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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
14962 Allied Electronics, Inc. AIM PRODUCTS LLC. Not Provided High Melting Point (HMP) Solder; Dia..032; 296-301 degree C; 1LB
14968 Allied Electronics, Inc. AIM PRODUCTS LLC. Not Provided High Melting Point (HMP) Solder; Dia..020; 296-301 degree C; 1LB
1850042 RS Components, Ltd. Henkel North America Solder Wire Diameter:1.22mm; Melting Point:227 - 240C; Flux Type:Halide Activated Non-Corrosive Resin; Reel Weight:250g; Percent Copper:0.45 to 0.85%; Percent Silver:0%; Percent Tin:99%; Product Form:Wire; Brand:Ecosol; Percent Lead:0%
6258132 RS Components, Ltd. Henkel North America Solder Wire Diameter:1mm; Melting Point:217C; Flux Type:Ecosol 105 Colophony (Rosin) Free Flux Core; Reel Weight:500g; Product Form:Wire; Percent Tin:95.5%; Brand:Henkel; Percent Lead:0%; Percent Copper:0.7%; Percent Silver:3.8%
555099 RS Components, Ltd. Henkel North America Solder Wire Diameter:1.63mm; Melting Point:178 - 270C; Flux Type:Four Cores of Water Soluble Flux; Reel Weight:500g; Percent Silver:2%; Percent Tin:18%; Product Form:Wire; Brand:Alu-Sol; Percent Lead:80%
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Conduct Research Top

  • How to Choose a Solder
    The first step in choosing a solder is to decide what metals are going to be bonded, because the type of metal used will greatly influence the type of solder used. Soft solders are often used with copper, tin and brass. These solders have a low melting point and are made of tin (Sn) and lead (Pb
  • Surface Mount Technology (.pdf)
    One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder.
  • Medical Device Link .
    and from a study conducted by the National Electronics Manufacturers Initiative (NEMI). For all solders, the critical point in manufacturing is the reflow process. For tin lead, which is typically 63% Sn and 37% Pb and has a melting point of about 183 C (361 F), reflow solder-joint temperatures
  • How to use Fusible Alloys (.pdf)
    Fusible alloys are materials that melt at less then 300°F, well below the melting point of tin-lead eutectic solders and SAC alloys. Bismuth is the major component of many of these alloys and influences the melting point, as well as gives these materials the unique characteristic of expansion upon
  • Tin
    Tin is characterized by a low-melting point (450 F), fluidity when molten, readiness to form alloys with other metals, relative softness, and good formability. The metal is nontoxic, solderable, and has a high boiling point. The temperature range between melting and boiling points exceeds
  • Back to the future with copper brazing
    For copper alloys, both soldering and brazing call for melting a filler metal, flowing it into the joint, and binding it with the base metal. However, solders melt belo w 450 C while brazing, by definition, uses filler metals with higher melting points. At brazing temperatures, the filler metal
  • Tougher and stronger glue
    , or powder-coated metals and plastics in chairs, desks, and cabinets. There are three traditional fastening methods thermal, mechanical, and chemical. Thermal methods weld, braze, or solder two homogenous materials with similar melting points. Mechanical fastening secures dissimilar substrates with bolts, screws