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MEK Etch
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Product Announcements
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Products/Services for MEK Etch
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Cleaning Agents and Surface Treatments - (1958 companies)Cleaning agents and surface treatments includes liquid cleaners, degreasers, strippers, passivators, etchants, solutions and additives for cleaning and surface preparation. Search by Specification | Learn More -
No Image AvailablePhotolithography Services - (33 companies)Photolithography Services Information. Photolithography services create photomasks and use them to etch or engrave patterns on semiconductor substrates. Photolithography is a semiconductor manufacturing process that is used to remove parts... Learn More
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Electrochemical, Photochemical, and Chemical Milling Services - (102 companies)Electrochemical, photochemical and chemical milling services use etching, electrochemical, and photochemical processes to create unstressed, high-precision parts. Search by Specification | Learn More -
Finishing and Surface Treatment Services - (815 companies)Finishing and surface treatment services pretreat or finish the surfaces of manufactured components to meet roughness or surface condition requirements. Search by Specification | Learn More -
Thin Film Coating Services - (226 companies)Thin film coating services apply very thin layers of specialized materials to part surfaces. They perform processes such chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, electrochemical deposition (ECD), plasma etching, rapid thermal processing (RTP), and titanium nitride coating. Search by Specification | Learn More -
Thin Film Equipment - (309 companies)Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation. Search by Specification | Learn More
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Printed Circuit Board (PCB) Fabrication Services - (930 companies)Printed circuit board (PCB) fabrication services design and fabricate circuit boards. They differ from electronic manufacturing services, which populate and assemble boards. Search by Specification | Learn More
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Marking Services and Engraving Services - (550 companies)Marking services and engraving services mark and engrave products and parts. Services offered include laser marking and engraving, rotary engraving, sublimation, electro discharge machining, and embossing. Search by Specification | Learn More
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Label and Nameplate Services - (1305 companies)Label and nameplate services design and manufacture labels, tags, nameplates and related products for identification, inventory control, packaging, decoration, and regulatory compliance. Companies produce serial number plates, instruction labels, RFID tags, shipping and packaging labels, company logos, decals, fleet wraps, barcode labels, and other forms of identification for products that require the display of alphanumeric or graphical images. Search by Specification | Learn More
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Wafer and Thin Film Instrumentation - (347 companies)Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing. Search by Specification | Learn More
Product News for MEK Etch
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Aerospace Defense Coatings Of Georgia
Chemical, Abrasive or Etch CleaningII, Class 1): Abrasive Cleaning, Deburring and Finishing. BAC 5749: Alkaline Cleaning. BAC 5750: Solvent Cleaning. BAC 5764: Nonskid. BAC 5771: Stripping Inorganic Finishes. BAC 5786: Etch Cleaning of Aluminum Alloys. CSFS035: Chemical Cleaning of Metals. CSFS037: Abrasive Cleaning Of Metals. DPS 9.29: Surface Treatment of Titanium. DPS 9.301: Cleaning Aluminum Alloys. DPS 9.316: Stripping of Organic Finishes. ES1-4: Emergency Test Method for Vapor Pressure of Petroleum Products. GP 17G (All... (read more) -
INVISTA
FlexiSolv™ products - Solvents for Adhesivesalternative for solvents such as methylene chloride, MEK, 1,1,1-trichloroethane, xylene, toluene, and acetone in adhesives applications. (read more) -
Master Bond, Inc.
Unique UV Cure Adhesive for Temporary Bondingand thermal shock. Master UV14-3 can be cured in much greater section thickness (up to 1/8 inch deep) compared to most conventional UV type systems, making it of value for various electronic and opto-electronic potting and encapsulation applications. Disassembly can be easily accomplished upon exposure to most conventional solvents such as acetone, MEK, etc. Master Bond UV14-3, UV cure adhesive, is durable and tough. The re-workable adhesive has a Shore D hardness of 30 and an elongation of 150%... (read more) -
Videojet Technologies Inc.
2300 Series High Resolution Ink Jet PrinterThe new enhanced Videojet® 2300 Series of large character ink jet printers from Videojet Technologies Inc. offers superior code quality and improved flexibility for easier production line integration and operation. The new Videojet 2340, 2350 and 2360 printers all feature Videojet's patented automatic printhead micropurge. This feature provides automated micropurging of the printheads during operation, helping to eliminate frequent downtime, while maintaining high quality printing, even in dusty... (read more) -
Epoxies Etc...
