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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
600MCM4ALCU PLC Radwell Buchanan Panel Accessories, Terminal Blk/Strip Wiring Dev TERMINAL BLOCK ULTRA HEAVY DUTY 600MCM 4AWG
PLF1MC-M Digi-Key Panduit Corp Cables, Wires - Management MARKER TIE FLAG 4.3L 109MM MINI
24-6337-9713 Newark / element14 MCM Not Provided MCM - 24-6337-9713 - SOLDER WIRE; 63/37 SN/PB; 183 °C; 1LB
21-3230 Newark / element14 MCM Not Provided MCM - 21-3230 - WIRE TIE TENSIONING TOOLS
22-540 Newark / element14 MCM Not Provided MCM - 22-540 - SHEAR WIRE CUTTER
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Conduct Research Top

  • Screw Clamps
    Screw clamp technology has been integrated into many other functional terminal blocks including fuse holders, electronic component holders, signal conditioning modules, surge protection modules, and more. Screw clamp technology offers the widest range of products for 24 AWG to 600 MCM wire
  • Minimizing Materials & Costs with Exothermic Welding
    ground resistance monitoring product, the GRM2000, which addresses concerns on operator safety and system efficiency. Often in grounding grids it is common to see main grounding conductors sized at 250 mcm or larger. When wire sizes are at this level or larger, it may become difficult and expensive
  • Medical Device Link . Spotlight on Electronic Components
    of printed circuit boards (PCBs) and multichip modules (MCM-Ls) suited for. EMDM:September1999:Spotlight. Skip to : [Content] [Navigation]. Medical Device Link. The Online Information Source for the Medical Device Industry. Suppliers Archived Articles Entire Site Search Try Our Advanced Search
  • EcoWire (R) Training Presentation (.ppt)
    hook-up wire is cost-effective and widely available
  • Medical Device Link .
    ,. blanking/tip switch. MOSFET die, 0.110 sq in., 1 KV, 13.5 ohm. MOSFET, 1 KV, 13.5 ohm. MCM, 6-array MOSFET (MSAFA1N100D). High-voltage. switching bridge. IGBT die, 0.160 sq in., 1200 V, 55-A surge. MCM, half-bridge, capacitive-coupled, IC-driven IGBT. Thyristor-based (SCR and Triac) up to 1200 V
  • Is Smaller Better?
    by which the devices may be directly connected to the substrate of a multi chip. module (MCM) or to a printed circuit board. Their parasitic reactances are very small, due to the. absence of a package. Thermal resistance is low, since there are substantial thermal paths from the. diode junction
  • Phase Locked Loop Systems Design for Wireless Infrastructure Applications
    with lower cost and smaller package size. Figure 3 Phase noise characteristics 1.5 to 2.4 GHz CMOS cross-coupled vs. discrete BJT. Type 2 is based on multi chip module (MCM). This type has a few dies as well as discrete components on a. substrate. The die include VCO, PLL and varactors, while discrete
  • Determining the Frequency of Condition Monitoring tasks
    the similarity of wording in Moubray's RCM11 description of P-F, and Wolfson's. I wonder just who invented this 'curve' theory. If it is so good for RCM why does no-one unconnected with RCM appear to use it? My investigations through the MCM community suggest that they have never heard

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