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Description: , RoHS-compliant Multi-Chip Module (MCM).
GPS Chips and Modules - Low-Noise Amplifier Front-End Module with GPS/GNSS Pre-Filter -- SKY65708-51
Description: Mount Technology (SMT) in the form of a 1.7 x 2.3 mm Multi-Chip Module (MCM) package, which allows for a highly manufacturable and low-cost solution. For applications that require additional rejection for the LTE Band 13, Skyworks SKY65708-11 is the ideal solution.
- IC Package Type: Other
Description: applications. The SKY18105 is provided in a compact 4.5 x 4.5 mm Multi-Chip Module (MCM) package.
- Form Factor / Package: Surface Mount Technology (SMT)
Amplifier and Comparator Chips - 330 – 2700 MHz Dual-Channel, Variable Gain Amplifier Front-End Module -- SKY65186-11
Description: ). The DSA is a 6-bit attenuator with an 0.5 dB step size that provides 31.5 dB of total attenuation. The DSA is controlled using an on-chip Serial Peripheral Interface (SPI) logic circuit. The SKY65186-11 is provided in a 32-pin, 7 x 7 mm Multi-Chip Module (MCM) package, which allows for a highly
- Device Type: Variable Gain Amplifiers
- Package Type: Other
Description: of an SP9T switch, GSM transmit signal low-pass harmonic filters, and a GPIO controller. The low current consumption makes this device very suitable for battery operated applications. The SKY18108-11 is manufactured in a compact, 3.2 x 2.5 mm, 20-pin Multi-Chip Module (MCM) package.
- Frequency Range: 4.00E8 to 2.70E9 Hz
- Actuator Type: Other
- Package Type: Surface Mount
Description: down is achieved by setting the VEN pin to 0 V. No external supply side switch is needed since typical “off” leakage is a few microamps with full primary voltage supplied from the main power supply. The SKY66002-11 is packaged in a 10-pin, 3 x 3 mm Multi-Chip Module (MCM), which allows
Description: Indium Gallium Phosphide (InGaP) Heterojunction Bipolar Transistor (HBT) technology. The device is internally matched and mounted in a 4 x 4 mm, Multi-Chip Module (MCM) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution.
- Amplifier Type: Power Amplifier
- Applications: Mobile / Wireless Systems
- Frequency Range: 2.40E9 to 2.50E9 Hz
- Minimum Gain: 26 dB
RF Mixers - 1700-2000 MHz Diversity Downconversion Mixer with Integrated Integer-N PLL and VCO -- SKY73212-11
Description: a robust silicon BiCMOS process. The device has been designed for optimum long-term reliability. It is manufactured in a compact, 44-pin 10 x 6 mm Multi-Chip Module (MCM).
- Package Type: Surface Mount Technology (SMT)
- IF Frequency Range: 4.00E7 to 3.00E8 Hz
RF Switches - 0.6-2.7 GHz DP12T (SP7T/SP5T) Receive Diversity Switch with MIPI RFFE Interface for Carrier Aggregation -- SKY13484
Description: are required on the RF paths as long as no DC voltage is applied to those paths. The SKY13484 is manufactured in a compact, 2.5 x 2.9 x 0.8 mm, 22-pin surface mount Multi-Chip Module (MCM) package.
Description: in a compact, 38-pin Multi-Chip Module (MCM).
- Frequency Range: 1.93E9 to 1.99E9 Hz
Supplier: Maxwell Technologies, Inc.
Description: Maxwell Technologies’ 79C2040 multi-chip module (MCM) memory features a greater than 100 krad (Si) total dose tolerance, dependent upon orbit. Using Maxwell Technologies’ patented radiation-hardened RAD-PAK® MCM packaging technology, the 79C2040 is the first radiation-hardened 20
Supplier: Maxwell Technologies, Inc.
Description: Maxwell Technologies’ 81840 high-performance 128-channel multiplexer features a typical 300 krad (Si) total dose tolerance. This datasheet defines the design, performance, and test requirements for a hermetic, telemetry multiplexer, multi-chip-module (MCM), utilizing chip and wire technology
- Configuration: Other
- Applications: Avionics, Military
- Supply Voltage (VS): -15 to 15 volts
- Operating Ambient Temperature: -67 to 257 F
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Featured Products for MCM Multi Chip Module Top
Hi-rel, hi-temp modules from MS Kennedy & Cissoid
of expertise in developing complex high-quality/high-reliability multichip module solutions. Collaboration between the companies will address packaging multiple ICs into new, integrated, and highly compact standard multi-chip module products. Products introduced jointly will address new, high-temperature applications enabling customers to quickly develop their own solutions and reduce time to market. The first jointly developed standard product will be based on Cissoid ’s HADES ® V2... (read more)
Browse Datasheets for Anaren, Inc.
