Sites:
Search Electronics:
 

Products & Services

See also: Categories | Featured Products | Parts by Number | Technical Articles
Page: 1

Parts by Number for Melting Point Solder Top

Part # Distributor Manufacturer Product Category Description
14962 Allied Electronics, Inc. AIM PRODUCTS LLC. Not Provided High Melting Point (HMP) Solder; Dia..032; 296-301 degree C; 1LB
14968 Allied Electronics, Inc. AIM PRODUCTS LLC. Not Provided High Melting Point (HMP) Solder; Dia..020; 296-301 degree C; 1LB
HMP-366 18 National Microchip Multicore Solder Co. Not Provided SOLDER HIGH MELT POINT RA 18AWG
HMP-366 22 National Microchip Multicore Solder Co. Not Provided SOLDER HIGH MELT POINT RA 22AWG

Conduct Research Top

  • Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)
    , it is activated at a single point for a small For Low-Melting Alloy. is important to ensure the surfaces of target, or multiple points simultaneous- Target Bonding. the solder material are flat to a specifi- ly for larger target/backing plate assem- Solder Preparation. cation of .001” per 1.0” (0.025mm per
  • Surface Mount Technology (.pdf)
    One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder. ept_H1H4.eps Surface Mount Technology (SMT). Failure Analysis
  • Solder Reflow Recommendation
    ), melting and eutectic temperatures also change, requiring modification to the solder reflow profile. AN233 Solder Reflow Recommendation AN233. Solder Reflow Recommendation. BASICS OF THE REFLOW PROCESS. Author: Ravi Sharma. Microchip Technology Inc. Lead-free soldering techniques have been
  • Adding Solder to a NanoBond (R) Assembly
    . Silver Lead Free Solder. Silver Solder Paste. Silver Tin Alloy. SMT Solder. SMT Solder Paste. SOLAR. Solder. Solder Alloy. Solder and Flux. Solder Bar. Solder Basics. Solder Bumping. Solder Cream. Solder Defect. Solder Evaluation. Solder Joints. Solder Melting. Solder Metal. Solder Paste. Solder
  • Humidity and Solder Paste - Avoid Issues
    . Silver Tin Alloy. SMT Solder. SMT Solder Paste. SOLAR. Solder. Solder Alloy. Solder and Flux. Solder Bar. Solder Basics. Solder Bumping. Solder Cream. Solder Defect. Solder Evaluation. Solder Joints. Solder Melting. Solder Metal. Solder Paste. Solder Paste Reflow. Solder Paste Syringe. Solder
  • How to Choose a Solder
    The first step in choosing a solder is to decide what metals are going to be bonded, because the type of metal used will greatly influence the type of solder used. Soft solders are often used with copper, tin and brass. These solders have a low melting point and are made of tin (Sn) and lead (Pb
  • AN0011 Solder Alloy Choice and Stress Release Cracking in Through Hole Ceramic Capacitors
    . 95Pb/5In solder has a high melting point of 300ºC/313ºC, and 93.5Pb/5Sn/1.5Ag. a high melting point of 296ºC/301ºC, so neither could be soldered using the. available hot air furnace. Instead samples of these were assembled using a hot
  • Crimp vs Solder: Pros and Cons
    dielectric. NONCONFORMING. Dielectric melted past OD + 20 maximum. Flare of dielectric will interfere with assembly. Pin has melted into dielectric. Pin will not meet interface. PREFERRED. Dielectric shows clean 90 degree stripping. No evidence of melting. Crimp-on. This fabrication method has always been
  • Assessment of Eutectic Solder Phase Growth in Under-The-Hood Power Control Modules (.pdf)
    remain in equilibrium. and act as anchors to grain boundary mobility [1]. There are two driving forces for solder phase growth. during thermo-mechanical cycling (TMC). First, due to its. In multiphase systems, such as eutectic solder, the. low melting point, the imposed strains during TMC
  • Medical Device Link .
    and from a study conducted by the National Electronics Manufacturers Initiative (NEMI). For all solders, the critical point in manufacturing is the reflow process. For tin lead, which is typically 63% Sn and 37% Pb and has a melting point of about 183 C (361 F), reflow solder-joint temperatures