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Mechanical Part Metrology System

 

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Surface metrology equipment is used to measure the surface finish and/or geometry of engineering components. Surface texture and topology characteristics include surface roughness, contour, form, waviness, and defects.
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  • MICRO: Integrated metrology beginning to measure up to expectations
    materials and thinner films create more-demanding metrology needs. "How do you measure one atomic layer?" Johnson asked rhetorically. "As a friend of mine in the business said, 'Very carefully.'" Chemical-mechanical polishing is a major driver in this segment because of its process variability
  • MICRO: Defect/Yield Metrology - Schramm (October 2000)
    overlay metrology. For example, conventional measurement optics require step heights >50 A to provide sufficient signal and contrast for the system's algorithms to function properly, but advanced CMP processes can result in step heights of <20 A. CMP further complicates the measurement task
  • Non-Contact 3D Surface Metrology of Large Grain High Purity Niobium by SLCM and FESEM
    Abstract - Non-Contact 3D Surface Metrology of Large Grain High Purity Niobium by. SLCM and FESEM. Z.H. Sung, P.J. Lee and D.C, Larbalestier. Applied Superconductivity Center, National High Magnetic Field Laboratory,. Florida State University, FL, 32310. Microsoft Word - abstract_v1.2.doc
  • Utilizing Laser Technology in Dimensional Metrology Applications
    of a probe that contacts the part (a mechanical comparison). Labmasters employ patented laser paths that are in-line with the measurement axis to minimize Abbe2 error. The probes and associated optics are guided along very accurate low friction slides by precision force systems to minimize instrument
  • MICRO: Defect/Yield Analysis and Metrology - Poag(July 2000)
    management system. ADC Results, Benefits, and Challenges. The DMOS 5 facility typically uses the bright-field inspection systems at postetch, and it uses the dark-field inspection tools at chemical and physical vapor deposition steps and following chemical-mechanical polishing (CMP). Before
  • MICRO:February 1998:Anaysis & Metrology Post-CMP; by Cheri Dennison, (p 31)
    ). MICRO Advertiser and Product Information Buyers Guide. Chip Shots blog. Greatest Hits of 2005. Featured Series Web Sightings Media Kit. Comments? Suggestions? Send us your feedback. MicroMagazine.com ANALYSIS & METROLOGY POST-CMP Developing effective inspection systems
  • Evaluating chemical mechanical cleaning technology for post-CMP applications
    of the choice of equipment, however, CMP produces an extremely high level of surface contamination, so cleaning has become an integral part of a manufacturable planarization process. For many high-volume production fabs, the cleaning process of choice is mechanical double-sided brush scrubbing, referred
  • Vision software helps check parts fast
    . These minor gripes aside, the software has let us rapidly implement superior measurement processes. PC-DMIS Vision is part of the Wilcox Enterprise Metrology Suite of software products from Wilcox Associates Inc., 200 Frenchtown Rd., North Kingstown, RI 02857, www.wilcoxassoc.com. Ed Drozdowski

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