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Microelectronic Encapsulation
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RiverSide Electronics, Ltd. 
Epoxies Etc... 
Epoxies Etc... 
LORD Corporation
Epoxies Etc...
Hernon Manufacturing, Inc. |
Products/Services for Microelectronic Encapsulation
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Encapsulants and Potting Compounds - (221 companies)Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics. Search by Specification | Learn More -
No Image AvailableInsulating Varnishes and Impregnating Resins - (22 companies)Insulating varnishes and impregnating resins are designed for applications that require a low-viscosity resin or varnish for coil impregnation or magnet wire coating insulation. The resin may infiltrate the coil or electrical device through dipping, trick Search by Specification | Learn More
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Electronic and IC Packaging Services - (112 companies)...packaging is produced via integrated circuit encapsulation, the last stage of the semiconductor device fabrication process. Today, electronic packaging and IC packaging services provide many different types of IC packages. Examples include single in-line... Search by Specification | Learn More -
Electrical and Electronic Resins - (451 companies)Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications. Search by Specification | Learn More -
Conformal Coatings - (128 companies)Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants. Search by Specification | Learn More -
Electrical Insulation and Dielectric Materials - (530 companies)Electrical insulation and dielectric materials includes various forms of materials that surround and protect electrical conductors and prevent unwanted current flow, leakage or crosstalk. Search by Specification | Learn More
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Thermal Compounds and Thermal Interface Materials - (147 companies)Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product. Search by Specification | Learn More
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Dielectric Ceramics and Substrates - (148 companies)...with dielectric strength, dielectric constant and loss tangent values tailored for specific device or circuit applications. In capacitor applications, ceramics with a high dielectric constant are used to increase the charge that can be stored. In microelectronic... Search by Specification | Learn More
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Coating Services - (1720 companies)...electrical devices. They are used to apply dopants and sealants to chips and other microelectronic parts. Physical vapor deposition (PVD) and chemical vapor deposition (CVD) are two most common types of thin film coating methods. Physical vapor deposition... Search by Specification | Learn More
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Flexible Circuits - (267 companies)...methods and rigid printed circuit boards (PCBs). Flexible circuits such as microelectronic connectors are often designed for specialized configurations and demanding environments. Typically, a flex circuit is made of a flexible, polymer film... Search by Specification | Learn More
Product News for Microelectronic Encapsulation
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Dow Automotive Systems
BETAPRIME 5404A Pinchweld and Encapsulation Primeradhesion to polyvinyl chloride (PVC) substrates. Promoting adhesion to reaction injection molding (RIM) encapsulations. An integral component of all BETASEAL ™ glass bonding systems, BETAPRIME 5404A Primer helps autoglass shops reduce inventory and save time and money while providing long term reliability and durability. The newly validated drying times of six minutes at 20°F (-6.7°C) and 12 minutes at 0°F (-17.8°C) make it the fastest AGRSS-compliant pinchweld and encapsulation primer... (read more)Browse Industrial Adhesives Datasheets for Dow Automotive Systems -
Mini-Systems, Inc. (MSI)
Hybrid AssemblyMSI provides the electronics industry with the highest quality hybrid microelectronic assembly; offering technical sales and service for all your design needs. Manufacturing capabilities for hybrid assembly, thick film technology, surface mount technology, chip and wire assemblies and electronic packaging. Services include custom layout and design, auto and manual gold wire bonding, specialized substrate metalization, Hermetic sealing, solder reflow, and custom packaging and sub-assemblies... (read more)Browse Resistors and Potentiometers Datasheets for Mini-Systems, Inc. (MSI) -
ITW Polymer Technologies - Insulcast Division
Silicone PrimersRTVS Primers are dilute solutions of reactive silicone resins which can be used to improve adhesion of micro-electronic coatings and various RTV silicones to a variety of substrates. Various primers are available for addition cured and condensation cured silicone RTV's. Clear primers are desired for clear silicone systems. These primers may be used on metal, wood, glass, ceramics, and many plastics. (read more)Browse Silicone Adhesives and Sealants Datasheets for ITW Polymer Technologies - Insulcast Division -
M.S. Kennedy Corp.
