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  • What is Hot in IR Micro Vision
    three-dimensional (two space coordinates plus time) mapping of excess heat distribution in the device's active area of 0.1 mm2 or less. Particularly, crucial issues that must be addressed now are micro device thermal management' and power budgeting rather than the knowledge of how to manipulate material
  • MICRO: Products In Action
    Advanced Micro Devices (AMD; Austin, TX) recently retrofitted a 15-year-old Anelva 1015 sputtering system with new optical character recognition (OCR) sensor technology. The retrofit was done to demonstrate the feasibility of integrating a stand-alone, in situ wafer identification system
  • MICRO:Dresden photomask
    and Semper Oper, the site combines two facilities under one roof: the Advanced Mask Technology Center (AMTC), a joint venture between DPI and chipmakers Infineon Technologies and Advanced Micro Devices (AMD), and DPI's own production plant. A significant addition to the Silicon Saxony high-tech
  • MICRO: Advanced Process
    Robert Chong and Kevin Lensing, Over the last three years, FASL, a joint venture between Fujitsu (Tokyo) and Advanced Micro Devices (AMD; Sunnyvale, CA), has pursued an aggressive technology roadmap at AMD's Fab25 in Austin, TX. In 2002, the fab, which manufactures Spansion flash memory chips
  • MICRO: The Hot Button
    Integrated metrology, e-diagnostics have made inroads, but problems still hinder widespread implementation IRAJ EMAMI AND BHANWAR SINGH (AMD Fellows, Advanced Micro Devices): As feature sizes shrink below 90 nm, process tolerances have become significantly tighter. Many tools have not been able
  • MICRO: Sutton (April 2001)
    Advanced Micro Devices (AMD) has learned during its implementation of the prewet step at Fab 25 in Austin, TX. Examples of potential defects are discussed, and the results of experiments in which process parameters were varied in an attempt to control a defect mechanism are presented. Such factors
  • MICRO:Industry News:Breakout (July '99)
    . The software instantaneously detects and classifies process faults. It also makes changes from one wafer run to another by adapting recipes to fit shifting process requirements. The software was born from a collaboration among Advanced Micro Devices (AMD) in Austin, Minneapolis-based
  • MICRO: Facilities Technologies - Mattukat (September 2000)
    was carried out at the Advanced Micro Devices (AMD) Fab 30 in Dresden, Germany . As the general contractor, M+W Zander (Stuttgart, Germany) designed and built this turnkey fab, which includes approximately 12,000 m of Class 100T cleanroom space and was designed for the production of the Athlon processor

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