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  • Dispensing Solder Paste Micro-Deposits to 0.2mm - A Process Solution
    and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today's electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment
  • Minimizing Micro-cracks in Solar Cell Interconnection During Manual Soldering (.pdf)
    Solar cell substrates are delicate. The manual soldering process applies stress to the material which can cause micro-cracks to form. This article identifies the requirements and equipment needed to reduce the microcracking during solar cell assembly. Microsoft Word - Solar Soldering Application
  • Freescale: Using HC08 Micro Controller Family to Enhance System Security
    EXPERTS. COMMUNITY. ORDER. QUICK PASTE. SUBMIT BOM. MY ACCOUNT. QUOTES. ORDER STATUS & TRACKING. ORDER HISTORY. INVOICES. RETURN A PRODUCT. SAVED CART(S). CONTACT INFORMATION. SHIPPING ADDRESSES. BILLING ADDRESSES. NOTIFICATION PREFERENCES. CHANGE PASSWORD. New to Newark/element14? Start here
  • Tombstone Troubleshooting
    for almost all assemblies. Throughout the 1990's, type III paste and laser cut stencil became the norm. For those using micro-components today, a type IV paste and electro-formed stencil are quickly becoming a prerequisite. Likewise, equipment that can place components within plus or minus 2 or 3
  • Computer Power User Article - Clearly Custom
    to the necessary tools to complete this mod (drill, soldering iron, solder, and a Philips-head screwdriver), we used a single-pole/single-throw micro switch, a few feet of two-conductor wire, and a compatible 2-pin connector. Your motherboard allegedly has a built-in mechanism for recovering from
  • Binder Transfer in Paint and Coatings
    - and micro-volume fluid control. Pumps. Side Channel Sealless Magnetic Drive Pumps. These pumps are the low flow/high head problem solver. Pumps. Maintenance and Energy Cost Control. Predictive and preventive maintenance drive efficiencies. Centrifugal Pumps. Sealless Centrifugal Pumps
  • Thermal Profiling Optimizes Printed Circuit Board Assembly
    assemblies compound the. profilers would often overheat, leading to. micro BGAs, high ball-count. issues. Higher temperature requirements. inaccurate readings, lengthy cool-downs. BGAs, LGAs, etc. These. for lead-free reflow make it harder to. and even device failure. As components,. easy to use thermal
  • Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
    . Each wafer coating was subjected to mechanical stress. 20. testing. Drop tests of 20 cm, and scratch resistance were. s. e. 15. f. lin. Material. Micro Scratches. o. uncoated. Pen Scratches. #. ST Polyimide. Used. with Diamond Tip. 10. t. i. v. e. Epotek K5022-176F 12um. Epotek K5022-176F 5um. S o

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