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  • MICRO:The 300-mm Imperative, by Gary Gallagher, p.81 (July '99)
    Gary Gallagher and Michael Wright, The creation of an optimal wafer environment throughout all stages of IC fabrication poses a constant challenge to the semiconductor industry. Regardless of whether this challenge has been felt at the macro level in the cleanroom or at the micro level in a process
  • MICRO: Products
    The Model 5200 PanelPrinter system performs advanced photolithography for large-area substrate applications that require 0.8 -4- um resolution. Fully integrated subsystems include a high-fidelity projection lens and illumination system, a precision x-y stage, an automated substrate-alignment system
  • MICRO: Expansions
    Several semiconductor manufacturers are at various stages of expanding their 300-mm-based capacity. Chinese foundry SMIC started receiving the initial production equipment for its Fab 4 in Beijing in early June. Scheduled to begin production in the second half of 2004, the facility is the first
  • MICRO: ITRS
    Interim edition includes no surprises, sets stage for 2005 As expected, no surprises lurk in the 2004 update of the semiconductor industry's technological guidebook. The 14 technology working groups reviewing the document determined that the 2003 version of the International Technology Roadmap
  • MICRO: Products
    , nondestructive Pulse technology, providing metrology for all stages of copper integration, including yield-critical dense narrow-line-array structures in low-k and ultra-low-k interlayer dielectric materials. The system operates on the Vanguard-II platform, which offers high throughput
  • MICRO: Products
    continuous-motion stage, which uses air bearings in vacuum, reducing vibration levels. The OD optical displacement sensor is a sensing and measuring system in one package. The OD performs ultraprecise measurements and detects the presence of even very small objects. The instrument works on the principle
  • MICRO: Products
    . The SB250 has a stage travel range of 210 x 210 mm , allowing operators to expose masks up to 7 in. and wafers up to 200 mm in diameter. Other features include a field-proven 50-keV shaped-beam column, write-on-the-fly writing mode, and fully automatic substrate handling. The system can be used
  • MICRO: Spotlight
    when planarization is reached, preventing overpolishing. (S.F., South Hall, Booth 417) The HPS Integrated LoPro (ILP) two-stage valve from is a vacuum poppet valve and a bypass valve in a single unit. The valve's compact size and ultracompact limit-switch option assure that it will fit into tight

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