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  • Metal Injection Molding of Co-28Cr-6Mo
    applications, metal injection molding. (MIM) can compete favorably with castings on cost. Two pre-alloyed, -25 µm Co-28Cr-6Mo powders were. selected for evaluation. One powder was produced by gas-. In addition to the property requirements summarized in these. atomization, the other
  • Using a buffered rinse solution to minimize metal contamination after wafer cleaning
    Robert J. Small, Maria L. Peterson, and Aaron Robles, Wet chemical processes are considered effective methods of removing particles, metal ion contaminants, and native oxides from semiconductor devices, with such wafer-cleaning steps accounting for up to 30% of the 300 to 500 process steps
  • Energy-Resolved Depth Profiling Analysis of Metal-Polymer Interfaces in Thin Film Capacitors by Dynamic Quadrupole Sims (.pdf)
    and sensibility of the. technique allows studying the degradative process in the capacitor films and the accurate location of the metal-polymer interface. These factors affect drastically to the capacitor performance and they will determine the potential failures that could be developed during de
  • PEEK vs. Metal: Why Plastic is Better (.pdf)
    temperatures (continuous service temperature of 500ºF/260ºC). Microsoft Word - PEEK - updated 11-21-06.doc. T E C H N I C A L W H I T E P A P E R. PEEK vs. Metal: Why Plastic is Better. Introduction. PEEK is a linear aromatic polymer which is semi-crystalline and is widely regarded as the highest
  • Analysis of Barrier Metal Layers of SI-Devices (HD-2000 5)
    structures of about a micron deep. In addition, it allows accommodation of EDX spectrometers for elemental analysis. Analysis of barrier metal layers in Si-devices is one of the important evaluation requirements for the semiconductor industry. The barrier metal layers have been used for a long service life
  • Standardization in Coating Evaluation: A Universal System for Repair Coatings (.pdf)
    . standardize test intervals. were invited to participate in the working group. The. define uniform metal ographic prepara-. main emphasis of the committee is on surface. tion and evaluation. treatments (like plating, shotpeening, NDT,. The formed sub working group was named: `EACMT. elimination of out
  • Infrared Evaluation of Energy Efficiency Factors in the Construction and Installation of Modular and Mobile Homes
    in the new location can be more stress. filled than the initial setup. InfraMation 2006 Proceedings. ITC 115 A 2006-05-22. Figure 9: Cold area on ceiling caused by metal duct separation in ceiling of home. Figures 9 through 11 show how moving a mobile or modular home from one location to another can
  • Powder-Forged Connecting Rod Evaluation
    portions of the product to realize the final dimensional characteristics of the component. Microsoft Word - Connecting Rod Evaluation.doc January 2005. Connecting Rod Evaluation. James R. Dale. Vice President, Member and Industry Relations. Metal Powder Industries Federation. 105 College Road East

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