversity downconversion mixer is provided in a compact, 36-pin Multi-Chip Module (MCM).
- Package Type: Surface Mount Technology (SMT)
- RF Frequency Range: 1.20E9 to 1.70E9 Hz
- IF Frequency Range: 5.00E7 to 5.00E8 Hz
Standards and Technical Documents - Field-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components -- IEC PAS 62162:2000
Description: Describes a uniform method for establishing charged-device model (CDM) electrostatic discharge (ESD) withstand thresholds. All packages semiconductor components, thin film circuits, surface acoustic wave (SAW) components, opto-electronic components, hybrid integrated circuits (HICS), and multi-chip
Description: Maxwell Technologies’ 79C2040 multi-chip module (MCM) memory features a greater than 100 krad (Si) total dose tolerance, dependent upon orbit. Using Maxwell Technologies’ patented radiation-hardened RAD-PAK® MCM packaging technology, the 79C2040 is the first radiation-hardened 20
- Memory Category: DRAM
- Density: 1.28E9 bits
- Bits per Word: 40 bits
- IC Package Type: Other
Description: Maxwell Technologies’ 89LV1632 high-performance 16 Megabit Multi-Chip Module (MCM) Static Random Access Memory features a greater than 100 krad(Si) total dose tolerance, depending upon space mission. The four 4-Megabit SRAM die and bypass capacitors are incorporated into a high-reliable
- Memory Category: SRAM
- Density: 1.60E7 bits
- Number of Words: 512 k
- Bits per Word: 32 bits
Description: Maxwell Technologies’ 27C1512T high density 512K OneTime Programmable Electrically Programmable Read Only Memory multi-chip module (MCM) features a greater than 100 krad (Si) total dose tolerance, depending upon space mission. The 27C1512T features fast address times and low power dissipation
- Memory Category: EPROM
- Density: 512000 bits
- Number of Words: 32 k
- Bits per Word: 16 bits
Description: Maxwell Technologies’ 79C0832 multi-chip module (MCM) memory features a greater than 100 krad (Si) total dose tolerance, dependent upon orbit. Using Maxwell Technologies’ patented radiation-hardened RAD-PAK® MCM packaging technology, the 79C0832 is the first radiation-hardened 8
- Memory Category: EEPROM
- Density: 8.00E6 bits
- Number of Words: 256 k
- Bits per Word: 32 bits
Description: Maxwell Technologies’ 81840 high-performance 128-channel multiplexer features a typical 300 krad (Si) total dose tolerance. This datasheet defines the design, performance, and test requirements for a hermetic, telemetry multiplexer, multi-chip-module (MCM), utilizing chip and wire technology
- Configuration: Other
- Applications: Avionics, Military
- Supply Voltage (VS): -15 to 15 volts
- Operating Ambient Temperature: -67 to 257 F
Supplier: Airbus Group
Description: Floating point DSP processor in MCM single package This module is based on 21020F DSP based core for embedded applications. It is an opened architecture that can be cascaded in large system thanks to 1355 high-speed links. It is a QFP mono-cavity Multi Chip Module, designed in a radiation
- Supply Voltage: 5 V
- Package Type: Other
- Clock Speed: 1.50E7 to 2.00E7 Hz
- MFLOPS: 30 to 40
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Custom Sensors and Assemblies for Life Sciences
is prominent in many industries: Industries. Silicon, III-V compound device design & fabrication. Optics assembly design. Hybrid Circuit and Multi-chip Module (MCM) design. Thick and Thin Film; Single and Double Sided Ceramic Design. Electro-Mechanical Assembly. . . Analytical & Clinical Chemistry / BioTechnology. Of numerous applications in the life sciences, fluorescence detection is where our sensors excel. In fluorescence microscopy of tissues and cells and automated... (read more)
Browse Electronic Manufacturing Services (EMS) Datasheets for OSI Optoelectronics
Hi-rel, hi-temp modules from MS Kennedy & Cissoid
of expertise in developing complex high-quality/high-reliability multichip module solutions. Collaboration between the companies will address packaging multiple ICs into new, integrated, and highly compact standard multi-chip module products. Products introduced jointly will address new, high-temperature applications enabling customers to quickly develop their own solutions and reduce time to market. The first jointly developed standard product will be based on Cissoid ’s HADES ® V2... (read more)
Browse Datasheets for Anaren, Inc.
