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Parts by Number for Micro Stages Top

Part # Distributor Manufacturer Product Category Description
M4604DM PLC Radwell Parker Daedal Not Provided METRIC DIGITAL MICRO. STAGE
M4804DM PLC Radwell Daedal Not Provided METRIC DIGITAL MICRO. STAGE
M050A1411X1 PLC Radwell Parker Not Provided MICRO STAGE 25TRVL,1MMLEAD,ALM
M075A2X51XX001 PLC Radwell Bayside Not Provided STAGE,MICRO,M075A, SP B.SCW&RL
M100A2761X1 PLC Radwell Bayside Not Provided STAGE,MICRO,100AL,TR=50,BALLSC
M150A5721X1 PLC Radwell Parker Not Provided STAGE,MICRO,M150A,T150,BS,L3MM
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Conduct Research Top

  • Dispensing Solder Paste Micro-Deposits to 0.2mm - A Process Solution
    and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today's electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment
  • AN0016 Micro-sectioning of Multilayer Ceramic Capacitors
    to determine in some cases whether faults are real or artifacts by changing the. grinding direction periodically, and examining the micro section at each stage. Polishing of Micro Section. It is common to use fine diamond slurries to polish micro sections. These may be of very fine. particle size (example
  • MICRO:The 300-mm Imperative, by Gary Gallagher, p.81 (July '99)
    Gary Gallagher and Michael Wright, The creation of an optimal wafer environment throughout all stages of IC fabrication poses a constant challenge to the semiconductor industry. Regardless of whether this challenge has been felt at the macro level in the cleanroom or at the micro level in a process
  • MICRO: Products
    The Model 5200 PanelPrinter system performs advanced photolithography for large-area substrate applications that require 0.8 -4- um resolution. Fully integrated subsystems include a high-fidelity projection lens and illumination system, a precision x-y stage, an automated substrate-alignment system
  • MICRO: Expansions
    Several semiconductor manufacturers are at various stages of expanding their 300-mm-based capacity. Chinese foundry SMIC started receiving the initial production equipment for its Fab 4 in Beijing in early June. Scheduled to begin production in the second half of 2004, the facility is the first
    Interim edition includes no surprises, sets stage for 2005 As expected, no surprises lurk in the 2004 update of the semiconductor industry's technological guidebook. The 14 technology working groups reviewing the document determined that the 2003 version of the International Technology Roadmap
  • MICRO: Products
    , nondestructive Pulse technology, providing metrology for all stages of copper integration, including yield-critical dense narrow-line-array structures in low-k and ultra-low-k interlayer dielectric materials. The system operates on the Vanguard-II platform, which offers high throughput
  • MICRO: Products
    . The SB250 has a stage travel range of 210 x 210 mm , allowing operators to expose masks up to 7 in. and wafers up to 200 mm in diameter. Other features include a field-proven 50-keV shaped-beam column, write-on-the-fly writing mode, and fully automatic substrate handling. The system can be used

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