Strong-bonding and Chemical Resistant Compoundsto metals & plastics. DOT noncorrosive. CHEMICAL RESISTANT DATA FOR 20-3004 LV & HV, % WEIGHT GAIN. 28 days % Weight Gain. Deionized water: 1.55. Methanol: 9.38. Ethanol: 6.92. Toluene: 2.26. Xylene: 0.20. Butyl Cellosolve: 2.41. Methyl Ethyl Ketone (MEK): Destroyed after 28 days. 10% Lactic Acid: 2.99. 10% Acetic Acid: 5.64. 70% Sulfuric Acid: 0.36. 50% Sodium Hydroxide: -0.09. 10% Sodium Hypochlorite: 1.16. 1, 1, 1 Trichloroethane: 0.64. Samples cured for 7 days @ 25ºC before testing. From our web... (read more)
Conduct Research
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MICRO:Surface Chemistries, by Joseph Zahka, p.85 (March '99)
@ 22 C 3.1 @ 22 C1.3 @ 85 C Wets IPAprewet OlinRER-550 Ethyllactate, 2pentanone Wets Wets OlinRER-500 Ethyllactate, MEK Wets Wets OlinMicrostrip2001 NMP,amine 43.5 @ 22 C Wets IPA prewet OlinMicrostrip5001 NMP,amine 49.4 @ 22 C IPAprewet IPA prewet OlinMicrostrip5002 HAS,TMAH...
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MICRO:Product Technology News (Oct. '98, p.110)
instruments catalog. Information: 610/954-9000; fax, 610/954-0599. Kaye & MacDonald, pressure regulators brochure. Information: 973/674-8060; fax, 973/674-9227. Luxo, microscope product line brochure. Information: 914/658-8393; fax, 914/658-9635. Mek-A-Nize Engineering, No Compromise robot arm...
Engineering Web Search: MEK Etch
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./null Cold Rolled Steel 17-20 mil bondline Oakite degreased 40 not tested MEK/abrade/MEK 25 Aluminum Bell Peel (PIW), at Temperature (ASTM D 3167) See 3M Aerospace and Aircraft Maintenance Division Profile & Catalog |
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./null with isopropyl alcohol.* Glass: 1. Solvent wipe surface using acetone or MEK.* 2. Apply a thin coating (0.0001 in. or less) of 3M??? Scotch-Weld??? See 3M Aerospace and Aircraft Maintenance Division Profile & Catalog |
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NOVEL CAPACITORLESS SINGLE-TRANSISTOR DRAM TECHNOLOGIES A... (b) Poly block etch, few nm thick (~TSi) nitride deposition (c) Blanket nitride spacer etch, remove poly block by TMAH etch (d) Silicon pillar (fin) |
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MSDS Index at SNF 6:1 Buffered Oxide Etch (6:1 BOE) 8-18-99 20:1 Buffered Oxide Etch (20:1 BOE) 8-11-97 |
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QUANTUM NANOSTRUCTURE FABRICATION revised 9-December-1996 Main... FABRICATION revised 9-December-1996 Main Steps 1. Cleave Sample 2. Mesa etch process (optical lithography) 3. Ohmic contact process (optical |
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SPIE Handbook, Volume 1: Microlithography, Section 2.7.3 Etch chrome in wet etch from Transene or Cyantek (acetic acid and ceric ammonium nitrate) ~1 min. Rinse in water. |
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Hysol? Surface Preparation Guide Henkel Corporation Aerospace... acetone or MEK. Fluorocarbons Degrease with Use chemical etch. Pretreating can etch the surface of a metal, and form a highly adherent oxide. See Henkel Corporation - Aerospace Information |
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IMEC launches 100-nanometer process program IMEC (pronounced EE-mek) originally stood for the Interuniversity Microelectronics Center. |
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Chemical Filtration for Semiconductor Manufacturing Wet Etch Si etch HF/HNO3/acetic acid 7 SiO2 etch BOE/BHF-HF/NH4 F SiO2 etch ambient recir. See Pall Corporation - Industrial Division Information |
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Chemical Products and Technologies for the Evolving... NH4F:H2O:Surfacant G G E E E E E G G NR G E E G G E NR G E Mixed Acid Etch; (HNO3<20%) HNO3:HF:CH3CO2H LR NR LR NR LR LR E NR NR LR NR E E LR NR E NR See Pall Corporation - Industrial Division Information |
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