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Microelectronic Inspection Equipment

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Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  
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  • Supplier: STACI
    Description: to search out cost-effective alternate products STACI’s production facilities and those of its partners are well equipped, featuring advanced production equipment including: SMT equipment from Siemens, Sanyo, Juki, I.Pulse and Fuji Reflow Ovens from Heller, Tamura and Sanyo Chip on Board
    • Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn
    • Material Acquisition: Customer Supplied, Vendor Supplied
  • Description: and off-shore allowing ABX to fulfill customer demands through the most efficient use of resources, inventory, automation and labor. Surface Mount - Expert Surface Mount Knowledge and State of the Art Equipment Cable and Harness - Custom Turnkey Cable and Harness Assembly with Complete Test
    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
    • Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling, Other
  • Description: and cables in any quantity- even one or two if needed. This versatility helps us meet your needs for large, small, single or repeat parts with fast turnaround and reduced cost. An equipment list can be made available upon request. IMET Capabilities include: PCB Assembly - Leaded & RoHS - High
    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services, Other
    • Testing Services: Agency Compliance Testing, Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly, Other
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling, Other
  • Description: Suntron Corporation delivers complete vertically integrated electronics manufacturing services and solutions to support the entire life cycle of complex products in the Aerospace and Defense, Medical Equipment, Industrial, Network and Telecommunications, and Semiconductor Capital Equipment market
    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
    • Testing Services: Agency Compliance Testing, Analytical Laboratory Testing, Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn, Cabling
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Conduct Research Top

  • MICRO:Defect Inspection Equipment, by Thomas Reuter (Oct '99)
    Infineon Technologies) in 1996. He has a diploma in microelectronic technology from the technical college in Mittweida, Germany, and has coauthored several papers on patterned-wafer inspection applications. (Reuter can be reached at +49 351 8862524 or thomas.reuter@infineon.com.) Ulrike Bohmler...
  • What drives defect detection technology?
    ),1 to form its own subgroup dedicated to this subject. Defects are considered events that lead to or can lead to electrical faults in microelectronic circuitry. Their detection requires extensive use of in-line inspection tools, in situ sensors, and electrical testing and failure analysis equipment...
  • Microwave Photonic Systems Corportate Capability Statement
    , telecom, SATCOM and wireless products. RF and Fiber Optic Interface Design, Development and Manufacture: RF, fiber optic, photonic product designs span DC to 40 GHz. Analog, Digital, and Mixed Signal Micro-Electronic Design and Manufacture: embedded processors, power supplies, digital interfaces...
  • MICRO:Archive:Back Issue TOC
    first; FOUP sales set record; Genus sells first ALD tool Seiko Epson inks SOI pact; Partners offer software; Ibis ups wafer capacity; Brooks buys SEMY; Lambda opens service center; Semtech exiting foundry biz; Chem vendors expands to Asia SCP Global Technology, SPIE's Symposium on Microelectronic...
  • MICRO:Semicon West '99 (June '99)
    Kinetek ..........2951 Kinetico-Eng. Water Treatment Div...........1200A Kinetics Group..........1216A KIP..........1526N KLA-Tencor..........426 Koch Microelectronic Service..........3033 Koganei..........1526O Kurt J. Lesker..........1118 Kyocera Industrial Ceramics..........124 Lam Research...
  • INDUSTRY NEWS
    ramp vertical furnace systems. Eaton formed the unit after it purchased High Temperature Engineering in May 1996. The thermal business has more than tripled since its inception, Eaton says. Allied moves HQ AlliedSignal Advanced Microelectronic Materials (AMM) has moved its headquarters...
  • Application of Ultrasonic Cleaning
    components) Computer disk drive and head components Fire restoration Glass substrates Glassware cleaning (laboratory glassware) Hybrid microelectronic circuits (thin and thick film circuits) Hypodermic needle stock (cannulae) Jewelry cleaning (new manufacture) Lenses, ophthalmic, precision Maintenance...
  • MICRO: 2001 Back Issues
    ; Extraction focuseson contamination; Mattson to sell CVD unit; Ibis, MEMC form wafer team; TEL buys software vendor. Whats going on: Clean Tech 2001, SPIE Microelectronic and MEMS Symposium, and more. Round the Circuit: Axcelis touts implant advance; NIST develops optics device; University of Arkansas...
  • Movin'On
    is the president and CEO of financial services company Xertex Capital. Harold Bridges has been named vp and financial officer of Olin Microelectronic Materials. Bridges has worked for Olin for 20 years in financial, manufacturing, and administrative positions. The division also appointed Murrae...
  • MICRO: Expansions & Acquisitions
    plants. Arch Microelectronic Materials and Fuji Photo Film have embarked on a program to upgrade their combined photoresist production capability. Partners in a joint venture called Fujifilm Arch, the companies are renovating a cleanroom facility in Japan with a 193-nm toolset for developing advanced...

Engineering Web Search: Microelectronic Inspection Equipment Top

Inseto UK - Assembly Equipment and Materials for Electronic...
Provides assembly, test & inspection equipment for the microelectronic, photonic and semiconductor industries.
Inseto UK - For Microelectronic Production Assembly,...
Flexible microelectronic pick & place systems, die bonding equipment and die sorting machines in manual-inline configurations.
KLA Tencor - Wikipedia, the free encyclopedia

I SYSTEMS, Inc. - Microelectronic Inspection Systems (SMD,...
Semiconductor Inspection and Marking SMT & Hybrid Inspection 3D Metrology/Inspection (Solder Paste, Epoxy, BGA) AVM Series Automated Dimensional
See I Systems, Inc. Information
Corporate Releases | KLA-Tencor Completes Acquisition Of...
KLA-Tencor Completes Acquisition Of Microelectronic Inspection Equipment Business Unit Of Vistec Semiconductor Systems
CICFAR - Scanning Electron Acoustic Microscopy (SEAM)
Equipment Major equipment In-house developed & commercialised equipment
Dr Ume --- Grants and Contracts
Real-Time Quality Inspection of Weld Pool SME Amount Awarded: $35,000 Date: Jun. 1988 - Jun. 1989
See Georgia Tech School of Mechanical Engineering Information
ePanorama.net - electronics, audio, video, circuits and...
Measuring equipment, tools etc. Electronics kits Hifi equipment Digital audio equipments
Technical Quality Papers | Quality & Reliability | Analog...
Metallurgical Cross Sectioning of Microelectronic Packages for Optical Inspection and Electron Beam Analysis by Robert James Burgoyne
See Analog Devices, Inc. Information
TOSHIBA REVIEW(a06index.htm'97.11.10)
Recent Systems and Equipment for Railway Substations

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