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  • How to Choose a Solder
    The first step in choosing a solder is to decide what metals are going to be bonded, because the type of metal used will greatly influence the type of solder used. Soft solders are often used with copper, tin and brass. These solders have a low melting point and are made of tin (Sn) and lead (Pb
  • Surface Mount Technology (.pdf)
    One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder.
  • Medical Device Link .
    and from a study conducted by the National Electronics Manufacturers Initiative (NEMI). For all solders, the critical point in manufacturing is the reflow process. For tin lead, which is typically 63% Sn and 37% Pb and has a melting point of about 183 C (361 F), reflow solder-joint temperatures
  • How to use Fusible Alloys (.pdf)
    Fusible alloys are materials that melt at less then 300°F, well below the melting point of tin-lead eutectic solders and SAC alloys. Bismuth is the major component of many of these alloys and influences the melting point, as well as gives these materials the unique characteristic of expansion upon
  • Tin
    Tin is characterized by a low-melting point (450 F), fluidity when molten, readiness to form alloys with other metals, relative softness, and good formability. The metal is nontoxic, solderable, and has a high boiling point. The temperature range between melting and boiling points exceeds
  • Back to the future with copper brazing
    For copper alloys, both soldering and brazing call for melting a filler metal, flowing it into the joint, and binding it with the base metal. However, solders melt belo w 450 C while brazing, by definition, uses filler metals with higher melting points. At brazing temperatures, the filler metal
  • Tougher and stronger glue
    , or powder-coated metals and plastics in chairs, desks, and cabinets. There are three traditional fastening methods thermal, mechanical, and chemical. Thermal methods weld, braze, or solder two homogenous materials with similar melting points. Mechanical fastening secures dissimilar substrates with bolts, screws

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  • ZPRSO2004P049
    Each of the major elements in the lowest melting point solders --bismuth, indium, lead, and tin--confers different properties to the filler metals, often in a manner that is not obvious.
  • Advanced Flip Chip Packaging
    To avoid this stress concentration, an ideal solder for joint is a low stress and low melting point solder .
  • Lead-free Solders: Materials Reliability for Electronics
    Sn-Sb alloys have been used as high melting point solders and Ag is frequently used in surface finishes in electronic products [12].
  • Lead-Free Electronic Solders
    Improvements are achieved with introducing alloying elements and the results indicate the Sn–Zn-based alloys are promising low melting point solders [60, 63, 66].
  • Lead-free Electronics
    For example, Glazer concluded that the thermal fatigue data for low melting point solders varied widely, thus making any interpretation difficult.
  • ZPRSO2004P189
    New, CreepResistant, Low Melting Point Solders with Ultra-Fine Oxide Dispersions, J. Electron. Mater., Vol 27(No. 11), p 1216­1222 Mavoori, H. and Jin, S., 2000.
  • Gold in gallium arsenide die-attach technology
    However, only the gold on tita- nium (Au/Ti) metallization was used in conjunction with the lower melting point solders ; these are the last four alloy compositions listed in Table II.
  • On-demand multi-batch self-assembly of hybrid MEMS by patterning solders of different melting points
    Subsequently, remaining solders become molten and activated sequentially from low melting point solders to high melting point solders.
  • Joining Processes: An Introduction
    Low melting point soldered joints, based on indium, are also readily Idiassembled, as are some high vacuum seals that are based on gallium metal, which has both a low melting point and low vapour pres- sure .