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Computer Power User Article - Video Cards Exposed
of three ways: discrete (as a separate part from the chipset and video memory), MCM (Multi-Chip Module, with memory packaged onto one chip alongside the graphics core), and fully integrated (where the graphics core is built
Highly integrated CMOS RF SPDT switch with ESD and unit cell optimisation in MCM
Presented is the performance of a highly integrated RF single-pole double-throw (SPDT) switch fabricated in a 0.18 µm bulk CMOS. process and housed in a low-cost laminated multi-chip module (MCML) package. A switch controller is also implemented and consumes. ~40 µA from a 3.4 V supply. The switch
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Advanced Microsystems for Automotive Applications 2003
… Local Interconnect Network (LIN) 457, 509 Long-term measurements 323 Long range radar 431 Low Temperature Cofired Ceramics (LTCC) substrate 323 Low-g 349 LTCC ( Low Temperature Cofired Ceramics) substrate 323 MATCH-X 21 MCM ( Multi Chip Module ) 271, 457 Mechanical planarization …
Research on Mechanics, Dynamic Systems and Material Engineering
The design of box was setting of multi-functional structure, its main function is not only supporting high density assembly of flexible circuit board (FPC), and protecting the flexible circuit board MCM multi chip module , but also have the high power device …
A microinstrumentation system for industrial applications
The system is composed of an universal platform which is to be populated with the required sensors, microactuators and a microcontroller using MCM ( Multi Chip Module ) techniques, to solve a particular measurement problem.
International Air and Space Symposium (Evolution of Flight) > Low Cost User Terminals and Infrastructure
The assemble cost can be further reduced by using the MCM ( Multi Chip Module ) approach.
Mosaic near-infrared focal plane array
cSP (chip size package or chip scale package) and MCM ( multi chip module ) are recent technologies to achieve high density packaging for small instruments of commercial use.
Micromachining in silicon for passive alignment of optical fibers
MCM ( Multi Chip Module ) techniques are developed that make use of 3-dimensional packaging in order to obtain size reduction and shorter connections for higher speed applications.
DESIGN AND ANALYSIS OF AN INTEGRATED PULSE MODULATED S-BAND POWER AMPLIFIER IN GALLIUM NITRIDE PROCESS
Ground returns should be on planes and in the case of multilayered MCMs ( Multi Chip Modules ) there should be separate ground planes for analog, digital and rf grounds.
Ku-band MMIC's in low-cost, SMT compatible packages
This approach can also apply to MCM ( Multi Chip Module ) for fiuther reduction of the size and cost.
NEC Cenju-3: a microprocessor-based parallel computer
The VR4400 CPU and 1MB secondary cache SRAMs are mounted on an MCM ( Multi Chip Module ).
Flip chip MPU module on high performance printed circuit board “ALIVH”
Keywords: SBBTMtechnique, ALIVHTM, MCM ( Multi Chip Module ), MPU (Micro Processor Unit .
Layout syntheses of electronic circuits - Fundamental algorithms for the design automation
MCM ( multi chip modules ) MESFET (Metal semiconductor field-effect transistor) MIPS (million instructions per second) MOS (Metal oxides semiconductor) OPC (Optical proximity of correction .
Electronics for engineers and natural scientists
… 554 Mask ROM 473 mask 320, 322 measures, effective 58 mass plane 505 Masse core 131 mass storages 471 master-Slave-flip-flop 513 matrix 527, storage 473, -, 527 Verkniipfungs- maximum lasting voltage 97 MCM ( multi chip module ) 314 MDI (medium Dependent …
Advanced Ceramic Technologies & Products
The LTCC was first commercialized as the MCM ( Multi Chip Module ) used in supercomputers, whose development began in the 1970s.
Interaction of Photons with Polymers: From Surface Modification to Ablation
Polymer metallization is one important technical pro- cess which is employed in microelectronics packaging and MCM ( Multi Chip Module ) technology, as well as in the production of decorative overlayers, diffusion barriers, and electromagnetic shielding.