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Microelectronic Molding Compounds
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RiverSide Electronics, Ltd. 
Epoxies Etc... 
Epoxies Etc... 
Epoxies Etc...
Epoxies Etc...
Epoxies Etc... |
Products/Services for Microelectronic Molding Compounds
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Encapsulants and Potting Compounds - (221 companies)...and potting compounds. Common potting compounds and casting resins are used to fill compartments or pockets that contain electronic components. Encapsulants seal or cover circuits; typically, encapsulant layers are less than 100 mils thick. Molding... Search by Specification | Learn More -
Thermal Compounds and Thermal Interface Materials - (147 companies)...components. Encapsulants seal or cover circuits; typically, encapsulant layers are less than 100 mils thick. Double-sided thermal interface tapes and pads, substrates, and shapes are often used as electrical insulators. Molding compounds... Search by Specification | Learn More -
Electrical and Electronic Resins - (451 companies)Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor... Search by Specification | Learn More -
Polymer and Plastic Composites - (316 companies)Polymer and plastic composites are strengthened with fibers, fillers, particulates, powders and other matrix reinforcements to provide improved strength and/or stiffness. Examples include fiber reinforced plastics (FRPs), sheet molding compounds... Search by Specification | Learn More -
Electrical Insulation and Dielectric Materials - (530 companies)...products. Lubricants, metal working fluids, molding compounds, non-woven products, plates or boards, and polymers are also available. In addition, electrical insulation and dielectric materials may come as potting compounds, powders or grains, precursors... Search by Specification | Learn More -
Thermosets and Thermoset Materials - (296 companies)...as encapsulates, electrical conductors in microelectronic packaging, and adhesives in structural bonding applications. Phenolics are thermosetting molding compounds and adhesives that offer strong bonds and provide good resistance to high temperatures... Search by Specification | Learn More
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Molding Compounds and Resins - (284 companies)How to Select Molding Compounds and Resins. Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are used in injection molding, compression molding, reaction injection molding (RIM), resin transfer... Search by Specification | Learn More
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Insulating Varnishes and Impregnating Resins - (22 companies)Insulating varnishes and impregnating resins are designed for applications that require a low-viscosity resin or varnish for coil impregnation or magnet wire coating insulation. The resin may infiltrate the coil or electrical device through dipping, trick Search by Specification | Learn More
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Dielectric Ceramics and Substrates - (148 companies)...with dielectric strength, dielectric constant and loss tangent values tailored for specific device or circuit applications. In capacitor applications, ceramics with a high dielectric constant are used to increase the charge that can be stored. In microelectronic... Search by Specification | Learn More
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Nanomaterials - (266 companies)...materials, semi-finished plastics (stock shapes), elastomer shapes, molding compounds, liquid or casting resins, monomers and intermediates. Silica / Silicate. Compounds of silicon and oxygen, contain additional elements or modifiers to form more complex... Search by Specification | Learn More
Product News for Microelectronic Molding Compounds
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Plastics Color Corporation
Custom Molding Compounds and ResinsPlastics Color Corporation (PCC), headquartered in Calumet City, Illinois, is a global provider of custom polymer compounds, solutions, colorants, and additive masterbatches in an extensive range of markets; from pharmaceuticals packaging to medical devices to consumer packaging to sporting goods and many more. (read more) -
Aremco Products, Inc.
EZ-CAST™ 580N FLEX MOLDING COMPOUND NOW AVAILABLEEZ-Cast ™ 580N is a high temperature, flexible, high-tear-strength silicone-rubber molding compound ideal for producing high reliability master molds for casting ceramic fixtures. Material properties include a maximum temperature resistance of 400 °F (204 °C), Shore "A" Durometer of 40, tensile shear strength of 700 psi minimum, and tear strength of 110 minimum lb/in. EZ-Cast ™ 580N is supplied as a two-part system that mixes in a ratio of 10 lbs. resin to 1 lb. catalyst. It sets... (read more)Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Aremco Products, Inc. -
JAMAK Fabrication USA
Custom Forumulated Silicone Compoundsand that is our primary focus. This allows us to tailor compounds to meet specific processing needs of silicone fabrication equipment which includes injection, compression, and transfer molding along with extrusion capability. Because we mix our own silicone compounds we can respond to changing customer needs much quicker, including changes to the compound to meet your specification needs. Jamak has mixing capability from 1 pound to 2000 pound batches to meet your specific need, large or small we can do... (read more) -
Composites Group (The)
Molding Processes: Compression MoldingCompression Molding. Composite Compression Molding produces high quality cost competitive parts for all volume ranges. Parts produced from sheet molding compound (SMC) or bulk molding compound (BMC) have a high strength-to-weight ratio with low shrink rates. Furthermore, matching colors and textures can be molded in to eliminate the need for secondary finishing. Other advantages include reduced waste, the ability to mold-in inserts and structural reinforcements; and the ability to execute... (read more) -
ANALYZE Inc.
Compound QuantificationANALYZE has determined the amounts of one or more components in many diverse products and materials; including the following: Adhesives, Coatings & Sealants. Formulated Consumer, Food, Nutraceutical and Pharmaceutical Products. Cosmetics. Cleaners. Degradation Products Produced During Drug Stability Tests. Residual Monomer Levels in Cured Polymers. Mobile Ions Remaining on the Surface of an Electronic Part after Cleaning. Additive Levels in Products Formed from Compounded Thermoplastic... (read more)Browse Material Testing Services Datasheets for ANALYZE Inc.
Engineering Web Search: Microelectronic Molding Compounds
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Moisture resistant aluminum nitride filler for high thermal... Moisture resistant aluminum nitride filler for high thermal conductivity microelectronic molding compounds |
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Improved thermal conductivity in microelectronic encapsulants Improved thermal conductivity in microelectronic encapsulants |
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Solder - Wikipedia, the free encyclopedia of a non-eutectic solder can be exploited in plumbing as it allows molding of the solder during cooling, e.g. for ensuring watertight joint of pipes, |
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Intel Technology Journal Materials Technology for Environmentally Green Micro-electronic Packaging See Intel Corporation Information |
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Intel Technology Journal HF packaging materials introduced by Intel include several materials such as molding compounds, underfill materials, and substrates. |
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Emei Group - Inductive Components, EMI Shielding, Bulk... Home > Group Products > Bulk Molding Compounds |
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Products | KYOCERA Molding Compounds for Semiconductor Encapsulation Semiconductor Components (Microelectronic Packages) |
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The George W. Woodruff School of Mechanical Engineering Molding Compounds Passivation Reliability Issues associated with Service Conditions See Georgia Tech School of Mechanical Engineering Information |
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Correlation between chemistry of polymer building blocks and... encapsulants, conductive or non-conductive adhesives, underfills, molding compounds, insulators, dielectrics, and coatings. |
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CHERIC | ???? | ??DB | ??? ?? Studies on Molding Conditions and Physical Properties of EMC(Epoxy Molding Compounds) fiiled with Crystalline SiO2 for Microelectronic Encapsulation |
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