Custom Sensors and Assemblies for Life Sciences
is prominent in many industries: Industries. Silicon, III-V compound device design & fabrication. Optics assembly design. Hybrid Circuit and Multi-chip Module (MCM) design. Thick and Thin Film; Single and Double Sided Ceramic Design. Electro-Mechanical Assembly. . . Analytical & Clinical Chemistry / BioTechnology. Of numerous applications in the life sciences, fluorescence detection is where our sensors excel. In fluorescence microscopy of tissues and cells and automated... (read more)
Browse Electronic Manufacturing Services (EMS) Datasheets for OSI Optoelectronics
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Computer Power User Article - Video Cards Exposed
of three ways: discrete (as a separate part from the chipset and video memory), MCM (Multi-Chip Module, with memory packaged onto one chip alongside the graphics core), and fully integrated (where the graphics core is built
Recent Progress in III-V Devices and Modules for Next Generation Mobile Handsets
of SOC, die. stacking and/or MCM technology or system in a package (SiP) approaches provide alternative solutions to the. problem of incorporating various RF functions, if such advanced packaging solutions are readily available at low cost. Using our internal state-of-the-art production assembly
Highly integrated CMOS RF SPDT switch with ESD and unit cell optimisation in MCM
Presented is the performance of a highly integrated RF single-pole double-throw (SPDT) switch fabricated in a 0.18 µm bulk CMOS. process and housed in a low-cost laminated multi-chip module (MCML) package. A switch controller is also implemented and consumes. ~40 µA from a 3.4 V supply. The switch
Phase Locked Loop Systems Design for Wireless Infrastructure Applications
with lower cost and smaller package size. Figure 3 Phase noise characteristics 1.5 to 2.4 GHz CMOS cross-coupled vs. discrete BJT. Type 2 is based on multi chip module (MCM). This type has a few dies as well as discrete components on a. substrate. The die include VCO, PLL and varactors, while discrete
High performances MEMS accelerometers are used in railway applications
the resolution range of 20 to. The basic structure of the acceleration. multi chip module (MCM) approach. 24 bits and beyond in the future. detector is constituted of a proof. combining the MEMS device and. mass with a surface of few mm2 and. electronics in a hermetically sealed. conclusion. a thickness
MEMS Motion Sensors, the Solution for Harsh Environments in Defence Applications
conditions. devices, robustness, power and size. critical for high precision under harsh. in the Mil Aerospace, Industrial,. environments. Colibrys has chosen a. Instrumentation and Energy markets. n. Technology. multi chip module (MCM) approach. The three key ingredients needed to. combining
Is Smaller Better?
by which the devices may be directly connected to the substrate of a multi chip. module (MCM) or to a printed circuit board. Their parasitic reactances are very small, due to the. absence of a package. Thermal resistance is low, since there are substantial thermal paths from the. diode junction
Increasing the Maximum Transmit Power Rating of a Power Amplifier Using a Power Combining Technique
, and board layout. A narrow band splitter/combiner can easily achieve less than a 5 degree phase imbalance while the PA contribution (such as with. the SKY65152-11) is fairly small when the input/output matching is integrated within a multi chip module (MCM). Eventually, the RF. designer should pay
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Advanced Microsystems for Automotive Applications 2003
...Local Interconnect Network (LIN) 457, 509 Long-term measurements 323 Long range radar 431 Low Temperature Cofired Ceramics (LTCC) substrate 323 Low-g 349 LTCC ( Low Temperature Cofired Ceramics) substrate 323 MATCH-X 21 MCM ( Multi Chip Module ) 271, 457 Mechanical planarization...
A microinstrumentation system for industrial applications
The system is composed of an universal platform which is to be populated with the required sensors, microactuators and a microcontroller using MCM ( Multi Chip Module ) techniques, to solve a particular measurement problem.
International Air and Space Symposium (Evolution of Flight) > Low Cost User Terminals and Infrastructure
The assemble cost can be further reduced by using the MCM ( Multi Chip Module ) approach.
Mosaic near-infrared focal plane array
cSP (chip size package or chip scale package) and MCM ( multi chip module ) are recent technologies to achieve high density packaging for small instruments of commercial use.
Micromachining in silicon for passive alignment of optical fibers
MCM ( Multi Chip Module ) techniques are developed that make use of 3-dimensional packaging in order to obtain size reduction and shorter connections for higher speed applications.
DESIGN AND ANALYSIS OF AN INTEGRATED PULSE MODULATED S-BAND POWER AMPLIFIER IN GALLIUM NITRIDE PROCESS
Ground returns should be on planes and in the case of multilayered MCMs ( Multi Chip Modules ) there should be separate ground planes for analog, digital and rf grounds.
Ku-band MMIC's in low-cost, SMT compatible packages
This approach can also apply to MCM ( Multi Chip Module ) for fiuther reduction of the size and cost.
NEC Cenju-3: a microprocessor-based parallel computer
The VR4400 CPU and 1MB secondary cache SRAMs are mounted on an MCM ( Multi Chip Module ).