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Parts by Number for Melting Point Solder Top

Part # Distributor Manufacturer Product Category Description
14962 Allied Electronics, Inc. AIM PRODUCTS LLC. Not Provided High Melting Point (HMP) Solder; Dia..032; 296-301 degree C; 1LB
14968 Allied Electronics, Inc. AIM PRODUCTS LLC. Not Provided High Melting Point (HMP) Solder; Dia..020; 296-301 degree C; 1LB
HMP-366 18 National Microchip Multicore Solder Co. Not Provided SOLDER HIGH MELT POINT RA 18AWG
HMP-366 22 National Microchip Multicore Solder Co. Not Provided SOLDER HIGH MELT POINT RA 22AWG

Conduct Research Top

  • Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)
    , it is activated at a single point for a small For Low-Melting Alloy. is important to ensure the surfaces of target, or multiple points simultaneous- Target Bonding. the solder material are flat to a specifi- ly for larger target/backing plate assem- Solder Preparation. cation of .001” per 1.0” (0.025mm per
  • Surface Mount Technology (.pdf)
    One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder. ept_H1H4.eps Surface Mount Technology (SMT). Failure Analysis
  • Solder Reflow Recommendation
    ), melting and eutectic temperatures also change, requiring modification to the solder reflow profile. AN233 Solder Reflow Recommendation AN233. Solder Reflow Recommendation. BASICS OF THE REFLOW PROCESS. Author: Ravi Sharma. Microchip Technology Inc. Lead-free soldering techniques have been
  • Adding Solder to a NanoBond (R) Assembly
    . Silver Lead Free Solder. Silver Solder Paste. Silver Tin Alloy. SMT Solder. SMT Solder Paste. SOLAR. Solder. Solder Alloy. Solder and Flux. Solder Bar. Solder Basics. Solder Bumping. Solder Cream. Solder Defect. Solder Evaluation. Solder Joints. Solder Melting. Solder Metal. Solder Paste. Solder
  • Humidity and Solder Paste - Avoid Issues
    . Silver Tin Alloy. SMT Solder. SMT Solder Paste. SOLAR. Solder. Solder Alloy. Solder and Flux. Solder Bar. Solder Basics. Solder Bumping. Solder Cream. Solder Defect. Solder Evaluation. Solder Joints. Solder Melting. Solder Metal. Solder Paste. Solder Paste Reflow. Solder Paste Syringe. Solder
  • How to Choose a Solder
    The first step in choosing a solder is to decide what metals are going to be bonded, because the type of metal used will greatly influence the type of solder used. Soft solders are often used with copper, tin and brass. These solders have a low melting point and are made of tin (Sn) and lead (Pb
  • AN0011 Solder Alloy Choice and Stress Release Cracking in Through Hole Ceramic Capacitors
    . 95Pb/5In solder has a high melting point of 300ºC/313ºC, and 93.5Pb/5Sn/1.5Ag. a high melting point of 296ºC/301ºC, so neither could be soldered using the. available hot air furnace. Instead samples of these were assembled using a hot
  • Crimp vs Solder: Pros and Cons
    dielectric. NONCONFORMING. Dielectric melted past OD + 20 maximum. Flare of dielectric will interfere with assembly. Pin has melted into dielectric. Pin will not meet interface. PREFERRED. Dielectric shows clean 90 degree stripping. No evidence of melting. Crimp-on. This fabrication method has always been

More Information on: Melting Point Solder Top

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  • ZPRSO2004P049
    Each of the major elements in the lowest melting point solders --bismuth, indium, lead, and tin--confers different properties to the filler metals, often in a manner that is not obvious.
  • Lead-free Solders: Materials Reliability for Electronics
    Sn-Sb alloys have been used as high melting point solders and Ag is frequently used in surface finishes in electronic products [12].
  • Lead-Free Electronic Solders
    Improvements are achieved with introducing alloying elements and the results indicate the Sn–Zn-based alloys are promising low melting point solders [60, 63, 66].
  • Advanced Flip Chip Packaging
    To avoid this stress concentration, an ideal solder for joint is a low stress and low melting point solder .
  • Lead-free Electronics
    For example, Glazer concluded that the thermal fatigue data for low melting point solders varied widely, thus making any interpretation difficult.
  • Gold in gallium arsenide die-attach technology
    However, only the gold on tita- nium (Au/Ti) metallization was used in conjunction with the lower melting point solders ; these are the last four alloy compositions listed in Table II.
  • On-demand multi-batch self-assembly of hybrid MEMS by patterning solders of different melting points
    Subsequently, remaining solders become molten and activated sequentially from low melting point solders to high melting point solders.
  • ZPRSO2004P189
    New, CreepResistant, Low Melting Point Solders with Ultra-Fine Oxide Dispersions, J. Electron. Mater., Vol 27(No. 11), p 1216­1222 Mavoori, H. and Jin, S., 2000.