RAD Hard LineMSK earned its certification to Class K of MIL-PRF-38534 in 1997 and has become a major supplier of both custom and standard microelectronic components to the space industry. MSK has designed and manufactured thousands of complex custom hybrid microcircuits that are currently in orbit on both commercial and military satellites, as well as being on the International Space Station, space shuttle, and various launch vehicles. Our standard product offerings for space flight continues to expand... (read more) -
LaserStar Technologies Corporation
8000 Series - LaserStar Micro-Welding System. • Computer and Disk Drive Components. • Medical Components and Devices. • Automotive and Aerospace Electronics. • Microelectronic Assemblies. • Batteries (Seam and Tab Welds). • Sensors and Controls. • Jewelry Chain Welding... (read more)Browse Laser Processing Equipment Datasheets for LaserStar Technologies Corporation -
Membrana GmbH
Liqui-Cel® Membrane ContactorsLiqui-Cel® Membrane Contactors are compact, modular devices used around the world to remove gases from or add gases to liquids. The devices are capable of removing CO2 to < 1ppm and O2 to < 1ppb and are already in use by thousands of customers worldwide in power stations, microelectronic fabs, pharmaceutical plants, food & beverage processing facilities and many other industries. Liqui-Cel Membrane Contactors are now available for online purchase . Visit our Membrane Contactor ONLINE (read more)Browse Degassers Datasheets for Membrana GmbH -
GE Analytical Instruments
Sievers 500 RLe TOC AnalyzerThe Microelectronics and Semiconductor TOC Analyzer. The Sievers 500 RLe On-Line TOC Analyzer represents the latest advancement in the science of ultra low-level TOC measurement in microelectronic applications. The 500 RLe replaces the Sievers Model PPT as the industry's only on-line, reagentless TOC analyzer capable of accurately detecting problematic compounds such as urea, trimethylamine, organic acids and bases. The 500 RLe uses GE Analytical Instrument's membrane conductometric technology... (read more)Browse Total Organic Carbon (TOC) Analyzers Datasheets for GE Analytical Instruments -
Aremco Products, Inc.
AREMCO-BOND™ 556-HTSP ELECTRICAL ADHESIVE. Aremco-Bondtm 556-HTSP mixes easily in a 1-to-1 ratio by weight and cures in 1 hour at 350 oF. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request. Typical applications for Aremco-Bondtm 556-HTSP include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components. Please contact Aremco's Technical Sales... (read more)Browse Epoxy Adhesives Datasheets for Aremco Products, Inc. -
LaserStar Technologies Corporation
FiberStar Welding Systems (Fiber Engine)Medical Components and Devices • Microelectronic Assemblies • Sensors and Controls • Computer and Disk Drive Components • Automotive and Aerospace Electronics • Batteries (Seam and Tab Welds) • Solar & Solar Cell Applications... (read more)Browse Laser Cutting and Welding Machines Datasheets for LaserStar Technologies Corporation -
Epoxies Etc...
Electrically Conductive Epoxy AdhesiveThe 40-3900 is a two component epoxy adhesive filled with silver. This electrically conductive formulation has a convenient 1:1 mix ratio. 40-3900 is a great choice to make electrical connections where hot soldering is impractical. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity, it has also been used extensively in applications such as micro-way EMI and RFI shielding, in the assembly or repair of printed... (read more)Browse Conductive Compounds Datasheets for Epoxies Etc...
Conduct Research
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
micro-electronic grade joining materials will be used. For LEDs, the silver epoxy is needed for both electrical and thermal properties. Optically clear epoxy is used for the potting, molding, or encapsulation of the LED. In LCDs, there are many different applications of epoxy of which 2 are presented. Microsoft...
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
for unfilled resin systems are on the order of 80. ppm/°C, while these new UV systems have CTE values on the order of 35 ppm/°C. The lower. the CTE value of the system, the less it will expand and contract under temperature changes. This is critical in microelectronic circuitry as expansion...
Engineering Web Search: Microelectronic Encapsulation
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Microelectromechanical systems - Wikipedia, the free... |
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Solder - Wikipedia, the free encyclopedia |
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Fraunhofer IZM Hotmelt encapsulation Hotmelt is a new technology for the encapsulation of microelectronic devices. |
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Fraunhofer IZM index EncapsulationTechnologies The IZM group for Encapsulation Technologies works in all fields of microelectronic encapsulation. |
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ASTM F542 - 07 Standard Test Method for Exothermic Temperature... ASTM F542 - 07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation See ASTM International Information |
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ASTM Subcommittee D09.01 : Published standards under D09.01... F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation See ASTM International Information |
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The Encapsulation of Microelectronic Devices for Long-Term... The Encapsulation of Microelectronic Devices for Long-Term Surgical Implantation |
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Reworkable encapsulation Reworkable encapsulation Pub Acronym: ISEE-95 Pub Year: 1995 |
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Study on the fluid/structure interaction at different inlet... to be a guideline or reference and provides better understanding of the encapsulation process for package design in the microelectronic industry. |
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Prediction of cure induced warpage of micro-electronic... Title: Prediction of cure induced warpage of micro-electronic products Authors: J. de Vreugd, K.M.B. Jansen, L.J. Ernst, C. Bohm Abstract: Prediction |
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